Title:
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL-FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/090410
Kind Code:
A1
Abstract:
Provided is a resin composition with which a novel cured product can be achieved. Also provided are the cured product, a prepreg, a metal-foil-clad laminate board, a resin composite sheet, and a printed wiring board. The resin composition comprises a polymaleimide compound (A) and a maleimide compound (B) other than the polymaleimide compound (A). The polymaleimide compound (A) serves as a reaction feedstock (1) obtained by reacting: an aromatic amine compound (a1) having 1-3 alkyl groups on an aromatic ring; an aromatic divinyl compound (a2) having two ethenyl groups; and maleic anhydride.
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Inventors:
TOKUNAGA NAOYA (JP)
YAMAMOTO KATSUYA (JP)
HASEBE KEIICHI (JP)
KOBAYASHI TAKASHI (JP)
KAMATA YUJI (JP)
KOGA SHOTA (JP)
YAMAMOTO KATSUYA (JP)
HASEBE KEIICHI (JP)
KOBAYASHI TAKASHI (JP)
KAMATA YUJI (JP)
KOGA SHOTA (JP)
Application Number:
PCT/JP2023/038272
Publication Date:
May 02, 2024
Filing Date:
October 24, 2023
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
MGC ELECTROTECHNO CO LTD (JP)
MGC ELECTROTECHNO CO LTD (JP)
International Classes:
C08F222/40; B32B5/28; B32B15/08; B32B15/088; B32B27/34; C08F2/44; C08F290/06; C08F299/02; C08J5/24; C08K3/013; C08K3/016; C08K5/49; C08L65/00; C08L71/00; C08L79/08; C08L101/00; H05K1/03
Domestic Patent References:
| WO2020004211A1 | 2020-01-02 | |||
| WO2021149733A1 | 2021-07-29 | |||
| WO2020054601A1 | 2020-03-19 | |||
| WO2019230945A1 | 2019-12-05 | |||
| WO2023171553A1 | 2023-09-14 | |||
| WO2023171554A1 | 2023-09-14 | |||
| WO2023176763A1 | 2023-09-21 | |||
| WO2023176764A1 | 2023-09-21 | |||
| WO2023176766A1 | 2023-09-21 |
Foreign References:
| JP7160151B1 | 2022-10-25 | |||
| CN113121999A | 2021-07-16 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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