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WO/2024/092601A1 |
The present invention relates to a two-component epoxy resin composition, consisting of - a first component K1 comprising at least one epoxy resin A that contains on average more than one epoxy group per molecule; and - a second componen...
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WO/2024/095948A1 |
A sealing agent comprising: a cationically polymerizable compound (A); a cationic polymerization initiator (B); and a curing retarder (X), wherein a viscosity change ratio represented by V1/V0 is not less than 1.00 but less than 1.75, wh...
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WO/2024/093718A1 |
Disclosed in the present invention are a hollow microsphere composite thermally-conductive filler coated with a low-dimensional nanometer high-thermal-conductivity material, a preparation method therefor, and a use thereof. According to ...
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WO/2024/090829A1 |
The present invention pertains to an epoxy resin having a high glass transition temperature and excellent flexibility. This epoxy resin is characterized by being prepared using a method comprising the steps of: reacting alcohol and isocy...
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WO/2024/088848A1 |
The invention relates generally to the field of insulation, more particularly to a formulation for a high-temperature insulation at operating temperatures of 200°C and higher. The insulation is used to insulate electric conductors. The ...
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WO/2024/088989A1 |
The invention is directed to acrylic plastisol composition comprising at least one acrylate polymer, at least one epoxy resin having on average more than one epoxide group per molecule, at least one latent hardener for epoxy resins, at l...
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WO/2024/090396A1 |
The present invention provides a curable resin composition which is capable of forming a cured product that is excellent in terms of low dielectric loss tangent, plating adhesion and heat resistance. A curable resin composition according...
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WO/2024/084968A1 |
The present invention relates to an epoxy resin composition comprising: (A) an epoxy resin containing two or more epoxy groups per molecule; (B) a mesogenic group-containing polyorganosiloxane represented by formula (1); and (C) an epoxy...
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WO/2024/085744A1 |
The invention relates to an epoxy composition that can be used in the field of building, in particular for coating metal structures, sandwich panels, insulated panel roof coverings and pipes in buildings and structures for industrial, co...
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WO/2024/080195A1 |
The present invention pertains to: a prepreg which contains a fiber base material and a resin composition containing (A) a thermosetting resin and (B) a spherical zinc molybdate, and in which the weight per unit area of the fiber base ma...
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WO/2024/077101A2 |
The present disclosure relates to systems and methods for assaying and controlling micro-objects in a microfluidic device. In situ-generated hydrogel features, including barriers are provided for dividing a microfluidic chamber or flow c...
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WO/2024/075342A1 |
Provided are an epoxy resin composition whereby it is possible to achieve both injectability and reliability, a semiconductor device, and a method for producing the semiconductor device. The epoxy resin composition contains a polyalkyl...
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WO/2024/075602A1 |
The present invention provides a low-temperature-curable epoxy resin composition that achieves both excellent adhesive strength and ink resistance. Provided is an epoxy resin composition that includes components (A)–(C), the epoxy resi...
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WO/2024/075480A1 |
Disclosed are: a thermosetting resin composition which contains an epoxy resin (component (A)), a (meth)acrylate compound (component (B)), an epoxy resin curing agent (component (C)) and a thermal radical polymerization initiator (compon...
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WO/2024/075343A1 |
The present invention provides: an epoxy resin composition which can be applied by means of a jet dispenser, while having good injectability; a semiconductor device; and a method for producing a semiconductor device. This epoxy resin c...
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WO/2024/074069A1 |
The present invention relates to the technical field of epoxy resin-based flame-retardant composite materials, and disclosed in the present invention is a stirring equipment and a method for preparing an epoxy resin-based flame-retardant...
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WO/2024/071133A1 |
Provided is a silicon-atom-containing UV-curable composition that has exceptional workability when applied to a substrate and that, being cured, yields a product having exceptional mechanical properties and low outgassing characteristics...
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WO/2024/066525A1 |
A reinforced polypropylene composite material, a preparation method therefor, and use thereof. The enhanced polypropylene composite material comprises the following components: 30-78 parts by weight of unimodal polypropylene homopolymer,...
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WO/2024/068653A1 |
In general, the present invention relates to lignin-derived curing agents, as well as their use in resin compositions. Furthermore, the present invention relates to methods for preparing said lignin-derived curing agents.
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WO/2024/070841A1 |
Provided are hollow particles which suppress reductions in pressure resistance under high temperatures. The present invention pertains to hollow particles comprising a shell, which includes a resin, and a hollow portion surrounded by the...
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WO/2024/071234A1 |
Provided are: a curable composition which contains a filler and a compound A having a group A that is a hydrocarbon group in which at least one hydrogen atom is substituted with a fluorine atom and a group B that is at least one group wh...
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WO/2024/071585A1 |
The present invention relates to a thermoplastic resin composition and an automobile interior part manufactured therefrom. Employing materials different from those conventionally used, the thermoplastic resin composition according to the...
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WO/2024/070897A1 |
With regard to a film for protecting the circuit wiring or the sensor electrode of a circuit sheet or a sensor sheet, the present invention makes it possible to form a protective film which has reduced thickness and has an exceptional ab...
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WO/2024/068550A1 |
The invention relates to a composition for coating metal surfaces, comprising a binding agent which comprises a phenolic resin, an epoxy resin, in particular phenoxy resin, a polyester resin (soft resin) and a polyisocyanate, further com...
