Document |
Document Title |
WO/2022/108331A1 |
The present invention relates to an isocyanate prepolymer composition using an anhydrosugar alcohol-alkylene glycol composition and uses thereof and, more specifically, to: an isocyanate prepolymer composition which is eco-friendly, whic...
|
WO/2022/107730A1 |
The present invention relates to a composition for electromagnetic shields, said composition being characterized by containing (A) silver particles, (B) a resin and (C) an alkoxysilane compound, and being also characterized in that the c...
|
WO/2022/102629A1 |
The present invention provides a prepreg and an epoxy resin composition, which are capable of reducing the burning time of a molded article. A prepreg according to the present invention is obtained by impregnating a carbon fiber base mat...
|
WO/2022/100752A1 |
The present invention provides a photocurable composition, a binder and a preparation method therefor, and a bonding method for a substrate. The photocurable composition comprises a monomer, a cationic photoinitiator, a photosensitive re...
|
WO/2022/102489A1 |
The present invention relates to: a resin composition containing a paratertiary butylphenol novolac resin (A) and a phenol resin (B) having a dicyclopentadiene skeleton; a cured article of the resin composition; a semiconductor encapsula...
|
WO/2022/102467A1 |
The purpose of the present invention is to provide: a thermosetting epoxy resin composition which achieves a good balance between a pot life and fast curing properties at low temperatures; and a molded article which is obtained by thermo...
|
WO/2022/102757A1 |
The present invention addresses the problem of providing a resin composition such that the minimum melt viscosity can be further reduced, the relative dielectric constant (Dk) and the dielectric loss factor (Df) are low, the glass transi...
|
WO/2022/102697A1 |
A resin composition for semiconductor encapsulation, according to the present invention, comprises: an epoxy resin; a phenol resin curing agent; a curing accelerator; and an alumina powder, wherein an α-dose of a cured product of the re...
|
WO/2022/100743A1 |
A photocurable composition, a coating and a preparation method therefor, a carbon fiber prepreg and a preparation method therefor, and a fiber composite. The photocurable composition comprises a monomer, a cationic photoinitiator and a p...
|
WO/2022/103004A1 |
The present invention relates to an organic-inorganic hybrid liquid insulating material having high heat resistance while retaining substrate adhesion and chemical resistance of an epoxy resin, and to a method of preparing same, the meth...
|
WO/2022/097493A1 |
Provided are: a molding material containing a reinforcing fiber bundle (A) and a polyphenylene sulfide (B), wherein the melting point of said polyphenylene sulfide is 270 °C or less; and a molded article containing a reinforcing fiber a...
|
WO/2022/095076A1 |
A plastic valve having a heat-resistant protective shell and a preparation method therefor. The plastic valve having a heat-resistant protective shell comprises a plastic valve body (1), wherein a protective shell (2), which is formed by...
|
WO/2022/097598A1 |
The present invention addresses the problem of providing a benzoxazine compound-containing composition having a low melt viscosity, a curable resin composition, and a cured product thereof. As a solution, provided is a benzoxazine compou...
|
WO/2022/095286A1 |
The present invention relates to the technical field of polymer materials, and in particular to an epoxy resin-based polymer material, a preparation method therefor and the use thereof. A coordination group in the epoxy resin-based polym...
|
WO/2022/092323A1 |
Provided is a liquid composition which contains a resin and an inorganic filler, wherein the inorganic filler contains zeolite having a particle diameter of 1.0 μm to 10 μm inclusive, and an inorganic filler having a particle diameter ...
|
WO/2022/093365A1 |
Provided herein is a one-component adhesive composition showing excellent adhesive strength after heat and humidity exposure.
|
WO/2022/091732A1 |
The present invention provides an aqueous epoxy resin composition which contains (A) an epoxy resin, (B) a polyester resin that has a sulfonate group, (C) an aromatic nonionic surfactant, and an aqueous medium, and which is characterized...
|
WO/2022/088247A1 |
A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient...
|
WO/2022/088239A1 |
Provided are a maleimide-modified active ester, a preparation method therefor and the use thereof. Raw materials for preparing the active ester comprise: a diphenol compound having the structure as shown in formula A1, a diacyl compound ...
|
WO/2022/089460A1 |
The present invention provides a reactive fluorosilicone resin, a preparation method therefor and an application thereof. The reactive fluorosilicone resin is used as an additive, such that an added material has a low dielectric constant...
|
WO/2022/088219A1 |
A 4D-printed electrically responsive folding/unfolding composite material, a fabricating method therefor, and a shape memory behavior regulating method thereof. In a layer-by-layer printing process, an electrically conductive layer is em...
|
WO/2022/090821A1 |
A method of making a coated abrasive article includes disposing a precursor make layer on a major surface of the backing, optionally partially curing the precursor make layer to provide a partially cured precursor make layer, disposing a...
|
WO/2022/089459A1 |
Disclosed are a reactive phosphorus-silicon synergistic flame retardant, a polymeric phosphorus-silicon synergistic flame retardant, preparation methods therefor and applications thereof. The reactive phosphorus-silicon synergistic flame...
|
WO/2022/088248A1 |
Provided are a magnetic dielectric resin composition and an application thereof, the magnetic dielectric resin composition comprising resin and a magnetic filler, the magnetic filler being a composition of a positive temperature drift co...
|
WO/2022/089468A1 |
A polymeric flame retardant, a preparation method therefor and the use thereof. The polymeric flame retardant has excellent compatibility with an added polymer system and has excellent flame retardancy. The preparation process thereof is...
