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Patent Searching and Data


Title:
TWO COMPONENT CURABLE RESIN COMPOSITION FOR HYDROGEN GAS SEALING, AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2024/057920
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a two component curable resin composition by which can be obtained a cured product that excels in hydrogen gas barrier properties and exhibits high stretchability and high strength. The present invention provides a two component curable resin composition which comprises agent A and agent B mentioned blow, and for which the cured product of the same has a sea-island structure. Agent A is a composition containing an epoxy resin as component (a) and a catalyst as component (b), and agent B is a composition containing, as a component (c), an organic polymer having two or more hydrolyzable silyl groups per molecule, and an epoxy resin curing agent as component (d).

Inventors:
SOGA TETSUNORI (JP)
NAGAHORI TOMOMI (JP)
KASAMA YUMA (JP)
Application Number:
PCT/JP2023/031283
Publication Date:
March 21, 2024
Filing Date:
August 29, 2023
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09K3/10; C08L63/00; C08L101/10; C08G59/18
Domestic Patent References:
WO2002100951A12002-12-19
Foreign References:
JP2010248307A2010-11-04
JP2007099806A2007-04-19
JP2012001657A2012-01-05
JP2005255864A2005-09-22
Attorney, Agent or Firm:
IBC (JP)
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