Title:
ELECTROMAGNETIC WAVE ATTENUATION FILM AND MANUFACTURING METHOD OF SAME
Document Type and Number:
WIPO Patent Application WO/2023/228891
Kind Code:
A1
Abstract:
The purpose of the present invention is to easily and inexpensively obtain an electromagnetic wave attenuation film with little shift in absorption peak frequency and little change in frequency characteristics and angular characteristics over time. The electromagnetic wave attenuation film of the present invention includes: an electromagnetic wave attenuation substrate having a dielectric substrate having a front surface and a back surface, and thin film conductive layers disposed on both the front and back surfaces of the dielectric substrate; a support layer disposed on the back surface of the electromagnetic wave attenuation substrate; and a flat plate inductor disposed on the back surface of the support layer, wherein the thin film conductive layer includes a plurality of conductive elements. Further, the conductive elements are arranged periodically, and when the distance in the plane direction between the centers of gravity of the front and rear conductive elements is l, and the shortest distance from the center of gravity of the conductive element to the end of a plate is a, the following equation (1) may be satisfied. (1): L ≦ 5.2a
Inventors:
AOKI ATSUKO (JP)
KONDO SHINPEI (JP)
FUJITA TORU (JP)
IMAI MIHO (JP)
KOTAKA RYOSUKE (JP)
KONDO SHINPEI (JP)
FUJITA TORU (JP)
IMAI MIHO (JP)
KOTAKA RYOSUKE (JP)
Application Number:
PCT/JP2023/018861
Publication Date:
November 30, 2023
Filing Date:
May 22, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
H05K9/00; B32B7/025; B32B15/08; H01P11/00; H01Q17/00; H05K1/02; H05K1/16; H05K3/46
Domestic Patent References:
| WO2022107637A1 | 2022-05-27 |
Foreign References:
| JP2009170887A | 2009-07-30 | |||
| JP2021082896A | 2021-05-27 |
Attorney, Agent or Firm:
DAI-ICHI INTERNATIONAL PATENT OFFICE, P.C. (JP)
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