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WO/2024/095997A1 |
This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the pol...
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WO/2024/053390A1 |
The present invention provides: a polishing agent which is capable of polishing a surface to be polished, the surface containing a resin, highly flat at a high rate; an additive solution for polishing agents; and a polishing method. Th...
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WO/2024/049642A1 |
The present disclosure is directed towards polishing modules for performing chemical mechanical polishing of a substrate. The substrate may be a semiconductor substrate. The polishing modules described have a plurality of pads, such as p...
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WO/2024/044023A1 |
The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad The pad surface cleaning system may be used to spray the polishing surface with a h...
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WO/2024/039407A1 |
Embodiments of the present disclosure provide a multiple disk pad conditioner and methods of using the multiple disk pad conditioner during a chemical mechanical polishing (CMP) process. The multiple disk pad conditioner has a plurality ...
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WO/2024/022756A1 |
2.1. The invention relates to a honing method for processing an inner surface of a borehole in a workpiece using at least one honing operation. A honing tool which can be widened and which is coupled to a spindle shaft of a spindle unit ...
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WO/2024/018735A1 |
A method for dressing a polishing pad is proposed by which the polishing pad can be more evenly dressed even on a rotating platen having a curved surface. The method for dressing a polishing pad 100 comprises pressing the grindstone 12 o...
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WO/2024/019240A1 |
A pad conditioner for dressing the surface of a CMP pad according to an embodiment of the present invention comprises: a substrate; and a plurality of protrusion members provided on the substrate. Each of the protrusion members may inclu...
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WO/2024/003977A1 |
Provided are an electrolytic dressing device and an electrolytic dressing method that are suited for cylindrical grinding of a steel roll. The electrolytic dressing device comprises: a conductive grinding wheel that is used in grinding...
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WO/2023/239421A1 |
A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move ...
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WO/2023/239419A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a conditioner head to hold a conditioner disk in contact with the polishing pad, a motor to generate relative motion between the polishing pad and th...
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WO/2023/239420A1 |
A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a...
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WO/2023/219783A1 |
Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process. The polishing pad includes a base layer, comprising a first material composition, and a polishing layer disposed o...
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WO/2023/208450A1 |
Herein is disclosed a method of dressing a grinding wheel, the method comprising providing a dressing roller and a grinding wheel, wherein the dressing roller comprises a hub and a plurality of polycrystalline diamond (PCD) segments moun...
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WO/2023/199545A1 |
Provided is a cutting device comprising a table for cutting, a cutting mechanism, a table for dressing, a housing mechanism, and a transport mechanism. The table for cutting holds an object to be cut. The cutting mechanism uses a blade t...
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WO/2023/190008A1 |
This rotary dresser comprises a superabrasive particle layer in which superabrasive particles are bound in a single layer to a base metal by means of a plating layer, the superabrasive particles comprising first superabrasive particles h...
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WO/2023/189165A1 |
An information processing device (5) comprises: an information acquisition unit (500) that acquires operating status information including top ring status information, polishing table status information, polishing fluid supply nozzle sta...
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WO/2023/182779A1 |
A device for manufacturing a CMP conditioning disk may comprise: a diamond jig that provides a jig pocket in which a diamond can be seated; a suction unit that selectively provides the jig pocket with a suction force; and a moving unit f...
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WO/2023/180248A1 |
The invention relates to a device for transporting an object to a grinding machine and/or away from a grinding machine, with said device comprising: a base; a support arranged on the base, which can be rotated about a first axis of rotat...
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WO/2023/181651A1 |
The present invention relates to a coupling device for coupling a rotating body such as such as a polishing head and dresser to a rotating shaft. The present invention further relates to a device for attaching and detaching the rotating ...
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WO/2023/131075A1 |
Disclosed in the present invention is a polishing pad finishing apparatus, comprising: a connecting arm that horizontally extends; a finishing head unit, provided at one end of the connecting arm and used for finishing a polishing pad; a...
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WO/2023/132165A1 |
Provided is a novel dresser capable of imparting high flatness to a polishing pad. A dresser for a surface of a polishing pad is provided, comprising a circular dressing surface having a diameter DCD and facing the pad surface, and pel...
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WO/2023/129567A1 |
. Pad conditioning brushes are described. In particular, pad conditioning brushes including a carrier layer and a plurality of abrasive particle-free brush bristles extending from the carrier layer are described. The carrier layer and th...
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WO/2023/126760A1 |
Pad conditioning disks are described. In particular, pad conditioning disks includes discrete abrasive elements and a circumferential compressible layer are described. When uncompressed, the maximum height of the circumferential compress...
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WO/2023/126761A1 |
A conditioning disk with microfeatures is described. More specifically, a conditioning disk with at least one discrete abrasive element and at least one microfeature. The asymmetry of the at least one microstructure may enable, based on ...
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WO/2023/105633A1 |
[Problem] To appropriately perform setting of a dressing timing that has repeatability, effectively using experience and knowledge of a skilled expert regarding dressing timings for grinding wheels. [Solution] The problem is addressed by...
