Title:
DOUBLE-SIDE POLISHING APPARATUS AND POLISHING CLOTH DRESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/181019
Kind Code:
A1
Abstract:
The present invention provides an apparatus for double-side polishing of a semiconductor wafer using a polishing cloth and a polishing slurry, said double-side polishing apparatus being characterized in that: a dressing apparatus to which upper-side and lower-side conditioning heads for dressing the polishing cloth are attached is concomitant with an arm that supplies high-pressure washing water; and the dressing apparatus has a pressure adjustment mechanism that can pressurize each of the upper-side and lower-side conditioning heads with independent pressure. Thereby, it is possible to provide a double-side polishing apparatus capable of dressing the entirety of a polishing cloth with a uniform load weight via dressing using conditioning heads.
More Like This:
| JP3797065 | METHOD FOR PRODUCING WAFER HAVING ONE MIRROR FINISHED SURFACE |
| JP2012171059 | POLISHING DEVICE FOR SUBSTRATE |
| JP2017098350 | WAFER MANUFACTURING METHOD |
Inventors:
SASAKI TAKUYA (JP)
Application Number:
PCT/JP2021/047480
Publication Date:
September 01, 2022
Filing Date:
December 22, 2021
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/08; B24B53/017; H01L21/304
Foreign References:
| JP2017019027A | 2017-01-26 | |||
| JP2010280031A | 2010-12-16 | |||
| JP2020124750A | 2020-08-20 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
Download PDF: