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WO/2022/132310A1 |
A horizontal pre-clean module includes a chamber including a basin and a lid which collectively define a processing area, a rotatable vacuum table disposed in the processing area, the rotatable vacuum table including a substrate receivin...
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WO/2022/128630A1 |
In a method for machining workpieces in a tooth-grinding machine having a grinding tool (320) which has ceramically bonded abrasive particles consisting of a superabrasive material, the grinding tool is first dressed. Then, the dressed g...
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WO/2022/130696A1 |
The silicon wafer polishing method according to the present invention comprises performing, as a final polishing step, a prior stage polishing step and a subsequent finishing polishing step. In the final polishing step, the finishing pol...
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WO/2022/128631A1 |
The invention relates to a receiving flange (101) having a fixed flange (110) which is designed to receive a tool body (130). A flange receiving area (111) is formed on the fixed flange (110) in order to connect to a spindle shaft. A cou...
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WO/2022/118871A1 |
The present invention enables setting of a machining origin that does not cause variation in finished dimensions depending on the skill level of workers, further reduces the difference in production efficiency depending on the workers, a...
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WO/2022/101038A1 |
The invention relates to a method for dressing a multi-flight worm grinding wheel (1) for grinding teeth, wherein the worm grinding wheel (1) comprises a plurality of worm flights (2, 3), each of which are dressed by means of a dressing ...
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WO/2022/098527A1 |
A horizontal pre-clean (HPC) module for a chemical mechanical polishing (CMP) processing system is disclosed. The HPC module includes a chamber having a basin and a lid which collectively define a processing area. The module includes a r...
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WO/2022/098469A1 |
The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of ene...
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WO/2022/070607A1 |
The present invention relates to a technology for determining when to replace a polishing pad which is used with a polishing device for polishing workpieces, such as wafers, substrates, and panels. A polishing device (1) comprises: a pol...
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WO/2022/052899A1 |
A method for lubricating diamond wheel (20) grinding with a shock wave cavitation effect based nano-layer (41). After an air pressure regulating valve (9) is opened, nanoparticles (11) are pushed by shock waves generated by an accelerati...
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WO/2022/028871A1 |
The invention relates to a method for dressing a grinding tool (1) by means of a dressing tool (2), wherein the grinding tool (1) has at least one first working portion (3) for a first grinding operation and at least one second working p...
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WO/2022/014175A1 |
[Problem] To provide a dresser for an abrasive cloth in which the amounts of microscratching and metal elution are dramatically reduced over those in the prior art in a CMP step in semiconductor manufacturing. [Solution] A dresser for an...
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WO/2022/009700A1 |
This liquid supply device comprises: a rocking arm that can horizontally rock the upper side of a polishing table; a slurry tube that extends in the longitudinal direction of the rocking arm and discharges slurry onto the polishing table...
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WO/2022/006008A1 |
A chemical mechanical polishing system includes a steam generator with a heating element to apply heat to a vessel to generate steam, an opening to deliver steam onto a polishing pad, a first valve in a fluid line between the opening and...
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WO/2021/263043A1 |
A polishing assembly includes a rotatable platen to support a polishing pad, a polishing liquid delivery arm having an enclosure open at a bottom thereof and one or more ports to deliver a polishing liquid and a cleaning fluid downwardly...
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WO/2021/263202A1 |
A pad conditioner head cleaning tool has a first clamp configured to removably engage a first portion of a sponge against an outer surface of a disk-shaped pad conditioner head at a first location, a second clamp configured to removable ...
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WO/2021/262947A1 |
In a substrate processing system, such as a chemical mechanical system, updated controller configuration data is obtained for a plurality of liquid flow controllers of the substrate processing system. Each of a plurality of liquid flow c...
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WO/2021/193063A1 |
The present invention relates to a cyber-physical system which optimizes a simulation model for chemical-mechanical polishing, on the basis of actual measurement data of chemical-mechanical polishing. The chemical-mechanical polishing sy...
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WO/2021/183252A1 |
Embodiments herein relate to chemically impregnated applicators, which may be used to provide hydrophobic surfaces on CMP system components and related application methods. In one embodiment, a method of forming a hydrophobic coating on ...
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WO/2021/151051A1 |
Material removal systems including milling drum and milling-drumless products, systems, manufactures, and methods for removing material, such as concrete or asphalt, or industrial flowing applications may be augmented with manufactures t...
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WO/2021/117324A1 |
The present invention suppresses an increase in the footprint of a substrate processing device and improves the processing efficiency of a processing unit of the substrate processing device. A dressing unit used for the substrate proce...
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WO/2021/119485A1 |
A cleaning apparatus for a vacuum pedestal and method of cleaning a pedestal used in semiconductor device fabrication are described. The apparatus has a baseplate, a collar attached to the baseplate, a cap disposed on the collar, and a s...
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WO/2021/089904A1 |
A method for controlling operation of an abrading system (500) comprises: - providing an abrading head (300), which comprises an abrading device (200) and a communication unit (MOD1), - providing parameter data (PAR1) associated with the...
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WO/2021/069390A1 |
The invention relates to a method for grinding a workpiece with toothing or a profile, in which, in a single workpiece clamping operation in the grinding machine, the toothing or the profile is pre-machined using a rough-grinding tool in...
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WO/2021/058142A1 |
The invention relates to a dressing tool which has profiled elements (11.1, 11.2, 12.1, 12.2, 12.3, 12.4) which are arranged coaxially with one another and which are each provided with a profile form, which is tapered or the like in its ...