|
WO/2022/088597A1 |
Disclosed are a low-smoke high-toughness halogen-free flame-retardant PBT/PTT composite, a preparation method therefor and the use thereof. The low-smoke high-toughness halogen-free flame-retardant PBT/PTT composite comprises the followi...
|
WO/2022/085522A1 |
Provided is a liquid resin composition which retains low-warpage characteristics and is excellent in terms of heat resistance, chemical resistance, and the property of wetting heat-resistant insulating coats. The liquid resin composition...
|
WO/2022/085517A1 |
The purpose of the present invention is to provide a boron nitride material that is suitable as an insulation material that can be applied to a high-frequency circuit board. The present invention relates to a boron nitride material hav...
|
WO/2022/085563A1 |
A resin composition comprising a polyester-polyurethane resin (A) and an epoxy resin (B), in which an isocyante component constituting the polyester-polyurethane resin (A) comprises an isocynate compound that has a hydrocarbon group havi...
|
WO/2022/085270A1 |
Provided is a rubber composition containing: 100 parts by mass of a chloroprene polymer; more than 0 part by mass and 25 parts by mass or less of a diene polymer having an epoxy group; 0.2 to 2.5 parts by mass of at least one selected fr...
|
WO/2022/083134A1 |
A rock-like similar material and a preparation method therefor. The preparation method comprises: acquiring an aggregate composition of a target rock and a volume ratio of an aggregate cement; mixing, stirring and curing a corresponding ...
|
WO/2022/085763A1 |
Provided is a resin composition that is used as a laser-transmitting resin member during laser welding and that is capable of laser marking. Also provided are a molded article using the aforementioned resin composition, use of a resin co...
|
WO/2022/085532A1 |
Provided are: an encapsulation resin composition that enables a reduction in the elastic modulus of a cured article and makes it less likely for there to be an increase in viscosity during molding; and an electronic device. This encapsul...
|
WO/2022/084601A1 |
The invention relates to a reinforced product comprising at least one metal reinforcing element embedded in a rubber composition including at least one epoxidized diene elastomer, a reinforcing filler, and a crosslinking system containin...
|
WO/2022/085593A1 |
The present invention provides a thermoplastic polyester elastomer resin composition that is suitable for foam molded bodies that have excellent light-weightedness, rebound resilience, and surface smoothness. A thermoplastic polyester el...
|
WO/2022/080129A1 |
A cooling system component for vehicles, said cooling system component being capable of coming into contact with a fluid that contains water. This cooling system component for vehicles is obtained by injection molding a resin composition...
|
WO/2022/080078A1 |
The present invention provides a curable composition giving thermally conductive materials excellent in terms of thermal conductivity and heat resistance, a thermally conductive material, a thermally conductive sheet, and a device with a...
|
WO/2022/075191A1 |
This resin molding material contains (A) soft magnetic particles, (B) a fine silica powder that has an average particle diameter of from 0.1 μm to 2.0 μm, and (C) a thermosetting resin. The content of the soft magnetic particles (A) is...
|
WO/2022/075186A1 |
The resin molding material of the present invention is used in transfer molding or compression molding, contains (A) soft magnetic particles, (B) a silicone compound that is liquid at normal temperature (25°C), and (C) a thermosetting r...
|
WO/2022/073314A1 |
Disclosed in the present invention are a durable super-hydrophobic composite coating and a preparation method therefor. An ACNTB-SiO2-coupling agent suspension is applied, in parts by weight, onto the surface of a gel of a mixture of an ...
|
WO/2022/075213A1 |
A two-part curing composition set which is equipped with: a first agent which contains an epoxy-modified organopolysiloxane A1 having an epoxy group-containing group and also contains a thermally conductive filler B1; and a second agent ...
|
WO/2022/075214A1 |
A two-part curable composition set that comprises a first agent and a second agent, the first agent including an epoxy-modified organopolysiloxane formed by replacing a portion of the methyl groups of dimethyl silicone with a substituent...
|
WO/2022/074945A1 |
Provided is a metal particle-containing resin composition which exhibits excellent electrical conductivity, heat-dissipating properties and adhesion to a smooth surface such as a glass substrate. This metal particle-containing resin co...
|
WO/2022/075221A1 |
Provided is a resin composition containing a polyphenylene ether derivative (A) and a fluorine resin filler (B). Also provided are a metal foil with a resin, a prepreg, a layered board, a multilayered printed circuit board, and a semicon...
|
WO/2022/075453A1 |
A curable resin composition comprising a curable resin and a compound represented by general formula (A). In general formula (A), R11 to R16 each independently represent a hydrogen atom, -CH2OH, or -CH2OR17, R17 representing an alkyl gro...
|
WO/2022/069947A1 |
A self-healing resin composition of a polymer formed from the reaction between a thermoplastic polymer having terminal functional groups and a benzoxazine compound is provided. Also provided is a method of forming such a self-healing res...
|
WO/2022/070718A1 |
The present invention provides surface-modified boron nitride particles: that have excellent effects in improving the thermal conductivity of a thermally conductive material to be formed; and that can be used to manufacture a thermally c...
|
WO/2022/071406A1 |
Provided is a latex that has low environmental impact, has excellent polymer microparticle dispersibility, enables efficient recovery of polymer microparticles from latex, and is useful in novel technologies. Specifically, the present in...
|
WO/2022/071645A1 |
The present invention provides a sizing composition and glass fibers using same, the sizing composition enhancing tensile strength, impact resistance and flexural strength of thermoplastic composite material.
|
WO/2022/069532A1 |
The present application is directed to pumpable thermally foaming filler compositions based on combinations of a liquid epoxy resin and a polyvinyl chloride resin and/or an acrylic resin powder and at least one alkali metal salt of a fat...
|