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WO/2008/149864A1 |
A polishing method capable of reducing any concave defects of glass substrate for use in, for example, a reflective mask for EUVL. There is disclosed a method of polishing a glass substrate through polishing of the major surface of the g...
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WO/2008/109530A1 |
Disclosed are a computer numerically controlled machine and methods for forming, grinding, or dressing cutting tools in a computer numerically controlled machine. In some embodiments, the computer numerically controlled machine is provid...
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WO/2008/106677A1 |
Disclosed are a machine with a grinding wheel (202) and a dressing surface (200B) and related method. The dressing surface is movable in at least two axes of translation relative to the grinding wheel. The rotational speed of the grindin...
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WO/2008/101263A1 |
The invention relates to a dressing tool for the surface treatment of grinding tools, the tool having a base body, which comprises one or more dressing surfaces, which are at least partially equipped with superhard cutting materials, suc...
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WO/2008/076199A2 |
A method of reducing a degree of compression of a CMP pad during conditioning of the CMP pad comprises engaging the CMP pad with at least one superhard cutting element, the cutting element including a cutting face, the cutting face being...
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WO/2008/071122A1 |
A grinding method of a spiral groove using a profiled grinding wheel includes the following steps: firstly, the groove curve in the normal section namely on the plane perpendicular to the spiral curve is used as a generatrix to process a...
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WO/2008/062846A1 |
The invention provides a dressing stone not necessitating any coating layer. A dressing stone holding plural abrasive grains on the surface, wherein the abrasive grains are held by a glass-ceramic composite (1) consisting substantially o...
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WO/2008/040106A1 |
Centerless grinder, where the dressing slides (1) are mounted rigidly on the machine base (2) and not on top of the wheel headstocks, and the wheel headstocks (5) are moved through axes (6) and (7), without the need of moving the dresser...
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WO/2008/040105A1 |
Creation of hyperbolic profile through software to dress the regulating wheel of centerless grinders, in which the ideal hyperbolic profile is obtained through a software that analyses three variables (α, d and DR) and transforms into s...
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WO/2008/038583A1 |
[PROBLEMS] To provide a CMP conditioner having excellent corrosion resistance around abrasive grains. [MEANS FOR SOLVING PROBLEMS] A grindstone base having, formed on one side, an abrasive grain layer comprising a metallic bonding phase ...
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WO/2008/036892A1 |
Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particles and bond configurations. For instance, abrasive partic...
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WO/2008/001970A1 |
An apparatus and method for conditioning a polishing pad of a chemical mechanical polishing apparatus are provided. The apparatus includes: an arm drive motor disposed in a rotating spindle and periodically changing a rotational directio...
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WO/2008/001835A1 |
A method of controlling a processing apparatus capable of processing workpieces, such as grind stones, into a variety of shapes. The processing apparatus has an X-axis movement mechanism (9) capable of moving a tool (8) relative to a wor...
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WO/2007/131869A1 |
The invention relates to a grinding machine in which the axis control command for the axis drive unit allocated to the axis is not calculated offline, and therefore beforehand outside of the grinding machine, as is common with the presen...
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WO/2007/118288A1 |
A functional fluid composition, characterized in that the composition comprises a phased aqueous emulsion of an polyacrylamide co-polymer, one or more corrosion inhibitors and biocides, and a metal passivator. A functional fluid composit...
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WO/2007/110979A1 |
A device for ELID honing has a honing tool (10) positioned above work (1) that has a hollow circular cylindrical inner surface and is vertically movable and rotatingly drivable about the vertical rotating axis while being rockably suspen...
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WO/2007/096973A1 |
A dresser feeding device has an air supply source for supplying air; a dresser feeding air pipe connected at the base end to the air supply source; a dresser tank for holding dresser; a dresser feeding pipe for connection from the dresse...
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WO/2007/082556A1 |
The present invention relates to a method and apparatus for conditioning a polishing pad used in chemical mechanical polishing in which a consistent pressing force can be provided between an abrasive conditioning member (12) and the poli...
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WO/2007/079646A1 |
A gear form-grinding method using a grinding wheel comprises the following steps: manufacturing a special diamond dresser for the grinding wheel according to the module and the diameter of the workpiece; installing the special diamond dr...
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WO/2007/077964A1 |
A truing device for a grinding wheel having a rotatively supported correction truing tool and correcting the grinding wheel rotating with the correction tool. The correction tool includes a peripheral surface truer of which rotating peri...
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WO/2007/072879A1 |
A wheel truing device for use in a cylindrical grinding machine comprising a rotary drive section fixed to a headstock or a member integrated with it, and a wheel truing tool supported on and rotary-driven by the rotary drive section and...
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WO/2007/069629A1 |
A method of processing the chamfered portion of a semiconductor wafer, which is the method of fine-grinding the chamfered portion roughly ground of a semiconductor wafer by helical-grinding with the wafer and a second grindstone relative...
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WO/2007/069318A1 |
[PROBLEMS] To reduce working man-hours and increase machining accuracy of machining a workpiece. [MEANS FOR SOLVING THE PROBLEMS] This neck part grinding device (1) comprises a grinding unit (20) having a disk-like grinding wheel (W) and...
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WO/2007/054125A1 |
A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser a...
