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JP7300441B2 |
The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophilic coating, and polishing systems therefrom. The present disclosure provides an abrasive article including a ceramic body having an abrad...
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JP7297385B2 |
To determine whether or not a cutting blade needs to replaced.A cutting device comprises a cutting unit that cuts a work-piece with a cutting blade, which further comprises a management unit that manages the cutting blade. The management...
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JP7296849B2 |
To provide a new technique for preventing degradation of a cutting blade caused by idling operation, occurrence of an abnormality of the cutting blade, and further deterioration in processing quality.A cutting device comprises: a cutting...
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JP2023084189A |
To provide a dressing tool capable of not only dressing the lower surface (ground surface) of a grindstone included in a grinding wheel but also the outside thereof.One of a first dressing part used for dressing the lower surface of a gr...
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JP2023084039A |
To provide a dressing device enabling improvement of flatness of a polishing pad and enabling uniformization of shaving quantity of the polishing pad when dressing.A dressing device 1 is provided, comprising a dresser 3 dressing a polish...
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JP2023083337A |
To provide a grinding stone clogging detection device and the like, that can measure the clogging state of the grinding surface of a grinding stone in real time in a non-contact state with the grinding stone during processing.It comprise...
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JP7290910B2 |
A method for dressing a grinding worm using a dressing roll that engages the grinding worm to profile its helical grinding profile. The abrasive profile of the dressing roll is at least partially tooth-shaped in a radial cross section an...
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JP7288373B2 |
A grinding apparatus according to an embodiment comprises: a table to hold a substrate; a grinding stone driver to be rotatable while holding a grinding stone; and a location adjuster to adjust a relative location between the grinding st...
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JP7287977B2 |
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...
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JP7287761B2 |
A coupling mechanism capable of preventing vibration of a rotating body from occurring due to a lower-bearing friction torque is disclosed. The coupling mechanism includes an upper spherical bearing and a lower spherical bearing disposed...
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JP2023077113A |
To remove undulation from a cutting blade by dressing the cutting blade.A dressing method for a cutting blade, for dressing the cutting blade by means of a cutting device including a holding mechanism, a cutting unit with a rotatably pro...
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JP2023076059A |
To resolve poor conditions of a bottom surface of each abrasive wheel without deteriorating working efficiency in creep feed grinding.A creep feed grinding device includes: a chuck table; a grinding unit which has a spindle and in which ...
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JP7283750B2 |
To provide a facing device capable of improving yield of highly accurate polish of a substrate material to be performed after polish starts until temperatures of surface plates are stable.In a facing device 1 which includes facing member...
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JP7282466B2 |
To provide a dressing member that can maintain high processing efficiency when processing a work using a cutting blade to which abrasive grains are fixed with a binder.A dressing member is used in processing a work including a space open...
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JP7281502B2 |
The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the s...
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JP7275271B2 |
A dressing device for profiling and sharpening a grinding tool includes a rotatable sharpening tool and a rotatable profiling tool axially offset from and settable relative to the rotatable sharpening tool. In one embodiment, the rotatab...
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JP7275288B2 |
An apparatus for the robot-assisted machining of surfaces is described. In accordance with one embodiment, the device comprises the following: a support which can be mounted on a manipulator, a machining device with a tool (e.g. a grindi...
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JP2023067003A |
To provide a grinding processing system that can perform satisfactory grinding processing even if the system cannot obtain an evaluated result unintentionally.When a control device 30 of a grinding processing system 1 can obtain an evalu...
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JP7274278B2 |
To provide a work-piece processing system provided with an exchanger that performs exchange of a processing tool, a nozzle and a work-piece, between a processing machine and a stocker.The work-piece processing system is provided with: a ...
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JP2023064916A |
To provide a truing method for a threaded grinding wheel, which can perform truing for a plurality of types of threaded grinding wheels by using one type of a rotary truer.This truing method for a gear grinding threaded grinding wheel W ...
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JP2023064493A |
To provide a polishing device which can polish a substrate accurately.A polishing device includes: a rotatable polishing table 5; a polishing pad 2 attached to the polishing table 5; a polishing head 7 which presses a polished surface of...
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JP2023064421A |
To provide a dressing board that can be easily managed during storage.By applying a suction force from a chuck table via a through-hole that is open in a central area of a surface of a holding plate, the chuck table holds a dressing plat...
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JP7270373B2 |
A grinding apparatus and a grinding method of a composite substrate including resin, by which loading of a grinding wheel can be suppressed in grinding of a large-sized composite substrate including resin, and with which grinding can be ...
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JP7269074B2 |
The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing syste...
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JP7265848B2 |
Provided is a method for determining an accurate height of a polishing pad even when a dressing load applied to the polishing pad is changed. A method for determining a polishing pad height is provided. The method includes measuring a re...
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JP2023517313A |
Embodiments herein relate to chemical impregnation applicators and related application methods that can be used to provide hydrophobic surfaces to CMP system components. In one embodiment, a method of forming a hydrophobic coating on a s...
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JP7264663B2 |
To provide a grind stone enabling a high-accuracy dicing process of a dicing blade without a running-in processing step after dressing, and to provide a production method for the grind stone.A grind stone in this invention comprises a ha...
