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Patent Searching and Data


Title:
CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/233459
Kind Code:
A1
Abstract:
This connection structure comprises a plurality of insulating wires, a base material, a plurality of to-be-connected sections disposed on the base material, and a sealing member. Each of the insulating wires has a center conductor and an insulating layer which covers the peripheral surface of the center conductor. On the leading end section in the axial direction of each of the plurality of insulating wires, the center conductor is exposed from the insulating layer. The plurality of to-be-connected sections are arranged side by side in a row shape. The leading end sections of the plurality of insulating wires are respectively soldered to the plurality of to-be-connected sections. The sealing member is disposed on the base material so as to cover the leading end sections of the plurality of insulating wires and the plurality of to-be-connected sections.

Inventors:
YAMAMOTO MASAMICHI (JP)
NAKATSUGI KYOUICHIROU (JP)
KOINUMA TAKAYOSHI (JP)
MATSUMOTO MASAHIRO (JP)
HATTORI SHIHO (JP)
YOSHIDA NARUMI (JP)
Application Number:
PCT/JP2022/021909
Publication Date:
December 07, 2023
Filing Date:
May 30, 2022
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K3/34; H01R4/02; H01R9/05; H05K1/18
Foreign References:
JP2016092040A2016-05-23
JP2014164842A2014-09-08
JP2006164580A2006-06-22
JP2012014934A2012-01-19
JP2011171309A2011-09-01
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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