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WO/2007/045267A1 |
A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a...
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WO/2007/043263A1 |
A truing member capable of truing an abrasive pad composed by sticking a plurality of sheets of small abrasive pad efficiently and effectively, and a truing method of an abrasive pad. The truing member has a rectangular base place, and a...
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WO/2007/034646A1 |
A dresser for polishing cloth that suppresses any detachment of abrasive grains through not only stabilization of the melting temperature of brazing filler metal but also uniformization/stabilization of the state of abrasive grains braze...
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WO/2007/032519A1 |
A polishing method can bring a polishing surface to the optimum condition for polishing, without using a dummy wafer or the like, before resuming polishing, thereby eliminating the cost of dummy wafer or the like. The polishing method co...
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WO/2007/023949A1 |
An efficiently processible polishing tool, particularly used for a CMP pad conditioner, capable solving problems in a fixing strength for fixing abrasive grains to a base plate and problems in nonuniform polished surface and a method of ...
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WO/2007/015486A1 |
Detection and transmission of an ultrasonic signal with high S/N ratio is realized without requiring any component produced with high machining precision and without requiring the components to be assembled with high precision. A dresser...
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WO/2007/015909A1 |
Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive article in the presence of the condition...
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WO/2007/015911A1 |
Provided is a fixed abrasive article for polishing a workpiece having a hardness comprising (a) a substrate having a first surface and a second surface, (b) a region of abrasive composites distributed on the first surface of the substrat...
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WO/2007/008822A2 |
A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alig...
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WO/2007/000831A1 |
A diamond rotary dresser for gears, comprising base metals (105, 205), diamond layers (123, 223) formed in tapered shapes at their tip parts and fixed with diamond particles (102, 202) and nickel plated layers (103, 203), and joining lay...
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WO/2006/132725A1 |
Embodiments of a conditioning element (208) for conditioning a processing pad are provided herein. In one embodiment, a conditioning element (208) for conditioning a processing pad includes a body having a face. A plurality of diamond pa...
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WO/2006/129328A1 |
A tool (10) for reconditioning gear grinding wheels. The tool (10) is characterized by having a master (11) having a first number of teeth (14); and a wafer (12) having a second number of teeth (15). The wafer (12) is fixed to the master...
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WO/2006/127054A1 |
A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a condition...
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WO/2006/124637A1 |
An ultrasonic CMP polishing pad analyzer is disclosed. The analyzer provides a manufacturer or other user an ability to inspect a CMP polishing pad without removing the pad from the CMP machine by creating and displaying a topographical ...
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WO/2006/106790A1 |
In a step prior to starting a series of polishing steps of continuously polishing a plurality of polishing objects (semiconductor wafers (W)) by a polishing tool (10), a target shape of a polishing pad (13) is inputted, dressing of the p...
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WO/2006/098150A1 |
A polishing head (1) is provided with a reverse bowl shaped head main body (2). The head main body holds a carrier (3), a guide ring (4) and a dress ring (5), is rotatable and has a space section (8) formed inside. At a lower end section...
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WO/2006/039457A1 |
CMP pad dressers with increased pad dressing work loads on centrally located abrasive particles (310) during dressing of a CMP pad, and methods associated therewith are disclosed and described. The increase in work loads on centrally loc...
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WO/2006/032622A1 |
The present invention refers to a multi-station rotary machine for polishing wafers, comprising a machine body (1) and a rotating tower (2) consisting of a plurality of heads (3) each of which supports a wafer (4). Said tower (2) made to...
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WO/2006/019062A1 |
V-groove (14) is engraved in the direction of rotation in high-load site (13) of high diamond grain abrasion of a circumferential part of disk-shaped base body (11). A multiplicity of octahedral diamond grains (15) at crystal orientation...
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WO/2006/019839A1 |
A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad (20) is rotated and a wafer (18) to be polished is placed on the rotating polishing pad. The polishing pad (20) has grooves that ...
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WO/2006/006843A1 |
The invention relates to a belt cleaning system for a portage belt sander (1) which is provided with a drivable sanding belt (4), comprising a cleaning element (6), a support surface (7) for supporting the cleaning element (6), and displ...
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WO/2005/117084A1 |
The present invention generally relates to methods for processing materials. More particularly, the present invention relates to reactive fluids and uses thereof for removing deposition materials, including, but not limited to, overburde...
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WO/2005/105373A1 |
The present invention relates to a diamond tool of a polishing apparatus, which prevents an object from partially wearing by bringing an entire surface of the diamond tool into contact with the object at a constant pressure and causes a ...
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WO/2005/095055A1 |
A wafer planarization process with a conditioning tool (14) having an electrical insulator that electrically insulates the abrasive surface of the conditioning tool (14). The electrical insulator extends the useful life of the abrasive s...
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WO/2005/095056A1 |
[PROBLEMS] To prevent generation of scratches due to dropping of abrasive grains by stably and firmly fixing the grains, in a CMP conditioner whereupon the abrasive grains are firmly fixed on a protruding part on a base material upper pl...
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WO/2005/095059A1 |
A pad conditioner having an abrasive disk (12) and an undulating disk (10) and methods for using the same. The undulating disk (10) has at least one raised portion (26) and at least one recessed portion (28). The abrasive disk (12) is re...
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