Title:
POLISHING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2024/095997
Kind Code:
A1
Abstract:
This polishing device comprises: a polishing table that supports a polishing pad; a polishing head capable of pressing a substrate onto a polishing surface of the polishing pad; and a processor that estimates a polishing index of the polishing device by inputting state-reflective information reflecting the state of the polishing pad of the polishing device, into a machine learning model that has learned, by machine learning, a correlation between state-reflective information reflecting the state of another polishing pad and the polishing index of the other polishing pad.
Inventors:
SUZUKI YUTA (JP)
TAKAHASHI TARO (JP)
OTAKI HIROFUMI (JP)
TAKAHASHI TARO (JP)
OTAKI HIROFUMI (JP)
Application Number:
PCT/JP2023/039209
Publication Date:
May 10, 2024
Filing Date:
October 31, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/10; B24B37/015; B24B49/10; B24B53/017; B24B53/12; G05B23/02; H01L21/304
Attorney, Agent or Firm:
OHNO Seiji et al. (Marunouchi Kitaguchi Building 21F 6-5, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, JP)
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