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WO/2022/239648A1 |
[Problem] To provide an optical film that excels in initial adhesiveness with respect to both a water-based adhesive and a UV-curable adhesive, and also excels in durable adhesiveness with respect to long-term use in high temperature, hi...
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WO/2022/239955A1 |
The present invention relates to a flame-retardant curing agent for an epoxy, and more specifically, to a flame-retardant curing agent composition for an epoxy and a flame-retardant curing agent that is for an epoxy and comprises same, w...
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WO/2022/239203A1 |
This insulating varnish composition comprises: a thermosetting resin (15) which contains at least one resin that is selected from among an epoxy resin, a vinyl ester resin, and an unsaturated polyester resin that contains a high molecula...
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WO/2022/240037A1 |
The present invention relates to an epoxy resin composition, and a semiconductor element encapsulated using same.
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WO/2022/234776A1 |
Provided is a phenolic resin which is a reaction product of a catechol compound with an ortho-xylylene-skeleton-containing compound, the phenolic resin being characterized by having a catechol skeleton derived from the catechol compound ...
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WO/2022/230768A1 |
Provided is an epoxy resin curable composition that cures quickly and has a high hardness and excellent color tone after curing. This epoxy resin curable composition, which contains an epoxy resin having two or more epoxy groups per mole...
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WO/2022/229760A1 |
In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one ep...
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WO/2022/230767A1 |
Provided is an epoxy resin curable composition that cures quickly and has high hardness and exceptional color tone after curing. Provided is an epoxy resin curable composition containing an epoxy resin having two or more epoxy groups per...
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WO/2022/231172A1 |
The present invention relates to: a multifunctional epoxy compound obtained by modifying two or more epoxide functional groups on terminal portions of liquid crystal molecules synthesized by bonding multiple thermotropic liquid crystal m...
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WO/2022/230970A1 |
The present disclosure provides a thermally conductive composition that can produce a thermally conductive material having high thermal conductivity, and that has favorable moldability. The thermally conductive composition according to t...
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WO/2022/232548A1 |
Provided herein is an electrically conductive composition capable of sintering. More particularly, the electrically conductive composition comprises sinterable silver particles dispersed in a binder resin, which binder resin is not yet i...
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WO/2022/226386A1 |
A method for forming a structure through three-dimensional (3D) printing, the method comprising applying through a 3D printing apparatus one or more layers of a mortar composition, in which the mortar composition comprises a mortar powde...
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WO/2022/224211A1 |
The present invention relates to a process and system for recycling epoxy thermosets, containing cleavable bonds, said process using an acid solution to dissolve the epoxy thermoset and devolatizing the acid solution from a thermoplastic...
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WO/2022/224309A1 |
This monomer composition is for impregnating pores in a porous molded body. The molded body contains a metal powder and a heat-curable resin composition. The monomer composition contains at least one compound selected from the group cons...
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WO/2022/219426A1 |
Compositions are provided including a free-radically reactive component, a photoradical generator, and either a crosslinker having a photodegradable linkage or a chemical blowing agent, an epoxy component, and a photoacid generator. Poly...
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WO/2022/220276A1 |
One aspect of the present invention relates to an elastic resin sheet formed using a resin composition which includes a thermosetting resin and a curing agent, wherein when the maximum height of a surface roughness on a first surface of ...
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WO/2022/218726A1 |
The present invention relates to a multi-component epoxy resin material, comprising: an epoxy resin component (A) comprising at least one hardenable epoxy resin, and a hardener component (B) comprising a hardening agent for the epoxy res...
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WO/2022/215521A1 |
The present invention provides a two-part curable resin composition that does not use a dibutyltin catalyst, has exceptional storage stability, cures quickly upon mixing, and yields a cured product having high elongation and high strengt...
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WO/2022/215577A1 |
The present invention provides a resin composition for side filling, the resin composition being easily imparted with high UV curability even if partially interposed in a space between a mounting component and a base material of a semico...
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WO/2022/215644A1 |
Provided is a curable resin composition which has excellent coating workability and from which a member having excellent light shielding properties in the visible light region to the near-infrared region. The curable resin composition,...
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WO/2022/215522A1 |
The present invention provides a two-part curable resin composition that, while maintaining the adhesive strength with respect to metals, can provide a cured product having high strength and high elongation. Provided is a two-part cura...
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WO/2022/209415A1 |
Provided is a polycarbonate resin composition that makes it possible to produce a molded article that has an excellent matte finish without diminishing impact resistance, even using a smooth mold. The present invention relates to a matti...
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WO/2022/210261A1 |
The present invention provides a curable resin composition that gives a cured product having reduced surface gloss, and a sealing material that includes the same. The present invention also provides a cured product that is obtained by cu...
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WO/2022/205582A1 |
A thermosetting resin composition having excellent defoaming properties, abrasiveness, insulation reliability, substrate appearance detection efficiency, and heat dissipation properties and a cured product thereof and an electronic compo...
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WO/2022/209239A1 |
A method for producing a sealed structure, the method comprising: a step in which granules or a powder (1) formed of an epoxy resin composition is supplied to an extruder that is provided with a screw (42) and a die (5) which is provided...
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WO/2022/211652A1 |
A cold-curing repair composition based on epoxy resin contains: an epoxy resin or a mixture of an epoxy resin and an epoxy novolac resin, an active diluent, a plasticizer, rheology additives, and a particulate filler comprising a mixture...
