Title:
HOLLOW MICROSPHERE COMPOSITE THERMALLY-CONDUCTIVE FILLER COATED WITH LOW-DIMENSIONAL NANOMETER HIGH-THERMAL-CONDUCTIVITY MATERIAL, PREPARATION METHOD THEREFOR, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/093718
Kind Code:
A1
Abstract:
Disclosed in the present invention are a hollow microsphere composite thermally-conductive filler coated with a low-dimensional nanometer high-thermal-conductivity material, a preparation method therefor, and a use thereof. According to the preparation method, a low-dimensional nanometer high-thermal-conductivity material is tightly coated on the surfaces of micron hollow spherical particles by means of strong interactions including at least one of an electrostatic action, chemical bonding, and hydrogen bonding of solvents, wherein the mass ratio of the low-dimensional nanometer high-thermal-conductivity material to the micron hollow spherical particles is 1:5-1:100. The micron hollow spherical particles provided by the present invention suppress the agglomeration and orientation of the low-dimensional nanometer high-thermal-conductivity material, and provide a remarkable volume fraction on the premise of a low mass fraction, and the low-dimensional nanometer filler coated on the surfaces of the hollow microspheres provides high-thermal-conductivity performance as a thermal conduction pathway. Moreover, The preparation method realizes the tight bonding of a low-dimensional nanometer high-thermal-conductivity material and micron hollow spherical particles by means of strong interactions such as an electrostatic action, chemical bonding, and hydrogen bonding of solvents.
Inventors:
HUANG XIAO (CN)
LIU TINGTING (CN)
LIU TINGTING (CN)
Application Number:
PCT/CN2023/126117
Publication Date:
May 10, 2024
Filing Date:
October 24, 2023
Export Citation:
Assignee:
HUANG XIAO (CN)
International Classes:
C08K9/10; C08K3/04; C08K7/26; C08K7/28; C08K3/14; C08K3/38; C08L25/06; C08L33/12; C08L63/00; C09K5/14
Foreign References:
| CN115612179A | 2023-01-17 | |||
| CN110564159A | 2019-12-13 | |||
| CN106517215A | 2017-03-22 | |||
| CN107325421A | 2017-11-07 | |||
| CN109810660A | 2019-05-28 | |||
| CN106496633A | 2017-03-15 | |||
| US20140147648A1 | 2014-05-29 |
Attorney, Agent or Firm:
HANQIAO PATENT (CN)
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