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WO/2020/210311A9 |
A pad conditioner and chemical mechanical planarization (CMP) pad conditioner assembly for a CMP assembly are disclosed. The pad conditioner includes a substrate having a first surface and a second surface opposite the first surface. A p...
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WO/2021/041413A1 |
A chemical mechanical polishing touch-up tool includes a pedestal configured to support a substrate, a plurality of jaws configured to center the substrate on the pedestal, a loading ring to apply pressure to an annular region on a back ...
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WO/2021/003898A1 |
A pulsed discharge edge trimming apparatus for edge grinding grains of a micro-grinding head, comprising a micro-grinding head edge trimming device and a monitoring device. The micro-grinding head edge trimming device comprises, from top...
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WO/2020/255744A1 |
A polishing pad that includes a polishing layer having a polishing surface, the polishing pad being such that: the polishing surface comprises a deep-groove region having a first pattern formed from deep grooves or holes having a depth o...
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WO/2020/256200A1 |
The present invention relates to a device for measuring stock removal and correcting the alignment of a handler supplying a carbide insert product to grinding equipment in order to grind the carbide insert product. More particularly, the...
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WO/2020/256231A1 |
The present invention relates to an apparatus for measuring a grinding amount and correcting the alignment of a handler which supplies a cemented carbide insert product to grinding equipment for grinding the cemented carbide insert produ...
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WO/2020/208967A1 |
The present invention is a two-side polishing method for polishing the two sides of a wafer that is disposed between a polishing pad which is affixed to an upper surface of a lower platen and a polishing pad which is affixed to a lower s...
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WO/2020/193228A1 |
The invention relates to a method for automatic process monitoring in continuous generation grinding of pre-toothed workpieces (23), said method enabling the early detection of grinding disc chips. A plurality of workpieces are machined ...
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WO/2020/183013A2 |
The invention relates to a method for shaping sheets of glass material, characterized in that the shaping is performed using a grinding wheel having several grooves, the shaping being performed by alternating from one groove of said grin...
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WO/2020/179804A1 |
This substrate processing device is provided with a polishing part and a transport part. The polishing part has a first polishing unit and second polishing unit, and a polishing part conveyance mechanism. The first polishing unit has a f...
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WO/2020/152186A1 |
Described is a device for robot-assisted machining of surfaces. As per one exemplary embodiment, the device has the following: a support that can be mounted on a manipulator; a machining unit comprising a tool (for example, a grinding wh...
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WO/2020/114553A1 |
The invention relates to a method for dressing a grinding tool (3) comprising the processes of profiling and sharpening. Both processes are carried out by a single dressing device (1), which has two rotatable tools (4, 5), namely a profi...
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WO/2020/105298A1 |
Provided is a silicon wafer chamfer machining method capable of increasing the number of times a chamfer wheel used for helical chamfer machining is able to machine when a finished wafer slope angle is to be at a low angle. This silicon ...
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WO/2020/078514A1 |
A device (1) for producing a curved lateral surface (3) on a rolling element (2) for a rolling element bearing, comprising a grinding apparatus (4) for grinding the curved lateral surface (3) and at least one retaining apparatus (6) for ...
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WO/2020/073713A1 |
Disclosed is a single-point diamond trimming grinding wheel device based on on-line monitoring of acoustic emission. The device comprises a supporting module, an anti-interference module, a compression cooling module, and an acoustic emi...
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WO/2020/057330A1 |
A polishing and loading/unloading component module, comprising a loading/unloading module and two polishing modules; the loading/unloading module is at the middle, and the two polishing modules are located at two sides thereof, the loadi...
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WO/2020/058216A1 |
The invention relates to a method for dressing a honing tool (9) comprising honing strips (1), wherein at least one honing strip (1) is dressed by means of an electroerosive method. The invention further relates to a machining unit, in p...
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WO/2020/044011A1 |
The present invention relates to a conditioning head which includes a substrate comprising a substrate surface; and at least one raised non-planar abrasive region relative to the substrate surface. The non-planar abrasive region comprise...
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WO/2020/011303A1 |
A dressing roll (1) for dressing an abrasive wheel has a surface (2) which has a profile in the form of a thread (3, 4) and the geometry of which changes along the central axis of the dressing roll (1).
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WO/2020/001670A1 |
The present invention relates to a truing device, comprising a housing and a truing mandrel (1) with a shaft (10) used to mount a circular tool having a concentric opening, in particular a grinding disc (3), and with a first bearing (11)...
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WO/2019/242782A1 |
A micro-scale abrasive grain levelling parameter online precision control method, comprising the steps of: ① clamping an electrode (7) and a diamond grinding wheel (8) etc. to form a discharge circuit, and putting a work station (12) i...
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WO/2019/208712A1 |
The present invention relates to a polishing device provided with a surface property measuring device for measuring a surface property of a polishing pad used to polish a substrate such as a semiconductor wafer, and a polishing system in...
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WO/2019/204215A1 |
An apparatus for in situ reworking, e.g., dressing, of a circumferential contact surface of an abrasive wheel is disclosed. The apparatus comprises a cutting tool configured to engage with the contact surface and remove a surface layer f...
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WO/2019/198503A1 |
This dresser is provided with an attachment component, and a cutting edge component which has a base end portion side inserted into the attachment component, the part inserted into the attachment component being fixed to the attachment c...
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WO/2019/179751A1 |
The invention relates to a truing device (1) for truing a grinding tool (2) having a specified grinding profile (14), wherein the truing device (1) comprises at least one first truing region (3) and a second truing region (4) connected t...
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