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WO/2023/176610A1 |
The curable composition contains an infrared absorbing dye, a compound having an epoxy group, an epoxy curing agent having a phenol group, and a solvent. Also provided are a film, an optical filter, a solid-state imaging element, and an ...
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WO/2023/176396A1 |
This aromatic polycarbonate resin composition contains, relative to 100 parts by weight of (A) an aromatic polycarbonate resin (component A), 0.02-0.04 parts by weight of (B) an epoxy group-containing compound (component B), and 0.06-0.1...
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WO/2023/176934A1 |
The present invention addresses the problem of providing: an epoxy resin composition having excellent viscosity stability and attaining high compression characteristics under wet heat conditions and high fracture toughness; and a fiber-r...
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WO/2023/174788A1 |
The present invention relates to a rubber composition based on at least one diene elastomer, a reinforcing filler, a cross-linking system, and comprising an epoxy resin selected from tri(glycidoxyphenyl)methane, tetra(glycidoxyphenyl)eth...
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WO/2023/176284A1 |
According to the present invention, a resin composition includes (A) a nanocrystal magnetic powder that has a particle diameter of 5.5–20 μm, (B) a magnetic powder that has a particle diameter of no more than 2 μm, and (D) a thermose...
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WO/2023/176820A1 |
Provided are: a resin composition for optical-semiconductor encapsulation which has a black color for heightening the contrast of a display and has adequate light-transmitting properties; and a shaped resin object for optical-semiconduct...
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WO/2023/176935A1 |
[Problem] To provide an epoxy resin composition for resin transfer molding having low viscosity and volatility, a cured resin product of which will have excellent balance among elastic modulus under damp heat conditions, heat resistance ...
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WO/2023/176958A1 |
Provided is a resin composition characterized by containing an epoxy resin, a curing agent, a foaming agent, and a filler, the shape of the filler being a flake shape, a plate shape, a needle shape, a fiber shape, or a branch shape, and ...
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WO/2023/170891A1 |
Provided are: an insulating resin composition which contains a biomass material as a starting material and nevertheless can give cured objects having a better surface touch; a cured object obtained from the insulating resin composition; ...
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WO/2023/171028A1 |
Provided is a resin composition that is used as a capillary underfill (CUF) capable of further reducing filament cracking. Provided is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a filler. A cured pro...
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WO/2023/167513A1 |
The invention relates to an epoxy resin composition derived from a non-sugar alcohol composition and a preparation method therefor, and a curable epoxy resin composition including same and a cured product thereof. More specifically, the ...
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WO/2023/167152A1 |
The present invention provides a block copolymer which comprises a polymer block (B) that is mainly composed of a conjugated diene monomer unit, and a polymer block (A) that is mainly composed of a vinyl aromatic monomer unit and/or a po...
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WO/2023/167198A1 |
Provided is a wrap film having excellent barrier properties without external appearance defects such as white spots. In this wrap film, which is made of a resin composition containing a vinylidene chloride-vinyl chloride copolymer, the...
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WO/2023/167505A1 |
The present invention relates to an epoxy resin composition derived from an anhydrosugar alcohol-alkylene glycol composition and a method for preparing same, and a curable epoxy resin composition comprising same and a cured product there...
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WO/2023/167049A1 |
The present invention addresses the problem of providing an epoxy resin composition that contains a bifunctional epoxy resin, a bifunctional compound, and a polymerization catalyst, that has sufficiently long pre-reaction working life, t...
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WO/2023/166973A1 |
The purpose of the present invention is to provide a curable resin composition that cures rapidly and can reduce the occurrence of bleed. That is, this curable resin composition comprises an epoxy resin, a latent curing agent, and an i...
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WO/2023/167267A1 |
[Problem] To provide a curable resin composition from which a cured product having excellent insulation reliability can be formed and which has a suppressed amount of emission of halogen-containing substances during combustion. [Solution...
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WO/2023/162975A1 |
A sealing resin composition according to the present invention contains an epoxy resin (A) and a curing agent (B) that includes a phenolic curing agent obtained from a plant-derived starting material.
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WO/2023/163113A1 |
This encapsulant for an organic EL display element contains a cationic-polymerizable compound, a cationic polymerization initiator, a UV absorber, and a compound having phenolic hydroxyl groups. The mass ratio of the compound having phen...
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WO/2023/162489A1 |
Provided is a resin composition from which a resin film that can undergo EBR, that has high refractive index, transparency, heat resistance, light resistance, moisture resistance, and chemical resistance, and that has a dry etching rate ...
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WO/2023/162068A1 |
A sheet-type insulating varnish (1) to be arranged in a gap between members to be insulated is obtained by forming a thermosetting resin composition into a sheet shape in an uncured or semi-cured state, the thermosetting resin compositio...
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WO/2023/162785A1 |
The present disclosure addresses the problem of providing a resin composition which is capable of achieving a lower thermal expansion coefficient by suppressing the occurrence of ion migration. A resin composition according to the presen...
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WO/2023/163160A1 |
Provided is an electroconductive resin composition capable of forming a shield layer having exceptional adhesiveness to an object being coated even when exposed to high temperature and having exceptional shielding properties for the surf...
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WO/2023/162928A1 |
Provided is a resin composition that can enhance heat dissipating ability of an obtained cured product and that can enhance the flexibility of the obtained cured product. A resin composition according to the present invention contains ...
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WO/2023/162904A1 |
This solid electrolytic capacitor element comprises: a positive electrode foil having a porous portion on a surface layer thereof, and also including a first portion including a first end and a second portion including a second end oppos...
