Title:
SPACER FOR CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/084847
Kind Code:
A1
Abstract:
In the present invention, a spacer (1) having a columnar shape is mounted such that a circular conductor pattern (5) corresponding to a bottom end surface (1b) of the spacer (1) is formed on a circuit board (4), a resist (6) is formed around the conductor pattern (5), and the bottom end surface (1b) is on and in contact with the conductor pattern (5). A circular resist (16) is formed in the center of the conductor pattern (5) so as to project upward. The spacer (1) is positioned by forming a cylindrical fitting part (15b) on the bottom end surface (1b) of the spacer (1) and fitting the same to the circular resist (16). Furthermore, a reduced-diameter part (14b) is formed around the bottom end surface (1b) such that the conductor pattern (5) is exposed upward, and when mounting the spacer (1), molten solder is affixed by surface tension to the outer circumferential surface of the reduced-diameter part (14b) on the conductor pattern (5) so as to form a fillet (19).
Inventors:
SEKI TOSHIHIRO (JP)
KITAJIMA YOSHIKAZU (JP)
KITAJIMA YOSHIKAZU (JP)
Application Number:
PCT/JP2023/032379
Publication Date:
April 25, 2024
Filing Date:
September 05, 2023
Export Citation:
Assignee:
RHYTHM CO LTD (JP)
International Classes:
H05K1/14; H05K3/34
Foreign References:
| JPS62151780U | 1987-09-26 | |||
| JPH02131372U | 1990-10-31 | |||
| JPH03106776U | 1991-11-05 |
Attorney, Agent or Firm:
AIHARA & PARTNERS PATENT ATTORNEY CORPORATION (JP)
Download PDF:
Previous Patent: SHOCK ABSORBER AND METHOD FOR ATTACHING DAMPING FORCE ADJUSTMENT DEVICE
Next Patent: DISPERSANT AND AQUEOUS COATING COMPOSITION
Next Patent: DISPERSANT AND AQUEOUS COATING COMPOSITION