Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/053425
Kind Code:
A1
Abstract:
This printed wiring board comprises: a base film having a main surface; and first and second wirings disposed on the main surface. The first and second wirings are each spirally wound in a plan view. The second wiring is disposed inward of the first wiring in a plan view. The distance between the centers of adjacent rounds of the first wiring and the distance between the centers of adjacent rounds of the second wiring are smaller than the interval between a part located in the innermost round of the first wiring and a part located in the outermost round of the second wiring. A value obtained by dividing the number of times of winding of the first wiring by the number of times of winding of the second wiring is 0.1-10.0.
Inventors:
HIRAI RYOTA (JP)
NITTA KOJI (JP)
TSUDA YUKIE (JP)
MAKINO TAKAHIKO (JP)
NITTA KOJI (JP)
TSUDA YUKIE (JP)
MAKINO TAKAHIKO (JP)
Application Number:
PCT/JP2023/030633
Publication Date:
March 14, 2024
Filing Date:
August 25, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01F17/00; H05K1/16
Domestic Patent References:
| WO2021193778A1 | 2021-09-30 | |||
| WO2016199516A1 | 2016-12-15 |
Foreign References:
| JP6985568B1 | 2021-12-22 | |||
| JPH07245215A | 1995-09-19 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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