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Matches 701 - 750 out of 34,008

Document Document Title
WO/2022/030089A1
The present invention provides a conductive composition which enables the achievement of excellent die shear strength by sintering silver particles together regardless of the presence or absence of pressurization even by means of a low-t...  
WO/2022/030368A1
A composition that includes a compound (A) including a structure represented by general formula (I) as a first component, that includes at least one of an antioxidant (B1) different from a phosphorus-based antioxidant and a light stabili...  
WO/2022/030236A1
Provided is a semiconductor-sealing epoxy resin composition that satisfies required characteristics as a semiconductor sealing material, that does not produce odors, or NOx gas or SOx gas upon combustion, emits fluorescence even at long ...  
WO/2022/030370A1
The present invention is a heat-curable resin composition characterized in containing (A) a heat-curable resin, (B) a laser direct structuring additive, (C) an inorganic filler, and (D) a coupling agent, the (D) coupling agent: containin...  
WO/2022/031517A1
Provided herein is a hardener composition comprising (a) a first adduct comprising a reaction product of a liquid epoxy resin and isophorone diamine; (b) a second adduct comprising a reaction product of a liquid epoxy resin and m-xylylen...  
WO/2022/027922A1
A novel intumescent fireproof flame-retardant system, a coating, a flame retardant, and a sizing agent. A carbon source in the flame-retardant system is a phenolic resin, an acid aldehyde epoxy resin, PPO polyphenyl ether and/or polyphen...  
WO/2022/030507A1
A thermoplastic polyester resin composition characterized by comprising 100 parts by mass of a thermoplastic polyester resin (A) having an intrinsic viscosity of 0.60 dl/g or higher but lower than 0.85 dl/g, 5-30 parts by mass of a malei...  
WO/2022/030773A1
The present invention relates to a conductive resin composition, a method for preparing same, and a molded product comprising same and, more specifically, to a conductive resin composition, a method for preparing same, and a molded produ...  
WO/2022/030413A1
One aspect of the present invention relates to a resin composition comprising an acrylic resin and a curing agent. The acrylic resin comprises a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B)...  
WO/2022/025416A1
A thermoplastic resin composition of the present invention comprises: about 100 parts by weight of a polyolefin resin; about 7 to about 28 parts by weight of a polyolefin-polyalkylene oxide block copolymer; about 0.03 to about 1.3 parts ...  
WO/2022/022777A1
The invention relates to a high-power plug connection system comprising a cable connection housing for connecting at least two electric high-power plug connectors in order to transmit and/or distribute high electric current strengths and...  
WO/2022/023954A1
Efficient method for mixing, dispersing and integrating reduced graphene oxide (RGO) or carbon nanomaterials or nanostructured materials into a fusion-bonded epoxy (FBE) matrix. The polymer material comprises a mixture of the solid epoxy...  
WO/2022/024727A1
This epoxy resin composition comprises a mesogenic framework-containing epoxy resin (A), a liquid-state epoxy resin (B) having a viscosity of 1,500 mPa·s or lower at 25°C, a hardener (C), and an inorganic filler (D).  
WO/2022/019095A1
This thermosetting resin composition contains: an epoxy resin that is solid at 25°C; an epoxy resin that is non-solid at 25°C; fine particulate rubber that is dispersed in the non-solid epoxy resin; a setting agent; an inorganic filler...  
WO/2022/019309A1
Provided is a novel epoxy composition (modified epoxy resin). This composition is composed of an acrylic resin and an epoxy resin containing an alicyclic epoxy resin.  
WO/2022/019498A1
The present invention relates to an electrodeposition paint composition comprising a resin, a hardener, and an additive having cations dispersed in water, the additive being produced from an additive composition comprising a first epoxy ...  
WO/2022/014627A1
Provided is a liquid crosslinking agent which, as a liquid concentrate, has a sufficiently long life (pot life) and which exhibits satisfactory applicability during use. The liquid crosslinking agent contains an epoxy compound and an e...  
WO/2022/016134A1
Provided herein are curable resin compositions comprising (a) an epoxy resin component; (b) a phosphorated anhydride component; and (c) an active ester component. For example, the curable resin composition may comprise a phosphorated anh...  
WO/2022/011829A1
The present application provides a quantum dot film and preparation method therefor, and a display device. The quantum dot film comprises a quantum dot layer and a protective layer. The quantum dot layer comprises red quantum dots, green...  
WO/2022/014338A1
The present invention provides: a stabilizer composition which is capable of imparting a vinyl chloride resin with excellent thermal stability, coloring resistance, thermal coloring resistance and the like; a vinyl chloride resin composi...  
WO/2022/015535A1
Thermoset bulk molding compounds (BMC) useful for making electrically conductive components such as bipolar plates for fuel cells are described. The thermoset bulk molding compounds incorporate graphene nanoplatelets to increase the thro...  
WO/2022/014593A1
The present invention provides a compound for bonded magnets, said compound enhancing the mechanical strength (for example, crushing strength) of a bonded magnet. This compound for bonded magnets comprises a magnetic powder, an epoxy res...  
WO/2022/009628A1
One problem addressed by the present invention is to provide a curing agent for an epoxy resin that yields a resin composition having low viscosity and rapid curing and a cured product having high impact strength. The present invention p...  
WO/2022/007906A1
A method for catalyzing degradation of an anhydride-cured epoxy resin, comprising: formulating an anhydride-cured epoxy resin, a reaction solvent, and an organic acid catalyst into a degradation system, and performing a degradation react...  
