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Title:
RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/055959
Kind Code:
A1
Abstract:
Provided in embodiments of the present application is a resin composition, the resin composition comprising epoxy resin, a curing agent and an inorganic filler, wherein the cut-off particle size of the inorganic filler is 3 μm, and the inorganic filler has a D10 of 0.1 μm-0.4 μm, a D50 of 0.5 μm-1.1 μm and a D90 of 1.3 μm-2.9 μm. The resin composition has low viscosity and high fluidity and thus has a good narrow-gap-filling capability. Further provided in embodiments of the present application is the use of the resin composition.

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Inventors:
ZENG ZHIXIONG (CN)
LIU CHENGJIE (CN)
YUAN CAN (CN)
JIN SONG (CN)
BAO XUSHENG (CN)
ZHOU HUIHUI (CN)
Application Number:
PCT/CN2023/118230
Publication Date:
March 21, 2024
Filing Date:
September 12, 2023
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C09J163/00; C08L63/00; C09J11/04; H01L23/29
Foreign References:
CN113563836A2021-10-29
CN106633631A2017-05-10
CN101864147A2010-10-20
CN113201204A2021-08-03
KR20050068685A2005-07-05
JPH11335443A1999-12-07
KR20060076563A2006-07-04
KR20070072098A2007-07-04
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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