CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREFOR, AND PACKAGING STRUCTURE

WIPO Patent Application WO/2024/087201

A1

Provided is a manufacturing method for a circuit board assembly (100), comprising the steps of: providing a packaging substrate (22), the packaging substrate (22) comprising a base material layer (11), a circuit layer, and a hollow electrically-conductive column (21), the circuit layer being provided on the base material layer (11), and one end of the hollow electrically-conductive column (21) being provided on the circuit layer; providing a heating element (30) in the hollow electrically-conductive column (21), the heating element (30) being electrically connected to the circuit layer; filling the hollow electrically-conductive column (21) with a thermally-conductive medium (33), the heating element (30) being immersed in the thermally-conductive medium (33); and providing an electrically-conductive cover body (40) at the other end of the hollow electrically-conductive column (21), the electrically-conductive cover body (40) sealing the hollow electrically-conductive column (21), and obtaining the circuit board assembly (100). In addition, further provided is a packaging structure (200).

ZHU CHANGHE (CN)
LI YANG (CN)
WANG JIAN (CN)
LIU LIKUN (CN)
LI YANLU (CN)

PCT/CN2022/128372

May 02, 2024

October 28, 2022

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HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD (CN)
AVARY HOLDING SHENZHEN CO LTD (CN)
GARUDA TECH CO LTD (CN)

H05K1/02; H05K1/18

CN112020199A	2020-12-01
CN105792504A	2016-07-20
CN112020222A	2020-12-01
CN107958894A	2018-04-24
CN112533349A	2021-03-19
US20120023743A1	2012-02-02
US20180063948A1	2018-03-01

SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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