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WO/2022/202804A1 |
A thermosetting resin composition of the present invention comprises a thermosetting resin (A) and a high-dielectric constant filler (C). The high-dielectric constant filler (C) includes at least one selected from calcium titanate, stron...
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WO/2022/196696A1 |
The present invention addresses the problem of providing a resin sheet in which unevenness after lamination can be suppressed and warping after curing can be suppressed. The present invention provides a resin sheet which comprises a supp...
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WO/2022/190600A1 |
Provided is an insulating resin composition excelling in embeddability in metal wiring patterns, semiconductor IC, etc., even when highly filled with an inorganic filler. The insulating resin composition comprises an epoxy resin (A), a m...
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WO/2022/190745A1 |
A curable resin composition that contains (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen–containing amine latent curing agent, and (D) an ion scavenger. The (A) cyanate ester resin is preferably one type of compo...
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WO/2022/190647A1 |
A magnetic paste which comprises an epoxy resin (A) having an aromatic ring, an epoxy compound (B), a soft-magnetic powder (C), and a hardener (D), wherein the (A), (B), and (D) components have 25°C viscosities which have relationships ...
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WO/2022/192294A1 |
An epoxy composition containing CNS-derived fragments provides conductivity and surface hardness. In one illustration, the epoxy composition includes carbon nanostructures, fragments of carbon nanostructures, fractured carbon nanotubes, ...
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WO/2022/191238A1 |
Provided is a thermally conductive resin composition which can have improved thermal conductivity while being inhibited from having an increased viscosity. The thermally conductive resin composition comprises a first resin phase, a secon...
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WO/2022/186203A1 |
The present invention provides an epoxy-based composition that has excellent fluidity, low heat generation during curing, cures in a short time at room temperature, and can be used to obtain a cured product having excellent mechanical st...
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WO/2022/186219A1 |
The present invention addresses the problem of providing a resin composition capable of giving cured objects which can have a lower dielectric dissipation factor, can be inhibited from having cracks after desmearing, and have an excellen...
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WO/2022/187580A1 |
Liquid epoxy-based adhesive compositions are provided, which upon curing result in crash durable and stress resistant cured bonds on both steel and other materials in particular metals such as aluminum; and in some embodiments are weldab...
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WO/2022/185832A1 |
The present invention relates to an epoxy resin composition having excellent low-temperature curability and excellent permeability through narrow clearances. This epoxy resin composition contains components (A) through (C). Component (A)...
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WO/2022/186361A1 |
Provided is a curable resin composition containing: an epoxy resin; a curing agent; and a linear polysiloxane compound that has a structural unit having an epoxy group and an alkoxy group, and that also has a polymerization degree of 3 o...
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WO/2022/186603A1 |
The present invention relates to a graft copolymer, and to a core-shell type graft copolymer, a curable resin composition comprising same, and methods for preparing same, the graft copolymer comprising: a core including a rubbery polymer...
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WO/2022/186191A1 |
[Problem] To provide hexagonal boron nitride agglomerated particles and a hexagonal boron nitride powder, each of which can impart extremely high dielectric strength and heat conductivity to a resin composition produced by filling the he...
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WO/2022/185344A1 |
The embodiments herein disclose a system and method for developing a low-cost composite sheet for EMI shielding applications. A composite sheet is developed comprising of a continuous matrix with randomly dispersed conductive particulate...
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WO/2022/186101A1 |
[Problem] To provide a fast-curing epoxy resin composition having a long pot life. [Solution] An epoxy resin composition containing a curing agent A, a curing agent B, a curing agent C, an epoxy resin D, an epoxy resin E, and resin parti...
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WO/2022/187451A1 |
Covalent network polymers that include one or more of a cure rate modifying (CRM) additive, a tack modifying additive, a flame retardant additive, a physical additive, and a viscosity modifying additive allow the viscosity, pot life, tac...
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WO/2022/186316A1 |
The present invention addresses the problem of providing a curable resin composition that achieves both vibration-damping properties and rigidity at high temperature. A curable resin composition according to the present invention contain...
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WO/2022/181387A1 |
Provided are: hollow particles with which the low dielectricity of an electrical material, which is obtained from a resin composition containing the hollow particles, can be achieved; a production method therefor; and a use of said hollo...
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WO/2022/179827A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.% of a) at least one oxetane compound according to Formula (I) wherein: R1 and R2 ar...
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WO/2022/179826A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.%, of a) at least one oxetane compound according to Formula (I) wherein: R1, R2, R3,...
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WO/2022/182342A1 |
An electrochemical oxygen sensor includes a sensing surface having a working electrode and a reference electrode, a hydrophilic layer formed from an oxygen diffusion-limiting layer emulsion overlaying the working electrode and a hydropho...
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WO/2022/178700A1 |
This invention relates to a photocurable adhesive composition comprising at least one first hydroxyl terminated epoxidized unsaturated polyolefin having an epoxide equivalent weight less than 250 g/eq; at least one second hydroxyl termin...
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WO/2022/177283A1 |
The present invention relates to a coating composition, for a metal, with improved oil resistance and adhesiveness and a preparation method therefor, and a metal article coated with the composition and, more specifically, to a compositio...
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WO/2022/177006A1 |
The present invention provides: a resin composition containing an elastomer, an epoxy compound and a thermal polymerization initiator; a cured material of the resin composition; a laminate comprising a substrate film and a transparent re...
