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WO/2005/090648A2 |
An electrolytic processing apparatus can maintain a difference in electric resistance between a recessed portion and a raised portion in the surface of a workpiece, thereby providing a processed surface with improved flatness. The electr...
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WO/2005/080046A1 |
A centerless grinder has a stress structure including a machine bench, a template blade (5) mount for supporting the work-piece (W) and a regulating wheel (C) both mounted on a first carriage longitudinally movable by a first linear axis...
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WO/2005/077598A1 |
A detection signal corresponding to a change of the status of an object to be observed can be easily transmitted to a desired location without any complicate installation and adjustment for use. An AE sensor (21) is disposed at an approp...
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WO/2005/077600A1 |
A double end face truing device, wherein first and second cylindrical base bodies are axially projectedly formed on both side faces of the disk-like base of a double end face truing tool, and first and second abrasive grain layers to whi...
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WO/2005/072910A1 |
A main sensor (15) measures the distance Lm to the surface of a pad (2a), and a sub-sensor (16) measures the distance Ls to the surface of a reference block (12). The actually used measurement is the value (Lm+Ls). The reference block (1...
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WO/2005/072338A2 |
An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slu...
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WO/2005/061177A1 |
Embodiments of a processing pad assembly for processing a substrate are provided. The processing pad assembly includes an upper layer having a processing surface and an electrode having a top side coupled to the upper layer and a bottom ...
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WO/2005/051596A1 |
A grinding machine comprises a base, a wheelhead (10) with grinding wheel (12) and wheel drive mounted thereon, a workholder (22,23,36) and drive means for rotating a workpiece mounted therein about at least one axis (24), workholder dri...
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WO/2005/046935A1 |
Provided are materials and methods for the chemical mechanical planarization of material layers using a down force of less than about 2.5 psi while maintaining a material removal rate generally similar to that obtained using higher down ...
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WO/2005/046891A1 |
An apparatus (10) for cleaning the buffing face of a power driven buffing pad while mounted on a buffing machine includes separate cleaning devices (40, 43) adapting the apparatus to clean both rotary driven pads and orbitally driven pad...
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WO/2005/046933A1 |
A self-cleaning process, in which an elastic abrasive body (231) itself is cleaned by pressing the elastic abrasive body (231) against a pressed part (221) to deform the elastic abrasive body (231) while the elastic abrasive body (231) i...
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WO/2005/035174A1 |
Various types of diamond tools are provided by utilizing the fact that a synthetic single crystal diamond for use in a tool having a nitrogen content of 3 ppm or less exhibits an enhanced hardness in (100) face <111> direction and simult...
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WO/2005/032766A1 |
A dressing method capable of dressing the grinding stone of a vertical duplex-head surface grinding machine without incorporating a special dressing device therein. The vertical duplex-head surface grinding machine comprises a pair of up...
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WO/2005/024287A2 |
A mechanical element including: a workpiece including a first working surface for contacting a liquid, the working surface having at least one liquid repelling zone (124), the liquid repelling zone for interacting with a liquid, wherein ...
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WO/2005/016596A1 |
An apparatus including a fixed abrasive article (410) interposed between a substrate (456) and a support assembly (400). The support assembly (400) creates regions of high and low erosion force at the interface between the substrate and ...
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WO/2005/012592A2 |
The present invention relates to a composite material and the method of making same, which comprises a CVD diamond coating applied to a composite substrate of ceramic material and an unreacted carbide-forming material of various configur...
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WO/2005/002794A2 |
The invention provides a cell, a system and an article for processing a substrate in an electrochemical mechanical polishing system. A cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly...
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WO/2005/000523A2 |
A non-glazing dressing wheel (10) suitable for dressing a grinding wheel surface to be used for maintaining a certain tolerance to assure reliability and quality control of ground parts during the grinding operation. The dressing wheel i...
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WO/2004/112091A2 |
method and apparatus (15) for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and a...
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WO/2004/106000A1 |
In a system and a method, according to the present invention, a sensor signal, such as a motor current signal, from a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables (113) in a CMP sy...
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WO/2004/094106A1 |
Conditioning of chemical mechanical planarization (CMP) using conventional diamond-embedded abrasive strips are well suited to condition conventional 'hard' polishing but not soft polishing pads because the diamonds not only remove waste...
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WO/2004/087375A1 |
A polishing (102) pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconducto...
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WO/2004/086477A1 |
Provided are methods of fabricating chemical-mechanical polishing pad conditioners using vitrified compound material and chemical-mechanical polishing pad conditioners fabricated thereby. The methods include preparing a plate made of ins...
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WO/2004/077520A2 |
Polishing pads having a surface morphology that results in a high degree of planarization efficiency when planarizing a wafer surface are disclosed. One conditioned polishing pad is non-porous and has a surface height distribution with a...
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WO/2004/069478A2 |
A grinding machine (1) for grinding a workpiece (40) comprises the following components: a cup wheel (10) having an annular grinding surface (11); a disc-shaped electrode (60), which is positioned in the vicinity of at least a portion of...
