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Patent Searching and Data


Title:
MULTILAYER BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2024/090364
Kind Code:
A1
Abstract:
[Problem] To provide a multilayer body which has excellent heat dissipation performance in the thickness direction, excellent thermal diffusibility in the in-plane direction, and excellent electrical insulation performance in the thickness direction, and which is not susceptible to cracking. [Solution] Disclosed is a multilayer body which comprises a metal layer A, an insulating layer that is provided on at least one surface of the metal layer A, and a metal layer B that is provided on a surface of the insulating layer, the surface being on the reverse side from the metal layer A. This multilayer body is characterized in that: the insulating layer comprises a supporting layer and a heat transfer layer that contains at least an inorganic filler and a binder resin; and the supporting layer and the heat transfer layer are alternately stacked in a direction that is generally perpendicular to the thickness direction of the insulating layer so that the total number of layers is 3 or more.

Inventors:
SOEDA JUNSHI (JP)
MAEDA MASANORI (JP)
YAMANAKA KATSUHIRO (JP)
Application Number:
PCT/JP2023/038120
Publication Date:
May 02, 2024
Filing Date:
October 23, 2023
Export Citation:
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Assignee:
TEIJIN LTD (JP)
International Classes:
B32B7/027; B32B15/08; B32B27/18; H05K1/03; H05K1/05
Domestic Patent References:
WO2021090929A12021-05-14
Foreign References:
JP2006076263A2006-03-23
JP2021145134A2021-09-24
CN103144362A2013-06-12
JP2014515876A2014-07-03
JP2019131705A2019-08-08
Attorney, Agent or Firm:
TAMEYAMA Taro (JP)
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