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WO/2022/176324A1 |
Provided are an epoxy resin that can increase durability when used together with a rubber material, and a production method for the epoxy resin. The present invention is characterized in that a diene polymer is grafted to the main chai...
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WO/2022/172933A1 |
[Problem] To provide: a liquid composition which is excellent in terms of dispersion stability and handleability, contains a powder of a tetrafluoroethylene-based polymer, and is preferably a resist composition; a method for producing sa...
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WO/2022/169796A1 |
Waterborne dispersions including crosslinkable multistage polymeric particles useful in coating compositions are provided. The multistage particles have a last-formed layer that includes a diketone functionality that is capable of crossl...
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WO/2022/167411A1 |
The present application is directed to a rubber composition comprising at least one liquid epoxy resin, at least one rubber, at least at least one curing agent for epoxy resins, at least one substituted urea and at least one azo compound...
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WO/2022/168815A1 |
[Problem] To provide: a composition for curable resins for obtaining a cured product that is reduced in the molding shrinkage and linear expansion coefficient, while having high heat resistance, the composition for curable resins having ...
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WO/2022/168620A1 |
Provided is a curable composition that can suppress thermal degradation of a tetraazaporphyrin compound so that a lens having high visibility and excellent anti-glare and contrast enhancement effects can be achieved. The curable compos...
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WO/2022/168866A1 |
The present invention provides a thermoplastic polyester resin composition having distinctive resin viscosity characteristics required for extrusion molding, exceptional extrusion stability and extrusion molding properties, and optimal f...
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WO/2022/168694A1 |
The present invention provides an encapsulating resin composition for use in encapsulating a GaAs chip, wherein the die shear strength measured under condition 1 is more than or equal to 1.5 N/mm2. (Condition 1) The sealing resin composi...
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WO/2022/162805A1 |
The present invention provides: an insulating resin composition which improves the surface tactility of a cured object; a cured product of the composition; a rotary machine coil having favorable surface tactility; and a rotary machine us...
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WO/2022/163738A1 |
The present invention provides: organic hollow particles that enable a low electric permittivity, a low dielectric loss tangent, and a low thermal expansion rate with respect to various electronic materials; and a resin composition inclu...
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WO/2022/163555A1 |
The present invention addresses the problem of providing a production method having higher safety and efficiency in a method for producing a target benzoxazine compound that does not create a sudden temperature rise or smoke when introdu...
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WO/2022/163795A1 |
The present invention provides a curable composition comprising: a vinyl group-bound monoepoxy compound represented by formula (1); and a radical polymerization initiator.
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WO/2022/164480A1 |
A thermosetting resin composition including a thermosetting resin, a core-shell polymer, a low-density filler, and a curing agent is provided. The composition includes from 0.5 to 15 wt.% of the core shell polymer with respect to the wei...
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WO/2022/161837A1 |
The present invention relates to the use of boronic acids to increase the storage stability of epoxy resin compositions and to epoxy resin compositions comprising an epoxy resin, a hardener and a boronic acid.
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WO/2022/163609A1 |
[Problem] The present invention addresses the problem of finding: an electrical insulating layer for a metal base substrate used for electronic devices, in particular on-board electronic devices, the electrical insulating layer having a ...
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WO/2022/158385A1 |
[Problem] To provide a resin composition for electrical/electronic encapsulation which has excellent oil resistance and insulating properties, while retaining the intact flowability. [Solution] A resin composition comprising a polyester ...
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WO/2022/158384A1 |
[Problem] To provide a resin composition for an electrical/electronic encapsulation, the composition having excellent oil resistance and insulation performance without a reduction in fluidity. [Solution] Provided is a resin composition t...
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WO/2022/158755A1 |
The present invention relates to a primer composition for a glass adhesive, comprising: a first silane polymer comprising an epoxy group and an amino group; a second silane polymer comprising a mercapto group; an epoxy resin; an acrylic ...
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WO/2022/152851A1 |
The present invention relates to a composition, preferably for bonding metal sheets, comprising: a. 1 molar part of at least one linear epoxy resin having an average epoxy equivalent weight of 600 to 5000 g/mol and an epoxy functionality...
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WO/2022/151929A1 |
Disclosed in the present invention is a production method for a large-diameter engineering pipeline. The production method comprises the following steps: (1) preparing a large-diameter engineering pipeline prefabricated body; (2) deformi...
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WO/2022/152942A1 |
The invention relates to epoxy adhesive compositions comprising low glass transition temperature elastomeric core nanoparticles, a process for the preparation thereof, and uses thereof, in particular at a low temperature.
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WO/2022/153807A1 |
The present invention addresses the problem of providing: a curable composition from which it is possible to form a thermally conductive material having excellent thermal conductivity; a thermally conductive material; a thermally conduct...
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WO/2022/151517A1 |
Disclosed are a circuit laminate film for wafer-level packaging and sealing, a preparation method therefor, and an application thereof. The laminate film comprises 40-60 parts by mass of a first-type epoxy resin, 15-30 parts by mass of a...
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WO/2022/147941A1 |
A dialkyl phosphinate preparation method, comprising: using dialkyl phosphinate and a halogenated compound as raw materials, and reacting under the action of a catalyst to obtain dialkyl phosphinate, the catalyst being one or more of a p...
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WO/2022/147942A1 |
A dialkyl phosphonate compound containing an active epoxy group, the preparation and application thereof in serving as a flame-retardant agent and preparing a flame retardant material. The structure is as shown in any one of the followin...
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