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WO/2023/062866A1 |
This cutting device is configured to cut an object to be cut, with a blade. The cutting device comprises an imaging unit, and a control unit. The imaging unit is configured to move relatively to a dressing board, and image some region of...
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WO/2023/055663A1 |
A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing pla...
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WO/2023/055649A1 |
A CMP pad conditioner assembly includes a backing plate including a first face including a plurality of first mounting locations and a second face including a plurality of second mounting locations. A plurality of segments is secured to ...
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WO/2023/034874A1 |
Examples are disclosed that relate to planarizing substrates without use of an abrasive. One example provides a method of chemically planarizing a substrate, the method comprising introducing an abrasive-free planarization solution onto ...
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WO/2023/009116A1 |
Embodiments herein include high throughput density chemical mechanical polishing (CMP) modules and customizable modular CMP systems formed thereof. In one embodiment, a polishing module features a carrier support module, a carrier loadin...
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WO/2023/003947A1 |
A tool such as a wafer handler or wafer chuck can include a surface having at least one protrusion. A diamond coating is formed from diamond grains sized so that 90% of the grains are between 200 and 300 nanometers, with the diamond coat...
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WO/2023/287507A1 |
Embodiments provided herein include a system and method for cleaning a first surface of a substrate using a brush carousel assembly. In one embodiment, the brush carousel assembly includes one or more rotatable brush mounting assemblies ...
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WO/2023/281660A1 |
This dressing device is provided with: a dressing mechanism capable of performing dressing on the grinding groove of a grindstone having a spirally continuous grinding groove; and a control unit for controlling the operation of the dress...
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WO/2022/271492A1 |
Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein, In particular, embodiments herein relate to a CMP polishing method including urging a ...
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WO/2022/270175A1 |
A rotatable disc-like grinding stone 5 comprises a convex grinding portion 5b in the outer peripheral portion thereof. The cross-sectional shape of the convex grinding portion 5b passing through a rotational axis 6 of the grinding stone ...
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WO/2022/256059A1 |
The present disclosure describes an apparatus for chemical-mechanical polishing of a semiconductor wafer. Some embodiments of the present disclosure include a pad, a slurry introduction mechanism, a wafer carrier (e.g., carrying a wafer ...
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WO/2022/256175A1 |
In one embodiment, a method is provided for polishing a substrate, The method generally includes receiving a plurality of dwell times of a pad conditioning disk, wherein the plurality of dwell times are to be used in a pad conditioning p...
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WO/2022/256157A1 |
A method and apparatus for determining a polishing pad thickness profile are described herein. A set of displacement sensors, including an arm displacement sensor and one or more conditioning disk displacement sensors are utilized to det...
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WO/2022/241982A1 |
A trimming head rotating component, a polishing pad trimming head (201), and a trimmer (301). An inner ring lower gland (7) is provided in a cavity formed between a transmission film (6) and a grinding base (10), and a universal transmis...
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WO/2022/235592A1 |
A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head, a motor to generate relative motion between the platen and the carrier head, a steam generator including a vessel having a water inlet a...
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WO/2022/201701A1 |
The present invention simplifies the device configuration of a processing device having a blade replacement mechanism and reduces the footprint of the processing device, the present invention being provided with cutting tables 2A, 2B on ...
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WO/2022/192344A1 |
A polishing apparatus (31; 301) is provided. Another aspect pertains to a self-leveling polishing apparatus for smoothing diamonds (33). Yet another aspect of the present system uses a ball and swivel joint (107; 109) in a diamond polish...
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WO/2022/181098A1 |
The present technology relates to an information processing device that makes it possible to more easily determine timing for maintenance, using event data. The information processing device comprises a state estimation unit that estimat...
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WO/2022/181019A1 |
The present invention provides an apparatus for double-side polishing of a semiconductor wafer using a polishing cloth and a polishing slurry, said double-side polishing apparatus being characterized in that: a dressing apparatus to whic...
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WO/2022/158284A1 |
The present invention relates to a surface texture measurement device for a polishing pad that is used for polishing a substrate such as a semiconductor wafer, a surface texture measurement method for a polishing pad, and a surface textu...
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WO/2022/132310A1 |
A horizontal pre-clean module includes a chamber including a basin and a lid which collectively define a processing area, a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including a substrate receivin...
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WO/2022/128630A1 |
In a method for machining workpieces in a tooth-grinding machine having a grinding tool (320) which has ceramically bonded abrasive particles consisting of a superabrasive material, the grinding tool is first dressed. Then, the dressed g...
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WO/2022/130696A1 |
The silicon wafer polishing method according to the present invention comprises performing, as a final polishing step, a prior stage polishing step and a subsequent finishing polishing step. In the final polishing step, the finishing pol...
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WO/2022/128631A1 |
The invention relates to a receiving flange (101) having a fixed flange (110) which is designed to receive a tool body (130). A flange receiving area (111) is formed on the fixed flange (110) in order to connect to a spindle shaft. A cou...
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