Title:
MULTILAYER POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2024/085047
Kind Code:
A1
Abstract:
A multilayer polyimide film (10) comprises a non-thermoplastic polyimide layer (11) and a thermoplastic polyimide layer (12) that is disposed on at least one surface of the non-thermoplastic polyimide layer (11). The thermoplastic polyimide layer (12) includes a thermoplastic polyimide that has, as a diamine residue, a 1,3-bis(4-aminophenoxy) benzene residue, and has, as a tetracarboxylic dianhydride residue, a 3,3',4,4'-benzophenone tetracarboxylic dianhydride residue. The linear coefficient of expansion of the thermoplastic polyimide layer (12) is 65.0 ppm/K or less. The tensile modulus of elasticity of the non-thermoplastic polyimide layer (11) is 5.0 GPa or greater. The tensile stress of the non-thermoplastic polyimide layer (11) at 10% distortion is 200 MPa or more.
Inventors:
IMAMURA YUICHI (JP)
WATANABE TAKAYUKI (JP)
SHIMAZAKI TEPPEI (JP)
WATANABE TAKAYUKI (JP)
SHIMAZAKI TEPPEI (JP)
Application Number:
PCT/JP2023/036948
Publication Date:
April 25, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/34; B32B15/08; C08G73/10; C08J5/18; H05K1/03
Domestic Patent References:
| WO2022085619A1 | 2022-04-28 | |||
| WO2022080314A1 | 2022-04-21 |
Foreign References:
| JP2022101484A | 2022-07-06 | |||
| JP2003192789A | 2003-07-09 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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