| Document |
Document Title |
|
WO/2023/199738A1 |
[Problem] The purpose of the present invention is to provide a composition that achieves an excellent balance between electrical characteristics and adhesive strength. [Solution] Provided is a composition which contains a cyclic ether co...
|
|
WO/2023/198722A1 |
The present invention relates to a composition comprising a multistage polymer, a (meth)acrylic polymer and a monomer or prepolymer, its process of preparation and its use. In particular the present invention relates to a process for pre...
|
|
WO/2023/199924A1 |
The present disclosure relates to an electroconductive paste containing components (A) through (C). Component (A) is an epoxy resin, component (B) is a latent curing agent, and component (C) is a plate-like crystalline metal powder havin...
|
|
WO/2023/199925A1 |
According to the present disclosure, provided is an electrically conductive resin composition which exhibits excellent storage stability and yields a cured product having low connection resistance. The present disclosure relates to an el...
|
|
WO/2023/199865A1 |
The present invention provides: a flame retardant composition which has excellent flame retardancy and water resistance; a flame-retardant resin composition; a molded article; and a molded body of the same. The present invention provid...
|
|
WO/2023/199803A1 |
Provided are: a liquid composition including a thermosetting resin, first silica particles, second silica particles, and a solvent, wherein the first silica particles have a median size d50 of 1.5 to 20.0 μm, with the product of the med...
|
|
WO/2023/195992A1 |
The invention pertains generally to a composition which comprises: at least one two-part epoxy resin; Part A of the epoxy resin comprising at least one polyepoxide; and Part B of the epoxy resin comprising at least one amine hardener; at...
|
|
WO/2023/190135A1 |
The present invention provides a stress reducing agent (i) which has excellent dispersibility in a matrix resin, and (ii) which enables the achievement of a cured product that has a good linear expansion coefficient. The above is achieve...
|
|
WO/2023/188943A1 |
Disclosed are: a thermoplastic resin composition which is for agricultural materials, which contains starch, biodegradable resins, and a viscosity modifier, and in which the contained amount of a plasticizing agent is 0-5 parts by mass w...
|
|
WO/2023/190810A1 |
The present invention relates to a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine...
|
|
WO/2023/189030A1 |
The present invention provides a thermosetting resin composition which is capable of suppressing the generation of a void space between a sheet and an adherend that has a roughened surface even if pressing is performed with a low pressur...
|
|
WO/2023/188401A1 |
This resin composition for molding comprises a curable resin and an inorganic filler, wherein the inorganic filler includes calcium titanate particles and at least either of silica particles or alumina particles; the content ratio of the...
|
|
WO/2023/188952A1 |
The present invention provides: a thermally conductive rubber composition that makes it possible to obtain a cured product that has a low coefficient of thermal expansion, excellent heat resistance, and favorable tackiness; a heat-dissip...
|
|
WO/2023/191109A1 |
A two-component curable composition comprising: liquid A that contains a thermal-conductive filler, a reactive diluent, and an epoxy compound that has two epoxy groups and has, between the two epoxy groups, at least one selected from the...
|
|
WO/2023/189150A1 |
Provided is a method for producing an automobile structural body, by which it is possible to suppress appearance defects in the automobile structural body. Also provided is a curable composition which is suitably used in the production o...
|
|
WO/2023/189298A1 |
Provided is a resin composition that has exceptional heat resistance and enables bonding of a copper foil and a glass substrate using a lamination method. This resin composition contains: two or more polymers selected from the group cons...
|
|
WO/2023/184202A1 |
The present disclosure provides latent amine compositions which are used as a curing agent for flame resistant epoxy systems, the amine-epoxy resin compositions, and the cured products from amine-epoxy composition.
|
|
WO/2023/190221A1 |
Provided is a thermosetting resin composition capable of reducing the dielectric loss tangent while having high permittivity. A thermosetting resin composition containing (A) an epoxy compound, (B) a compound having a maleimide group, ...
|
|
WO/2023/190571A1 |
Provided is a conductive composition that can form a cured product having excellent conductive properties and adhesion to an adherend even at a lower curing temperature than is conventional. A conductive composition according to the pres...
|
|
WO/2023/189297A1 |
The present invention provides a resin composition which enables the bonding of a copper foil and a glass substrate by a lamination method, while having excellent dimensional stability. This resin composition contains a polyimide resin t...
|
|
WO/2023/189325A1 |
The first problem to be addressed by the present invention is to provide a composition which is capable of forming a magnetic material that has excellent magnetic permeability and excellent moisture resistance. The second problem to be a...
|
|
WO/2023/188297A1 |
A photosensitive resin film containing (A) a compound having an ethylenic unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, (D) an inorganic filler, and (E) a fluorine-containing resin, wherein the (D) in...
|
|
WO/2023/189609A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
|
|
WO/2023/184762A1 |
Disclosed are a degradable composite material, a fan blade, and a method for preparing same. The degradable composite material of the present invention comprises, in percentages by mass, 30-40% of a degradable epoxy resin composition, 45...
|
|
WO/2023/187507A1 |
The present invention provides a curable composition, a curable adhesive film, and an adhesive tape. Specifically, the curable composition comprises, based on the total weight thereof as 100 wt%: 15-50 wt% of an ethylene-vinyl acetate co...
|
|
WO/2023/190419A1 |
The present invention provides a resin composition for molding, the resin composition containing a curable resin, and an inorganic filler that contains silica particles and/or alumina particles, and calcium titanate particles. The conten...
