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WO/2024/006422A1 |
A composition for making a filler including a plurality of ceramic particles, an oxirane monomer in liquid form, an ultraviolet initiator that absorbs ultraviolet, and a thermal initiator.
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WO/2024/006495A1 |
Multi-layer circuit boards and methods of manufacture are described herein. A multi-layer circuit board includes a top layer and a bottom layer. The top layer includes an array of metal sections that are electrically insulated from one a...
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WO/2024/006108A1 |
In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame may be divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow th...
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WO/2024/004590A1 |
Provided is a stretchable device comprising a stretchable base material, a stretchable wiring provided on the stretchable base material, and an adhesive layer having portions which are separated from and facing each other. The stretchabl...
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WO/2024/004528A1 |
A composite material according to one aspect of the present disclosure includes a base material and polydopamine. Where a straight line connecting the measurement point at 3070 cm-1 and the measurement point at 3700 cm-1 in the infrared ...
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WO/2024/003613A1 |
A printed circuit board (PCB) includes a plurality of stacked layers, each layer having a major plane defining a major plane of the PCB, a plurality of signal pads disposed on a signal pad layer of the PCB that is parallel to the major p...
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WO/2024/005880A1 |
Antenna structures and assemblies for use in RADAR sensor assemblies and the like. In some embodiments, the assembly may comprise a printed circuit board, an integrated circuit coupled to the printed circuit board on a first surface of t...
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WO/2024/005208A1 |
Provided is a structure comprising a conductor layer and an insulator and having excellent adhesiveness. An embodiment of the present invention is a structure 30 comprising an insulator 10 and a conductor layer 20. The conductor layer 20...
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WO/2024/004518A1 |
This transparent conductive film comprises a meshed portion which is formed by a plurality of conductive wires. The meshed portion includes a plurality of non-conductive portions (22) that are edged by successive conductive wires (21A). ...
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WO/2024/006439A1 |
A substrate includes a monolithic structure formed from a dielectric material having a first side, a second side, and an intermediate region between the first side and the second side, and the intermediate region has a lattice structure ...
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WO/2023/248804A1 |
The stretchable device of the present disclosure comprises a stretchable substrate that has a first main surface and a second main surface, and an electronic component provided on the stretchable substrate. The first main surface include...
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WO/2023/246536A1 |
The present application provides a display device, comprising a display substrate and a driving assembly. In the process that a first bonding area in the display substrate is bonded to a second bonding area in the driving assembly by mea...
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WO/2023/248830A1 |
A stretchable wiring substrate 1A comprises: a stretchable base material 10A that has a first main surface 10Aa and a second main surface 10Ab opposing each other in a thickness direction T; and a wiring member 20A which is provided at l...
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WO/2023/247911A1 |
A method of manufacturing a conductive transfer, comprises the step of printing a non-conductive ink onto a release film to produce a first non- conductive ink layer and curing the first non-conductive ink layer. The method comprises pri...
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WO/2023/246608A1 |
Provided in the present application is a circuit board, comprising: a substrate; a wiring layer, which is located on the surface of the substrate and is used for transmitting a first electrical signal and a second electrical signal, wher...
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WO/2023/247219A1 |
A circuit board arrangement (14) comprises a first circuit board section (140A), a second circuit board section (140B), and a standoff element (2) comprising a body (20) having a first end (21) and a second end (22). The standoff element...
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WO/2023/248831A1 |
A stretchable wiring board 1A is provided with: a stretchable substrate 10A having a first principal surface 10Aa and a second principal surface 10Ab facing one another in a thickness direction T; a wiring member 20A that is provided to ...
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WO/2023/248485A1 |
In the present invention, a low-resistance conductive film is formed on a paper base material. A copper ink according to the present invention comprises copper fine particles, a liquid dispersion medium, and a dispersant which disperse...
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WO/2023/248658A1 |
According to the present invention, a mounting electrode is located on a positive principal surface of a resin layer located in the most positive Z-axis direction among a plurality of resin layers. An inner conductor layer overlaps the...
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WO/2023/246160A1 |
The present disclosure provides a circuit board, comprising a plurality of array connection points arranged to form a connection point array and a plurality of array holes arranged to form a hole array; at least some of the array connect...
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WO/2023/248657A1 |
In the present invention, a plurality of conductor layers include a first conductor layer that has a mounting electrode that is positioned at a positive main surface of an insulator layer that is positioned farthest in the positive direc...
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WO/2023/248517A1 |
The present invention provides a composite material, which comprises an insulating spacer that demonstrates at least the conventional, or higher, creepage withstand voltage even in AC equipment in atmosphere, and which enables size reduc...
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WO/2023/249732A1 |
A status monitoring system includes a status sensor configured to monitor a status of an electronic circuit. If the status monitoring system detects a status that exceeds a threshold, the status monitoring system records the details of t...
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WO/2023/247821A1 |
A flexible circuit board (10) having a base film (13) is usable for a magnetic tracking system (100) comprising a sensing circuit (101), a transmitting coil (102), and a sensing coil (103) positioned at a point of interest (105) and bein...
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WO/2023/248029A1 |
A multi-chip package structure is provided. The multi-chip package structure includes a first IC chip and a second IC chip, and a fluid conduit thermally coupled to the first IC chip and the second IC chip. The multi-chip package structu...