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WO/2024/063130A1 |
The resin composition contains compound (A) having a (meth)acryloyl group, compound (B) having an epoxy group and/or an oxetanyl group, radical polymerization initiator (C) and cationic polymerization initiator (D). The hydrogen bonding ...
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WO/2024/062904A1 |
The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device. That is, provided is a r...
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WO/2024/063153A1 |
The present invention provides a novel method for producing fibers that are suitable for an acidic gas adsorbent. This fiber production method includes a step I for obtaining a reactant P1 by at least partially reacting a compound group ...
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WO/2024/062987A1 |
The present invention relates to a liquid-crystal polyester composition which comprises a liquid-crystal polyester and an olefin copolymer, wherein the olefin copolymer comprises repeating unit A derived from a C2-C8 olefin monomer and r...
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WO/2024/055962A1 |
A resin composition. The resin composition comprises an epoxy resin, a curing agent and a fine silicon powder, wherein the mode diameter of the fine silicon powder is 18-22 μm, and the average particle size of the fine silicon powder is...
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WO/2024/057999A1 |
This coloring composition contains a coloring agent, a resin, a radically polymerizable monomer, a radical polymerization initiator, at least one generator which is selected from the group consisting of an acid generator and a base gener...
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WO/2024/055091A1 |
The present invention pertains to the field of polymers and nanotechnology. More specifically, the invention discloses a nanoparticle preparation, a premix comprising monomers and nanoparticles, their use in the preparation of polymers h...
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WO/2024/057920A1 |
The purpose of the present invention is to provide a two component curable resin composition by which can be obtained a cured product that excels in hydrogen gas barrier properties and exhibits high stretchability and high strength. Th...
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WO/2024/055959A1 |
Provided in embodiments of the present application is a resin composition, the resin composition comprising epoxy resin, a curing agent and an inorganic filler, wherein the cut-off particle size of the inorganic filler is 3 μm, and the ...
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WO/2024/055946A1 |
The embodiments of the present application provide a resin composition, a method for preparing same, and use thereof. The resin composition comprises epoxy resin, a curing agent, a curing accelerator, and an auxiliary agent. The auxiliar...
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WO/2024/053274A1 |
The present invention provides a polycarbonate resin composition which has excellent tensile strength, wet heat resistance, chemical resistance and processability. A composition according to the present invention contains, relative to 10...
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WO/2024/053804A1 |
The present application relates to a resin comprising a unit represented by chemical formula 1, a method for manufacturing same, a resin composition comprising same, and a molded product comprising the resin composition.
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WO/2024/053593A1 |
The present invention addresses the problem of providing a thiol group-containing polyether polymer which has a lower viscosity and superior workability compared to epoxy adhesives using conventional polymercaptan-based curing agents and...
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WO/2024/050658A1 |
Two component (2K) composition comprises: (I) a first component comprising: a) at least one epoxy silane oligomer according to Formula (AI) wherein: R e is a C 1-C 6 alkyl group; R f is an epoxide substituted C 1-C 12 alkyl group, C 3-C ...
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WO/2024/053609A1 |
The purpose of the present invention is to provide: an alkali-soluble resin able to yield a cured product having a high refractive index; a photosensitive resin composition; and a cured product. The present invention is an alkali-soluble...
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WO/2024/053402A1 |
The purpose of the present invention is to provide: a compound which is a curable resin and enables a cured product thereof to easily achieve repairability, re-formability and easy dismantlability; a curable resin composition which uses ...
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WO/2024/053664A1 |
An electroconductive composition comprising: 100 parts by mass of a binder component comprising 40-70 parts by mass of a solid bisphenol type epoxy resin and 30-60 parts by mass of one or more liquid epoxy resins including at least one r...
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WO/2024/047421A1 |
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising a curable resin and a curing accelerator, wherein the curing accelerator comprises calcium hydroxide nitrate particles. Th...
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WO/2024/046794A1 |
A phosphinate or a composition of phosphinates obtainable or obtained by reacting at least a phosphinic acid of formula (I) with an oxirane of formula (II) wherein R1 and R2 are the same or different and independently represent H or a hy...
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WO/2024/048585A1 |
This invention addresses the problem of providing rubber-bonded cellulose fibers and the like with which viscosity and melt viscosity do not easily increase when said fibers are added to various types of resins. Rubber-bonded cellulose f...
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WO/2024/049136A1 |
The present invention relates to a liquid crystal epoxy resin composition for heat dissipation materials and a cured product thereof. More specifically, the present invention provides: a curable liquid crystal epoxy resin composition inc...
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WO/2024/048055A1 |
Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an ...
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WO/2024/048431A1 |
Provided is a conductive polymer solution from which it is possible to provide an electrolytic capacitor that has a high capacity and that exhibits low ESR characteristics. The present invention uses a conductive polymer solution that co...
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WO/2024/048481A1 |
Provided are a composition, and a resin composition and cured product using the composition. The composition includes an amino group and a cyclic ether structure, and contains a compound having a molecular weight of 1000 or less, and a l...
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WO/2024/042952A1 |
The present invention provides: an acid generator which exhibits excellent solubility in a cationically curable compound; and a curable composition which is rapidly cured when subjected to a heat treatment, and which forms a cured produc...
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WO/2024/043168A1 |
This curable composition comprises a polymerizable monomer having a carbon-carbon double bond, a radical polymerization initiator, an azole compound, an elastomer, and a reducing agent. When the curable composition is sandwiched between ...
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