Title:
CURABLE COMPOSITION, RESIN SHEET, LAMINATE, METAL CLAD LAMINATED BOARD, AND WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/095742
Kind Code:
A1
Abstract:
The present disclosure provides a curable composition from which it is possible to obtain a resin which has excellent adhesiveness to substrates, which has excellent heat resistance, and in which the dielectric loss tangent (Df) at high frequency conditions is effectively reduced. This curable composition contains: one or more thermoplastic elastomers (E) selected from the group consisting of block copolymers including polymeric blocks (A) formed of structural units derived from one or more aromatic vinyl compounds including an alkyl styrene compound that has an alkyl group having 1-8 carbon atoms, and polymeric blocks (B) formed of structural units derived from one or more conjugated diene compounds, and hydrogenated products of the block copolymers; 3-30 parts by mass of a cross-linking agent (C) and 0-25 parts by mass of an inorganic filler (F) with respect to a total of 100 parts by mass of the thermoplastic elastomer (E) and the cross-linking agent (C); and a radical polymerization initiator (I). The dielectric loss tangent (Df) of a cured product obtained from the curable composition is 0.0030 or less at a temperature of 23°C and at a frequency of 10 GHz.
Inventors:
SATO YUSUKE (JP)
HASHIMOTO KAZUMI (JP)
ONO MOTOSHI (JP)
HASHIMOTO KAZUMI (JP)
ONO MOTOSHI (JP)
Application Number:
PCT/JP2023/037323
Publication Date:
May 10, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08L53/02; B32B15/08; B32B25/00; B32B25/16; B32B27/30; C08F287/00; C08K3/013; H05K1/03
Domestic Patent References:
| WO2021010432A1 | 2021-01-21 | |||
| WO2022059625A1 | 2022-03-24 |
Foreign References:
| JP2006257296A | 2006-09-28 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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