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WO/2023/162399A1 |
An asphalt composition including asphalt, a polyester resin, and an epoxy-group-containing resin is disclosed. An asphalt pavement material composition including said asphalt composition and an aggregate is also disclosed.
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WO/2023/162511A1 |
A resin composition containing (A) an Fe-Ni-Si alloy magnetic powder and (B) a thermosetting resin, wherein the Si content of the (A) component is 1-8 mass% with respect to 100 mass% of the (A) component.
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WO/2023/162460A1 |
A polycarbonate resin composition characterized by containing, per 100 parts by mass of a polycarbonate resin (A), 0.001-0.3 parts by mass of a specific triaryl phosphate (B) represented by a specific formula (1) and 0.0012-0.12 parts by...
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WO/2023/157905A1 |
The present invention relates to: a film for forming a protective membrane, said film being formed using a resin composition containing (A) a thermoplastic resin, (B) an epoxy resin, (C) an inorganic filler, and (D) a compound containing...
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WO/2023/157817A1 |
The present invention provides: spherical boron nitride particles which enable the achievement of a resin composition that exhibits excellent fluidity; a filler for resins and a resin composition, each of which contains the spherical bor...
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WO/2023/157906A1 |
The present invention relates to: a curable film for forming a protective coating, wherein the ratio of the number of phosphorous atoms to the total number of carbon atoms, nitrogen atoms, oxygen atoms, phosphorous atoms, and silicon ato...
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WO/2023/157542A1 |
Provided is a resin composition capable of giving cured objects which, even in semiconductor chip packages which are, for example, enlarged ones, are inhibited from cracking or causing delamination and from warping. The resin composition...
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WO/2023/157941A1 |
The present invention provides a conductive paste which is capable of forming a cured product that achieves high conductivity and long-term reliability at the same time. The present invention provides a conductive paste which contains, p...
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WO/2023/157907A1 |
The present invention relates to: a curable film for forming a protective coating, wherein the storage modulus E' at all temperatures in the temperature range of 23-150°C is 1 MPa or more, the ratio [E'(80)/E'(130)] of the storage modul...
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WO/2023/156145A1 |
A composition, process, and device are disclosed. The composition includes a polymer formed by reacting an epoxy compound with an amine curing agent. The epoxy compound comprises a Diels-Alder dimer and an ester moiety. The process inclu...
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WO/2023/155221A1 |
Provided is a wave-absorbing material having a composite structure, comprising: a high-frequency rare earth soft magnetic layer adsorbed on a matrix, a FeSiAl layer formed on the high-frequency rare earth soft magnetic layer, and a carbo...
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WO/2023/157893A1 |
The objective of the present invention is to provide a sintered compact composition, wherein an organic binder can be degreased rapidly without requiring special equipment or steps, and cracking and blistering during molding and after si...
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WO/2023/155285A1 |
The present invention provides a reinforced and toughened fiber composite material based on long-short carbon nanotubes and a preparation method therefor. The preparation method comprises: a) mixing short carbon nanotubes, a thermosettin...
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WO/2023/157507A1 |
The present invention addresses the problem of providing: a prepreg having excellent mechanical properties such as strength or elastic modulus, excellent appearance such as low coloring, transparency, or weather resistance, and excellent...
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WO/2023/153387A1 |
This polymerizable composition contains a cation-polymerizable compound, a photocationic polymerization initiator, and a tertiary amine. The blending ratio of the tertiary amine is 60 parts by mass or more with respect to 100 parts by ma...
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WO/2023/153522A1 |
Provided is a chain extending masterbatch for producing a polyester resin molded article, in which the masterbatch has excellent moldability and is capable of increasing the quality of the molded article by a general purpose processing m...
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WO/2023/153435A1 |
Provided is a prepreg in which the toughness and elastic modulus of a cured product thereof are improved. In an embodiment of the prepreg according to the present invention, a matrix resin composition and carbon fibers are contained, the...
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WO/2023/153372A1 |
Provided are: a reinforcing filler which can relatively inexpensively impart flame retardancy using reinforcing fibers; and a method for obtaining the reinforcing filler. The reinforcing filler, when incorporated by kneading into resin...
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WO/2023/149221A1 |
This resin composition for injection molding includes at least one kind of wax (a) having a <80°C melting point.
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WO/2023/149328A1 |
Provided is a two-component thermally conductive resin composition which can be cured at room temperature, and a cured product of which has a sufficient resin stretching ratio. The two-component thermally conductive resin composition com...
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WO/2023/149521A1 |
Provided is a resin composition with which it is possible to obtain a cured product wherein the dielectric loss tangent can be kept low and increases in the melt viscosity can be suppressed. This resin composition contains (A) a silane c...
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WO/2023/149209A1 |
The object of the present invention is to provide a resin composition, etc., from which a cured product having excellent insulation reliability under high temperature and high humidity environments can be obtained, even in the case of a ...
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WO/2023/148996A1 |
Provided are a resin composition that enables fine pattern processing even on a rough-surfaced substrate made of a ceramic or the like, a resin composition film, and a semiconductor device in which these are used. A resin composition con...
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WO/2023/145472A1 |
This resin composition comprises: a curable resin (A); an acrylic monomer copolymer (B) having structures represented by formulas (1) to (3) and having a weight-average molecular weight of at least 10,000 and not more than 900,000; an in...
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WO/2023/145697A1 |
Provided is a chlorine-containing polyether polyol that serves as a material for producing polyurethane having excellent mechanical properties, heat stability, moldability, and flame resistance. The chlorine-containing polyether polyol...
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