Title:
ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/095422
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an electronic control device with which the long-term reliability of the soldered section between a leadless package and a circuit board can be ensured. An electronic control device 1 comprises: a leadless package 101 in which a plurality of terminals 101e are exposed from an underside surface 101c of a sealing resin 101a; a circuit board 102 to which the terminals 101e are soldered and on which the leadless package 101 is mounted; a casing 104 which accommodates the circuit board 102; and external connectors 105a, 105b which are connected to a device outside the casing 104. The circuit board 102 has fixing parts 108a-108f which are fixed to the casing 104. The plurality of terminals 101e include a smallest surface area terminal 106 which has the smallest surface area. A plurality of sides which form the underside surface 101c of the sealing resin 101a include a first side 107 at which the smallest surface area terminal 106 is disposed. The first side 107 is disposed to be spaced farther apart than the other sides from the fixing parts 108a-108f and the external connectors 105a, 105b.
Inventors:
IGARASHI TAKESHI (JP)
OYAMA KATSUYA (JP)
YAMASHITA SHIRO (JP)
OYAMA KATSUYA (JP)
YAMASHITA SHIRO (JP)
Application Number:
PCT/JP2022/041074
Publication Date:
May 10, 2024
Filing Date:
November 02, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H05K3/34; H01L23/12; H05K1/18
Domestic Patent References:
| WO2019116828A1 | 2019-06-20 | |||
| WO2019012849A1 | 2019-01-17 |
Foreign References:
| JPH04180289A | 1992-06-26 | |||
| JP2011192817A | 2011-09-29 |
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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