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JP7263038B2 |
To provide a grinding stone clogging detection device and the like, that can measure the clogging state of the grinding surface of a grinding stone in real time in a non-contact state with the grinding stone during processing.It comprise...
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JP7262197B2 |
To provide a composition for polishing having high workability and capable of realizing smoothness of a polishing pad surface at an early stage.In polishing a magnetic disk substrate, a composition for polishing that is supplied between ...
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JP2023055160A |
To provide a cooling device of a diamond dresser which can suppress heat degradation and abrasion of a longitudinal diamond without reducing holding force of the longitudinal diamond.A cooling device of a diamond dresser comprises: a dre...
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JP7258443B2 |
A dressing tool, to be used in dressing a plurality of grindstones arrayed in an annular pattern on one surface side of a grinding wheel, includes a dressing section for dressing the plurality of grindstones, a support plate that is loca...
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JP7258719B2 |
To provide a diamond dresser that hardly causes interference of a form-grinding stone with a bond layer and insufficient cooling and also hardly causes breakage and crack of a columnar diamond, in work for dressing the form-grinding ston...
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JP2023050722A |
To provide a dressing method of a superabrasive grinding wheel which can apply sufficient dressing to the superabrasive grinding wheel which performs superabrasive grinding, and a device.In a diamond grinding piece arranged at a tip part...
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JP2023051422A |
To provide a cutting device capable of suppressing collision of a microscope with a workpiece held on a chuck table when implementing dressing of a cutting blade.A cutting device 1 comprises a chuck table 10, a cutting unit 20 and a movi...
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JP2023046123A |
To provide a dressing completion determination device that can conduct dressing completion determination of a grinding wheel at high accuracy, without requiring complicated preparatory work.An integrated intensity value calculation secti...
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JP7249373B2 |
An apparatus of cleaning a polishing pad includes: a first gas nozzle for spraying gas onto the pores of the polishing pad; and a first liquid nozzle for spraying a liquid to the pores of the polishing pad.
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JP7247397B2 |
To improve shape accuracy by preventing abnormal wear and shape variation and improve processing efficiency by preventing clogging, decrease in a service life of a grindstone and exchange of a grindstone, in processing for forming a terr...
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JP7242129B2 |
To provide a cutting device which enables efficient dressing of a cutting blade in a short time.A cutting device 2 cuts a plate-like workpiece 11 and includes: a holding table 12 which has a holding surface 12a for holding the workpiece ...
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JP2023036121A |
To provide a grinding method for a workpiece capable of suppressing to a minimum reduction of productivity with setting of a grinding stone.The present invention relates to a grinding method for a workpiece including: a grinding step of ...
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JP7237136B2 |
A coupling mechanism which enables a rotating body to follow an undulation of a polishing surface without generating flutter or vibration of the rotating body, and can finely control a load on the rotating body on a polishing surface in ...
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JP2023031472A |
To provide a new technique capable of reducing time and labor for removing a sub-table when a holding table is replaced in accordance with a workpiece shape.A holding table mechanism 2 comprises: a first holding table 21 having a first h...
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JP7234317B2 |
To improve a transfer rate and the processability of truing, and to improve the accuracy of a groove formed at a truer.In a truing method for forming a groove of a grinding stone 55 for grinding a chamfer part of a wafer W by using a dis...
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JP7232763B2 |
A pad conditioner includes a carrier, at least one abrasive element, and a spacer. The carrier includes a surface with an exposed region and a plurality of mounting regions. The abrasive element is disposed on the mounting region of the ...
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JP2023025727A |
To reduce a time required for work of replacing a workpiece and a dressing board when dressing is performed on a grinding wheel.A dressing ring having a ring-shaped dressing member for dressing a processing stone is provided. Preferably,...
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JP2023025889A |
To provide a cutting blade shaping method capable of shaping the shape of a cutting blade easily at low cost.The cutting blade shaping method comprises: a shaping preparation step of configuring a state where a tip of a cutting blade 21 ...
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JP7226818B2 |
To provide a dressing tool truing method which can perform highly accurate truing for a dressing gear used for dressing a grinding tool which grinds a tooth surface of a gear as a product, and a dressing tool truing program for performin...
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JP7226286B2 |
The present invention provides a method of reworking a wire saw, which, in cutting a work by a wire saw using a fixed grain wire and resuming the cutting of the work, which has been stopped because of a disorder such as disconnection of ...
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JP7222635B2 |
To provide an ultrasonic washing nozzle, which allows ultrasonic vibration with large amplitude to be propagated to washing water.An ultrasonic water jet device 2, which is a device for jetting water to which ultrasonic vibration is prop...
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JP2023018319A |
To simplify input of information regarding dressing for an operator.A cutting device has: a chuck table for holding a dressing board; and a cutting unit which has a spindle and in which a cutting blade is attached to a tip of the spindle...
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JP2023017278A |
To enable a grinding stone causing blinding to be subjected to dressing, so that a hard wafer can be ground into a predetermined thickness.In a finish grinding step, areas of an annular area to be ground of an outer peripheral part of a ...
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