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WO/2024/062832A1 |
A ceramic substrate according to one embodiment is characterized in that the ratio A/B of an arc discharge voltage A to a dielectric breakdown voltage B is at least 0.3, in a case where a 50 Hz or 60 Hz alternating-current voltage is app...
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WO/2024/063341A1 |
A PCB assembly according to one embodiment comprises: a first circuit board; an electronic component provided on the first circuit board; a second circuit board connected to the first circuit board; a thermal module configured to absorb ...
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WO/2024/063358A1 |
According to various embodiments, an electronic device comprises: a hinge; a first housing and a second housing rotatably connected to each other by the hinge; a flexible display disposed on the first housing and the second housing; a fi...
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WO/2024/061502A1 |
Motor vehicle lighting device comprising a housing (61, 62, 7), a main power supply circuit (5), a stepped support (1) fixed in the housing (61, 62, 7), a plurality of secondary substrates (311, 321, 331) fixed to the stepped support (1)...
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WO/2024/058641A1 |
A circuit board according to an embodiment comprises: an insulating layer; a pad part arranged on the insulating layer; a conductive metal part arranged on the pad part; a protective layer arranged on the conductive metal part; and a bon...
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WO/2024/056572A1 |
The invention relates to a method for connecting a sensor assembly arranged on a mounting plate to a device under test, with said method comprising the steps of (100) providing - a device under test, - a sensor assembly having a strain g...
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WO/2024/056275A1 |
The invention relates to an assembly (2) having at least one passive component (4), a first substrate (6), a second substrate (20) electrically connected to the first substrate (6), and a heat sink (28). In order to allow improved heat d...
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WO/2024/058254A1 |
Provided is a method for manufacturing a ceramic sintered body substrate, the method including: preparing a ceramic substrate 1 in which a through-hole 2 is formed before firing (S11); disposing a first metal paste 3 in the through-hole ...
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WO/2024/057412A1 |
A flexible wiring board (40) has a plurality of wiring layers arranged in the thickness direction, connects light source units (10) to a power supply unit and an information processing unit, and comprises: a plurality of first connectors...
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WO/2024/058376A1 |
An optical communication device according to one embodiment disclosed in the present document is characterized by comprising: a first optical element; a second optical element capable of performing optical communication with the first op...
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WO/2024/057107A1 |
A method for printing traces on a substrate and an additive manufacturing apparatus therefor are provided. The method comprises determining at least two first location points for a first trace and at least two second location points for ...
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WO/2024/058517A1 |
An electronic device comprising a conductive layer is disclosed. The electronic device according to various embodiments of the present invention may comprise: a printed circuit board in which at least one electrical constituent element a...
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WO/2024/058391A1 |
A circuit board for a battery monitoring circuit and a wire harness for connection therewith are disclosed. The battery monitoring circuit comprises first to (M+1)th voltage sensing pins, and an operating condition thereof is that voltag...
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WO/2024/058608A1 |
According to an embodiment disclosed in the present document, an electronic device may be provided. The electronic device may comprise: a housing; an inner structure disposed in the housing; a fixing member including a first support regi...
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WO/2024/058115A1 |
This method for producing a conductive base material comprises: a coating step in which a conductive composition that contains conductive particles is applied onto a base material, thereby forming a coating layer; and a conductive film f...
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WO/2024/052768A1 |
The present invention pertains to a laminate that can achieve adhesiveness with respect to a copper foil, and also heat resistance and electrical properties. More specifically, the present invention provides a laminate which comprises a ...
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WO/2024/052299A1 |
The invention proposes a transparent composite pane, which has a transparent carrier (2) and a conductive grid structure (3), which is arranged on the carrier (2) and comprises a large number of first conductor tracks (30) in a first dir...
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WO/2024/051224A1 |
The present disclosure provides a circuit board and an optical module. The circuit board comprises a top layer, a bottom layer, and a plurality of middle layers stacked between the top layer and the bottom layer; the top layer is provide...
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WO/2024/053877A1 |
An electronic device according to one embodiment may comprise: a housing including a front, a rear opposite to the front, and sides for surrounding the inner space between the front and the rear; a display visually exposed to the outside...
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WO/2024/050910A1 |
Embodiments of the present disclosure relate to the technical field of semiconductors, and provide a semiconductor structure and a manufacturing method therefor. The semiconductor structure comprises: a substrate; a lower electrode layer...
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WO/2024/053888A1 |
A camera module according to an embodiment may comprise: a lens; an image sensor which converts light incident through the lens into an electrical signal and comprises a connection pad; and a printed circuit board electrically connected ...
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WO/2024/053738A1 |
Provided is a copper/ceramic bonded body (10, 110) in which a copper member (12, 13, 112, 113) made from copper or a copper alloy is bonded to a ceramic member (11, 111), in which an active metal compound layer (31) containing a compound...
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WO/2024/054072A1 |
A circuit board according to an embodiment comprises: an insulating layer; a first pad arranged on the insulating layer; and a first protective layer which is arranged on the insulating layer, and which includes an opening overlapping wi...
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WO/2024/051694A1 |
The present disclosure relates to a display apparatus and an extended reality device. The display apparatus comprises: a first display module, a second display module and a first flexible circuit board. The first display module comprises...
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WO/2024/053425A1 |
This printed wiring board comprises: a base film having a main surface; and first and second wirings disposed on the main surface. The first and second wirings are each spirally wound in a plan view. The second wiring is disposed inward ...