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WO/2004/067226A2 |
The invention features a self-contained, portable apparatus for performing precision grinding operations on metal disks of up to, e.g., 54 inches in diameter. The apparatus can be attached to the surface of the disk to be refinished and ...
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WO/2004/062851A1 |
A cutting tool for soft material characterized in that a protrusion (15) having a cutter edge (17) is formed to project upward on the surface (11) of a substrate (10) composed of a hard material, and a retaining part (12) lower than the ...
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WO/2004/062850A1 |
An apparatus for conditioning a polishing pad of a CMP apparatus for making semiconductor wafers is provided which includes a control arm configured to extend at least partially over a polishing pad. The apparatus also includes at least ...
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WO/2004/060609A1 |
Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP mo...
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WO/2004/058451A1 |
A glass substrate for information recording mediums is produced by polishing the surface of a rough glass plate. The polishing of the rough glass plate has two steps, namely a primary polishing step for lapping the surface of the rough g...
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WO/2004/028746A2 |
Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles (20) are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The...
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WO2002053320A9 |
The present invention provides an improved planarization apparatus for chemical mechanical planarization. In an exemplary embodiment, the invention provides an apparatus having a back support (118) operatively coupled to the edge support...
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WO/2004/012904A2 |
A grinding tool (100) and method is provided for shaping an edge of sheet glass. The grinding tool (100) includes an arbor (30) and a wheel (20) being of an unitary construction and including an axis of rotation. The grinding tool has a ...
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WO/2004/007146A1 |
In a polishing apparatus (201), a polishing tool including abrasive and binder for binding the abrasive is pressed to a substrate (W) held by a top ring (21) and polishes the substrate (W). The polishing apparatus (201) comprises a light...
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WO/2004/002681A1 |
The thickness of an abrasive pad (311c) used for polishing a wafer (Wd) is measured by a pad thickness measuring device (319). When the thickness is less than a predetermined value, the abrasive pad (311c) is judged that its life is over...
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WO2003082519B1 |
Pad conditioners (15) and methods of conditioning pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided.
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WO/2003/095145A1 |
A cleaning head (10) for cleaning a polishing surface (42) of a polishing tool (40) comprises a dispensing element (11) for dispensing a cleaning liquid (13) onto the polishing surface (42) and a removing element (21) having a removing p...
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WO/2003/092944A1 |
Highly accurate polishing method and polishing system in which an excess metal film (18) can be removed readily and efficiently at the time of planarizing it (18) by polishing. A substrate (17) on which the metal film (18) is formed and ...
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WO/2003/090964A1 |
A polishing system and a polishing method in which the current density distribution can be kept substantially constant in the wafer plane while suppressing variation in the composition of electrolyte (2), or the like, between a wafer (3)...
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WO/2003/084715A1 |
A conditioning tool (20; 34; 64) is useful for treating the polishing surface of a polishing pad (9): The tool (20; 34; 64) has a base (5; 37) for supporting conditioning materials. The base (5; 37) has an abrasive section (3; 21; 22; 31...
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WO/2003/082524A1 |
Pads and methods of making the pads for applications such as polishing substrates and chemical mechanical planarization of substrates are provided. The pads include a substantially smooth surface for improved performance.
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WO2002060643A9 |
The present invention provides an improved planarization or polishing apparatus for chemical mechanical planarization and other types of polishing such as metal polishing and optical polishing. In an exemplary embodiment, an apparatus fo...
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WO/2003/071592A1 |
A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid wh...
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WO/2003/071593A1 |
A method for polishing wherein an article is polished by the thrust thereof on fixed abrasive grains with sliding, characterized in that it comprises a first step of polishing the article to be polished while feeding a polishing fluid wh...
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WO/2003/059576A1 |
An abrasive grain burying device (22), comprising pads (43) supported on a surface plate through flat surfaces (44) harder than the surface plate, wherein the pads (43) are supported on a support member (41) so that the attitudes thereof...
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WO/2003/058691A1 |
Methods and apparatus for controlling the temperature of a process surface and for conditioning of a process surface are provided. In one example, a temperature controller is described within a CMP system (140). The CMP system has a firs...
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WO/2003/055642A1 |
A method of truing a grinding wheel capable of accurately truing the wheel surface of the grinding wheel in a short time in a grinding device having the conductive grinding wheel, comprising the steps of, when the flat annular grinding w...
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WO/2003/053602A1 |
A cleaning solution for removing copper complex residues from the surface of polishing pads and wafer substrates includes an amine pH-adjusting agent, which can be a unidentate or bidentate amine compound or a quartnary ammonium hydroxid...
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WO/2003/037566A1 |
A method and apparatus for pre-conditioning a polishing pad (12) for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method incl...
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WO2002024410A9 |
A CMP system make repeatable measurements of eccentric forces applied to carriers for wafer or conditioning pucks. Force applied to the carrier may be accurately measured even though such force is eccentrically applied to such carrier. A...
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