|
|
WO/2023/190466A1 |
The present invention addresses the problem of providing a novel impact modifier for a polyacetal resin, capable of providing a polyacetal resin composition having low VOC emission. The modifier for a polyacetal resin contains a rubber-c...
|
|
WO/2023/189610A1 |
A resin composition containing a thermosetting resin, an inorganic filler, a copolymer, and an inorganic ion scavenger, wherein the copolymer has a (meth)acrylic monomer unit A having an anionic group, a (meth)acrylic monomer unit B havi...
|
|
WO/2023/190191A1 |
This epoxy resin composition comprises an epoxy resin, a styrene-based viscosity adjuster, polyisobutylene and a compatibilizer. The compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived stru...
|
|
WO/2023/190309A1 |
A surface-modifier resin composition which is for use in a process comprising a step in which the surface-modifier resin composition is adhered to a surface of a structure including a first region, which is made of a cured epoxy resin co...
|
|
WO/2023/189996A1 |
This resin composition for molding is for collectively sealing: a substrate equipped with an electronic component; a stator core which is fixed onto the substrate and which has a plurality of slots formed in the circumferential direction...
|
|
WO/2023/190456A1 |
Provided is a cured product that has a surface onto which a marking ink can be easily applied, exhibits excellent adhesiveness with the marking ink after curing, and can form a marker having excellent visibility of characters and symbols...
|
|
WO/2023/182495A1 |
[Problem] To provide a curable resin composition for black light shielding for an inkjet, the curable resin composition having excellent surface curability in addition to high light-shielding properties, exhibiting stable adhesion under ...
|
|
WO/2023/181831A1 |
The present invention addresses the problem of providing a low-temperature-curable resin composition and an adhesive which are able to be inhibited from suffering bleeding. Provided is a resin composition comprising (A) an epoxy compou...
|
|
WO/2023/182141A1 |
Provided is a glycidyl amine-type fluorine-containing epoxy compound. The present disclosure relates to a fluorine-containing epoxy compound represented by general formula (1). In general formula (1), n each independently represents an i...
|
|
WO/2023/179260A1 |
Disclosed in the present invention are a natural plant fiber/water-borne epoxy resin composite material and a manufacturing method therefor. The main components of the composite material are natural plant fibers, a water-borne epoxy resi...
|
|
WO/2023/183272A1 |
Provided herein is a two-component thermally-conductive epoxy adhesive.
|
|
WO/2023/182485A1 |
This resin composition for encapsulation is used to produce a single-sided-encapsulation-type structure by single-sided encapsulation of a mother board on which at least one electronic device is mounted. This resin composition for encaps...
|
|
WO/2023/182492A1 |
The present invention provides a curable composition which can form cured objects having both a low degree of thermal expansion and a low modulus. The present invention relates to a curable composition comprising (A) an epoxy compound ...
|
|
WO/2023/181953A1 |
A resin film is formed using a resin composition containing a carboxyl group-containing resin, a corrosion inhibitor having a solubility parameter (SP value) ranging from 17.0 (MPa)1/2 to 25.5 (MPa)1/2 inclusive, and a crosslinking agent.
|
|
WO/2023/182470A1 |
This thermosetting resin composition contains a thermosetting resin, an inorganic filler and a polymer having a mass average molecular weight of 10,000 or more, and is characterized in that aggregated boron nitride particles are containe...
|
|
WO/2023/180631A1 |
There is provided a method for producing an epoxy resin comprising mixing modified tall oil pitch with at least one epoxidized vegetable oil. Additionally, is provided an epoxy resin comprising modified tall oil pitch cross-linked with a...
|
|
WO/2023/181964A1 |
The present invention provides a styrene resin molded body which contains a syndiotactic polystyrene resin, and has heat resistance, flame retardancy and a low transmission loss. The present invention provides a styrene resin molded bo...
|
|
WO/2023/182085A1 |
The present disclosure addresses the problem of providing: a resin composition for sealing that can be used in order to produce a sealing part, the sealing part being capable of having high adhesion with a metal and a semiconductor eleme...
|
|
WO/2023/182627A1 |
The present invention relates to an energy-saving thermal barrier coating composition which dissipates internal heat and reflects external solar energy, thereby lowering the inner temperature of a coated body.
|
|
WO/2023/176397A1 |
Provided is a polycarbonate resin composition characterized by being obtained by blending, with respect to 100 parts by weight of (A) a polycarbonate resin (component A), 0.005-0.07 parts by weight of (B) an epoxy group-containing compou...
|
|
WO/2023/176680A1 |
A composition containing a cationic polymerizable component and an antioxidant, wherein the cationic polymerizable component contains at least one selected from alicyclic epoxy compounds, aliphatic epoxy compounds, aromatic epoxy compoun...
|
|
WO/2023/176703A1 |
The present invention provides a compound which is represented by formula (1). In the formula, R1 represents a hydrogen atom or a methyl group; each of R2 to R5 independently represents a hydrogen atom, an alkyl group having 1 to 10 carb...
|
|
WO/2023/176314A1 |
Provided are: an epoxy resin composition for interlayer insulation, which has excellent adhesion heat resistance and is capable of maintaining good voltage resistance at a high level; a resin sheet for interlayer insulation; a laminate f...
|
|
WO/2023/176768A1 |
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide comp...
|