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WO/2024/051851A1 |
A printing consumable and a chip (30). The printing consumable comprises a box body (10) and an electrical connection assembly; the electrical connection assembly is connected to the box body (10); the electrical connection assembly comp...
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WO/2024/052301A1 |
The invention relates to a method for producing a large number of conductor tracks on a transparent target substrate, in which method a large number of conductor track elements are provided on a temporary carrier (500) and transferred to...
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WO/2024/053619A1 |
A ceramic substrate according to the present invention contains alumina, zirconia, yttria, and a glassy substance. The glassy substance contains, as elements, Si, an alkali metal, and O which are each a first component, and contains, as ...
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WO/2024/054114A1 |
A printing device (1) is provided for printing a substance on a target surface (TS) of a target (T). The printing device comprises a carrier (2) having at a first main side (21) a hydrophobic coating (22) for carrying a specimen (SB1, SB...
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WO/2024/051235A1 |
Disclosed in the present invention is a manufacturing method for a planar transformer. The method comprises the following steps: manufacturing a first circuit board including a first circuit, and a second circuit board including a second...
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WO/2024/048283A1 |
This method for manufacturing a magnetic board, which comprises a magnetic layer and a conductor layer formed on a surface of the magnetic layer, includes a step (EP) of forming the conductor layer on the surface of the magnetic layer by...
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WO/2024/044853A1 |
Capacitive micromachined ultrasonic transducers (CMUTs) may be fabricated on pre- fabricated and interconnected substrates, such as printed circuit boards (PCBs). The PCBs may be rigid or flexible. The substrate may also be a ceramic. Th...
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WO/2024/046064A1 |
The present disclosure relates to a flexible circuit board, comprising a first region extending in a first direction; in the first direction, the first region comprises a binding area and a wiring area which are adjacently arranged; in a...
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WO/2024/048628A1 |
This conductive paste contains, with respect to (A) 100 parts by mass of a binder component containing 5-60 parts by mass of a solid epoxy resin and 40-95 parts by mass of a liquid epoxy resin in a range not exceeding a total amount of 1...
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WO/2024/046033A1 |
A signal transmission structure (100) and a manufacturing method therefor. The signal transmission structure (100) comprises a first device (10), a second device (20), and a first grounding portion (30). The first device (10) and the sec...
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WO/2024/047751A1 |
This electronic component support structure is a support structure for supporting an electronic component provided on a substrate, and is provided with a cover member that covers the electronic component. The cover member is an integral ...
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WO/2024/048216A1 |
This wiring board (10) comprises a substrate part (11) and a conductor part (12). The substrate part (11) comprises a conductor layer (20) that has a wiring pattern (first wiring pattern (21)) and an insulation layer (30) that has an ins...
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WO/2024/048728A1 |
Provided are: a film including a layer A and a layer B on at least one surface of the layer A, having a dielectric loss tangent of 0.01 or less, and having a surface free energy of 30 mJ/m2 or less on the surface of the layer B opposite ...
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WO/2024/048206A1 |
One embodiment of the present disclosure provides a method for producing a laminated substrate, the method including: laminating a metal plate, a semicured-resin-impregnated plate, and an electroconductive plate in the stated order; heat...
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WO/2024/049100A1 |
This embodiment comprises: a fixture unit including a second circuit board; a moving unit including a first circuit board disposed on the second circuit board and an image sensor electrically connected to the first circuit board; and a s...
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WO/2024/044984A1 |
Provided are a circuit board module and an electronic device. The circuit board module comprises: a bottom plate; and one or more chip modules located on the bottom plate and connected to the bottom plate. Each chip module comprises: an ...
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WO/2024/048444A1 |
A coating agent which comprises an acid-modified polyolefin resin (A), an epoxy compound (B), and an aqueous medium, and is characterized in that the acid-modified polyolefin resin (A) contains 0.1-10 mass% unsaturated carboxylic acid co...
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WO/2024/048921A1 |
An electronic device is disclosed. An electronic device (100) according to one embodiment of the present disclosure may comprise: a display (150); a housing (310) including a transparent front side plate (111) through which the display (...
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WO/2024/049027A1 |
A surface-treated copper foil, which has an excellent adhesive strength with respect to a resin substrate and is suitable for application to a high frequency foil, is disclosed. The present invention provides the surface-treated copper f...
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WO/2024/047872A1 |
The present invention discloses a method for manufacturing an electronic component, the method comprising: preparing an intermediate structure comprising a substrate having a first main surface and a second main surface on the rear side ...
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WO/2024/049999A1 |
A printed circuit board having an electrically insulative layer and a conductive solder pad. The conductive solder pad is disposed at least partially over the electrically insulative layer, and defines a solder contact area. The solder c...
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WO/2024/048317A1 |
The present invention addresses a first problem of providing a photosensitive composition from which it is possible to form a pattern having a low relative permittivity and excellent resolution. The present invention addresses a second p...
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WO/2024/048348A1 |
The present invention provides a film that has a layer A having a thermal expansion coefficient of 30 to 70 ppm/K and a void percentage of 20 to 60 vol%. Also provided is a layered body that uses this film.
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WO/2024/045574A1 |
The present invention relates to a printed circuit board having a pad and a communication device. The printed circuit board comprises: a signal layer and a reference layer, wherein the signal layer is provided with a pad, and the pad com...
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WO/2024/049183A1 |
The present invention relates to a method for producing a ceramic substrate. The ceramic substrate can be used in high-output power modules due to the 0.3-0.8mm thickness of the upper and lower metal layers that adhere to the upper and l...
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