WO/2022/010403A1
The present invention refers to a radiation curable composition, comprising 51-100 wt% of a cationic curable resin, further comprising a cycloaliphatic epoxide, at least one vinyl compound, selected from the group consisting of methyl vi...  
WO/2022/010972A1
Disclosed herein are curable compositions comprising an epoxide-functional polymer, a curing agent capable of reacting with the epoxide-functional polymer that is activatable by an external energy source, and a fluoropolymer that is subs...  
WO/2022/004656A1
The present invention pertains to: a flexible tube for an endoscope, said tube having a flexible cylindrical base material that is flexible, and a cover layer that covers the outer circumference of the flexible base material, wherein the...  
WO/2022/004553A1
Provided are: a liquid crystalline resin composition for a ball bearing anti-sliding wear member, said liquid crystalline resin composition being for use in the production of a ball bearing anti-sliding wear member in which sliding wear ...  
WO/2022/004409A1
The present invention provides a semiconductor package with an antenna, which has excellent solder heat resistance and low transmission loss. A semiconductor package 100 with an antenna, wherein an antenna part 5 is integrally formed wit...  
WO/2022/005890A1
A functional laminated glass article includes: a backer substrate; a flexible glass substrate comprising a thickness of no greater than 300 μm, and laminated to the backer substrate with an adhesive; a plurality of conductive traces dis...  
WO/2022/004695A1
Provided are a coated electric cable sealing composition which has excellent sealing properties even under conditions of cold/hot cycle and high temperature and humidity, for example, and a method for sealing a coated electric cable. Thi...  
WO/2022/000088A1
A compound of formula (I): MXy, alone or in combination with a compound of formula (II): MXzL, useful as a catalyst for accelerating the crosslinking of a reactive epoxy monomer, oligomer or polymer to form an epoxy thermoset resin, is p...  
WO/2022/000270A1
Thermoplastic compositions, methods of making the compositions, and composites containing the compositions are described. The thermoplastic composition can contain a polycarbonate, a polyphthalyl carbonate (PPC) copolymer, a poly (carbon...  
WO/2022/003769A1
The purpose of the present invention is to achieve an insulating material molded body (10) for arc suppression, said insulating material molded body being capable of suppressing decrease in the surface insulation performance when exposed...  
WO/2022/002217A1
Provided is a light conversion film capable of promoting plant growth and a preparation method therefor. The light conversion film contains garnet fluorescent powder with a composition of Y (3-x)Ba xAl (5-x)Si xO 12:mCe 3+,nCr 3+, where ...  
WO/2022/004756A1
A resin composition according to the present invention comprises: (A) a vinyl resin having a hyperbranched structure; (B) a liquid hardening agent; and (C) an inorganic filler.  
WO/2021/261383A1
A thermally curable composition which contains (A) a polyoxyalkylene polymer that has a hydrolyzable silyl group represented by general formula (1) -Si(R1)3-a(X)a (wherein each R1 independently represents a hydrocarbon group having from ...  
WO/2021/260557A1
The present invention relates to an epoxy adhesive composition, comprising: a) 10-50 parts by weight of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a combination of a bisphenol A epoxy resin and a bisphenol F epoxy resin, wh...  
WO/2021/261391A1
The present invention relates to a resin composition which comprises an epoxy resin and an aromatic polysulfone resin including an aminated aromatic polysulfone having an amino group at at least one of the terminals of a polymer backbone...  
WO/2021/261196A1
Provided is a radical curable resin composition comprising, as essential raw materials, a vinylester resin (A), an unsaturated monomer (B) having a flash point of at least 100ºC, a polyisocyanate (C), a polymerization initiator (D), a s...  
WO/2021/261427A1
Provided is an optical module in which a space between a light-emitting part (or a light-receiving part) 11a in an optical element 11 and an insulation layer 1 in an electric circuit board E is filled with a cured product of a light-tran...  
WO/2021/261306A1
This resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group having 6 or more carbon atoms and/or...  
WO/2021/253771A1
Disclosed are a low-smoke density high-performance halogen-containing flame-retardant reinforced PBT composite and a preparation method therefor. The low-smoke density high-performance halogen-containing flame-retardant reinforced PBT co...  
WO/2021/253580A1
Disclosed is a radiation cooling thin film. The thin film is formed by mixing ceramic particles, an organic solution and a curing agent with an organic curing precursor solution and then curing same. A micro-nano photon structure array i...  
WO/2021/251357A1
The present invention addresses the problem of providing a composition that makes it possible to form a magnetic-particle-containing film having excellent magnetic isotropic properties and that has excellent stability over time. The pres...  
WO/2021/251454A1
A heat-conductive sheet according to the present invention includes a resin layer composed of a resin composition that contains a thermosetting resin, a specific curing agent, and an inorganic filler.  
WO/2021/245650A1
A photopolymer composition comprising at least one cycloaliphatic epoxy compound and a photoinitiator comprising a triarylsulfonium salt.  
WO/2021/247419A1
Provided herein is a curable liquid stereolithography resin comprising (a) a divinylarene dioxide, such as for example a divinylbenene dioxide (DVBDO); (b) a free radically curable component, such as for example a (meth)acrylate componen...  
WO/2021/241541A1
A resin composition, a molded body of which is an electromagnetic wave absorber, the resin composition being such that an imaginary part (ε") of the complex dielectric constant at 25°C and 10 GHz and the volume resistivity (ρv) at 25...  
WO/2021/241734A1
The present invention addresses the problem of providing an epoxy resin composition which has an extremely low viscosity and excellent impregnation properties, is resistant to an increase in viscosity at an injection temperature, is stab...  

Matches 701 - 750 out of 34,008