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WO/2023/248810A1 |
This polyamic acid composition contains a polyamic acid and an organic solvent. The polyamic acid has a residue including a divalent organic group represented by chemical formula (1), a 3,3',4,4'-biphenyl tetracarboxylic dianhydride resi...
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WO/2023/249292A1 |
The wearable electronic device may comprise: a frame; a printed circuit board which is arranged in the frame and which includes at least one ground part; and a connection member. The connection member can comprise: an extension part; a f...
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WO/2023/249182A1 |
A flexible circuit board module for a hearing aid, according to the present invention, is a flexible circuit board module which is coupled to a faceplate constituting a hearing aid, the flexible circuit board module comprising: a base su...
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WO/2023/240759A1 |
Disclosed in the present application are an intelligent power module and an electrical device. The intelligent power module comprises: a first circuit board; at least one electrical connector, which is mounted on the first circuit board;...
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WO/2023/243676A1 |
A resin composition comprising (A) a resin comprising a structure derived from a maleimide resin (a) having one or more N-substituted maleimide groups and a structure derived from an amine compound (b) having one or more amino groups and...
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WO/2023/243542A1 |
This sintered body contains Al2O3, SiO2 and MnO and includes a primary crystal phase constituted from Al2O3, a first glass phase, and a second glass phase having a composition different from that of the first glass phase. The first glass...
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WO/2023/241865A1 |
The invention relates to an inductance plethysmography device comprising: • a support (20) made of elastic textile designed to be closed on itself along two lateral edges (21, 22) in order to surround a portion of the torso of an indiv...
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WO/2023/241277A1 |
A circuit board and a display device having same. The circuit board comprises: a circuit board body (1), wherein a part mounting face (11) is formed on one side of the circuit board body (1); a base face (12) is formed on the other side ...
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WO/2023/243667A1 |
A ceramic substrate according to the embodiments is characterized by having two or more peaks in the 98-106 eV range in a spectrum obtained by measuring a laser irradiation region of a laser machining surface via XPS. Also provided are a...
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WO/2023/243229A1 |
The present invention provides a novel electronic component, a production method therefor, and a conductive sheet used for these. Provided is a method for producing an electronic component provided with a conductive layer, said method co...
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WO/2023/244835A1 |
A method for water drainage of a substrate includes creating, on a surface of the substrate, a designated hydrophobic region having hydrophobic surfaces of a hydrophobic film. Electronic circuitries are fabricated in the designated hydro...
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WO/2023/243501A1 |
This printed wiring board comprises a base film having a major surface, and an electrically conductive pattern disposed on the major surface. The normal to the major surface is along a first direction. The electrically conductive pattern...
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WO/2023/243157A1 |
Provided is a bonded printed wiring board which can improve transmission characteristics and which has a structure in which space saving of a joint portion is achieved. A bonded printed wiring board 1 according to an embodiment of the ...
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WO/2023/243903A1 |
Disclosed are a composite film, a rigid flexible printed circuit board, and an electronic device comprising same. The present invention relates to a composite film, a rigid flexible printed circuit board using same, and an electronic dev...
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WO/2023/242703A1 |
The present invention relates to a device for use with an electrical component, wherein the device is configured to surround at least a component portion of the electrical component at least partially around the axis thereby defining a r...
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WO/2023/242254A1 |
The invention relates to a method for manufacturing a sensor for an aerosol-generating device, wherein the method may comprise any of the following steps: providing a layer of a flexible dielectric substrate, printing or mounting a first...
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WO/2023/241123A1 |
Disclosed in the present application are a flexible circuit board and a manufacturing method therefor. The manufacturing method for the flexible circuit board comprises: preparing a film; providing an imprinting mold having a protruding ...
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WO/2023/244003A1 |
The present invention relates to a ceramic substrate and a method for manufacturing same, the ceramic substrate comprising: a ceramic base; a first electrode pattern and a second electrode pattern formed on the upper and lower surfaces o...
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WO/2023/203179A9 |
Printed-Circuit-Board structure (10), in particular for an RF generator, comprising: a heat spreader (14); a basic printed-circuit-board, PCB, (22) having an upper surface (18) and a lower surface (28), wherein the basic PCB (22) compris...
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WO/2023/238537A1 |
A module (101) comprises: a core substrate (1) having a first surface (1a) and a second surface (1b) that form the front and back thereof, and a through-hole (1e) that connects the first surface (1a) and the second surface (1b); a redist...
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WO/2023/238592A1 |
Provided are: a laminate which has excellent adhesiveness between a support and a metal layer (metal-plated layer) and with which a seed layer serving as a base of plating can be simply and inexpensively formed, without roughening a supp...
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WO/2023/239162A1 |
A circuit board according to an embodiment comprises: an insulating layer which includes an upper surface and a lower surface and has a recess which is recessed from the upper surface toward the lower surface; and a circuit pattern layer...
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WO/2023/237616A1 |
The invention relates to a circuit carrier, in particular a multi-layer printed circuit board. The circuit carrier has at least two electrically insulating layers, and at least one electrically conductive layer. The circuit carrier also ...
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WO/2023/238515A1 |
A composition containing a liquid crystal polymer that contains a structural unit represented by formula (1), a structural unit represented by formula (2), and a structural unit represented by formula (3), wherein the composition is char...
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WO/2023/239053A1 |
The present invention relates to a structure of a flexible printed circuit board for overcurrent protection comprising shape memory material, and specifically, to a structure of a flexible printed circuit board, the structure being chara...
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