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WO/2022/210686A1 |
The present invention provides: a resin composition which has high thermal conductivity, high insulation properties and high heat resistance, while forming a sheet that has excellent handling properties; a cured product sheet; a composit...
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WO/2022/210785A1 |
The present invention provides a composition containing a polymerizable compound, inorganic microparticles, and a photopolymerization initiator, wherein the inorganic microparticle content is 30 vol% or more, and the curing depth is 100 ...
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WO/2022/206509A1 |
Embodiments of the present application provide a thermally-conductive material and a fabrication method therefor, a prepreg, a laminate, and a circuit board, which relate to the technical field of nanomaterials, and are used for providin...
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WO/2022/208165A1 |
A first epoxy resin composition is described that includes [A] at least one epoxy resin, [B] at least two hardeners comprising [B-l] at least a first hardener and [B-2] at least a second hardener different from the first hardener, and [C...
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WO/2022/210384A1 |
This resin composition for encapsulating comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes an epoxy resin having 2-6 epoxy groups per molecule, and the curing agent includes a compound having 2 o...
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WO/2022/210945A1 |
[Problem] To provide a curable resin composition that has good resolution in a resultant dried coating film and exhibits minimal adhesion even if cured products are stacked after heat curing and stored in a high temperature environment. ...
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WO/2022/212199A1 |
A thermoset composition includes an epoxy prepolymer, an amine hardener, a reactive diluent, and an accelerator for crosslinking reactions. A method for making the degradable and recyclable epoxy resin includes mixing an epoxy prepolymer...
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WO/2022/211653A1 |
The invention relates to a method for producing an aqueous epoxy dispersion. The method for producing an aqueous epoxy dispersion includes preparing a suspension of a nanomodifier in an epoxy resin or a mixture of epoxy resin and an orga...
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WO/2022/201985A1 |
The present invention addresses the problem of providing: a modified epoxy resin that has excellent flexibility and adhesiveness, has good reactivity to a curing agent, and is capable of exhibiting characteristics even when combined with...
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WO/2022/203042A1 |
[Problem] To provide an ultraviolet-ray-curable organopolysiloxane composition which contains a silicon atom, can be cured into a product having a small light transmittance in a specified ultraviolet ray wavelength range, and has excelle...
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WO/2022/202427A1 |
[Problem] To provide a thermosetting resin composition capable of easily individualizing chips by a step for individualizing chips one-by-one after batch sealing a plurality of chips using a thermosetting resin composition in production ...
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WO/2022/202792A1 |
A thermosetting resin composition according to the present invention contains (A) an epoxy resin, (B) a curing agent, and (C) a high-permittivity filler, wherein: the high-permittivity filler (C) contains 50 mass% or more calcium titanat...
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WO/2022/202394A1 |
The first problem addressed by the present invention is to provide a composition with which it is possible to form a cured product that is superior in terms of achieving high permeability and low magnetic loss, that has a superior hole f...
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WO/2022/202505A1 |
This electrically conductive resin composition contains (A) silver-containing particles, (B) a (meth)acrylic compound, and (C) at least one polyfunctional epoxy compound selected from compounds represented by general formula (1).
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WO/2022/202939A1 |
[Problem] To provide a curable resin composition that can be suitably used as a paste for coating or filling a printed wiring board having a high degree of wiring formation freedom, the curable resin composition making it possible to obt...
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WO/2022/201979A1 |
This resin composition contains a curable resin. When a cured product of the resin composition is subjected to thermogravimetric analysis from 30°C to 800°C at a heating rate of 90°C/min, the amount of outgas generated from the cured ...
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WO/2022/199134A1 |
The present invention relates to a lightweight organic composite material and a preparation method therefor. Specifically disclosed is an organic composite material based on thermally expandable microspheres. The organic composite materi...
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WO/2022/202886A1 |
The purpose of the present invention is to provide: a resin composition which has a small dielectric constant, a small dielectric loss tangent, high transparency, high solubility and high heat resistance and can be used suitably as a low...
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WO/2022/201890A1 |
The present invention addresses the problem of providing an epoxy resin composition excellent in terms of strength, elastic modulus, elastic modulus in wet-heat environments, and heat resistance after moisture absorption, the epoxy resin...
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WO/2022/202629A1 |
The present invention is a polyester elastomer resin composition that has superior strong acid resistance and thermal aging resistance and is suitable for extrusion molding, said polyester elastomer resin composition including: 50-90 par...
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WO/2022/202894A1 |
Provided are: a resin composition which has a low dielectric constant, a low dielectric loss tangent, high transparency, high solubility and high heat resistance and which can be advantageously used as a low dielectric material; a film f...
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WO/2022/202781A1 |
A thermosetting resin composition according to the present invention comprises: a thermosetting resin, a high dielectric constant filler having a specific dielectric constant at 25ºC and 25 GHz of 10 or higher; and an active ester compo...
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WO/2022/202683A1 |
The present disclosure addresses the problem of providing a thermosetting composition with which it is possible to achieve a long pot life, excellent thermosetting properties, and excellent photocuring properties that enables temporary b...
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WO/2022/202498A1 |
[Problem] To provide a silicon-atom-containing ultraviolet-curable composition which gives cured objects having excellent flexibility and which has excellent applicability to substrates. [Solution] This ultraviolet-curable composition is...
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