| Document |
Document Title |
|
WO/2024/090570A1 |
The present invention provides an Ni-plated steel sheet which comprises a steel sheet and an Fe-Ni diffusion layer that is formed on at least one surface of the steel sheet, wherein: the average crystal grain size in the outermost surfac...
|
|
WO/2024/081584A1 |
A copper electrolyte comprising a copper salt, a source of halide ions, and a reaction product of an amine or sulfur-containing compound with 2,3-epoxy-1-propanol for producing a nanotwinned copper deposit, optionally in combination with...
|
|
WO/2024/078627A1 |
Disclosed in the present invention are an electrolytic copper dissolution-integrated insoluble anode copper plating process optimization method and apparatus. According to the method, two processes of acidic electrolytic copper dissoluti...
|
|
WO/2024/075698A1 |
A composite material obtained by forming, on a material, a composite film comprising a silver layer containing carbon particles, wherein the crystallite size of the silver in the composite film is greater than 40nm and no greater than 70...
|
|
WO/2024/070245A1 |
Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 µm3/µm2 and has a...
|
|
WO/2024/070246A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.
|
|
WO/2024/070248A1 |
Provided is a surface-treated copper foil comprising a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The actual volume Vmc of a core portion of the surface-treated layer is 0.35 to 0.55 μｍ3...
|
|
WO/2024/061290A1 |
Provided in the embodiments of the present application is a leveling agent, comprising a polyamide substance. The polyamide substance comprises a repeating unit represented by formula (I) or a protonated or N-quaternized product of the r...
|
|
WO/2024/062909A1 |
This terminal material comprises, in the following order, a base material which comprises copper or a copper alloy, one or more underlayers which are constituted by one or more element selected from the group consisting of Ni, Co, and Fe...
|
|
WO/2024/053668A1 |
This plated member has a plating film, which contains at least chromium, carbon and oxygen, while having chromium that is precipitated from a trivalent chromium bath as a main component, on the outer surface; the plating film contains 60...
|
|
WO/2024/053640A1 |
A plated member, the outer surface of which has a plating film thereon which contains at least chromium, carbon and oxygen and has chromium which uses a trivalent chromium bath as a main component thereof, wherein: the plating film conta...
|
|
WO/2024/046395A1 |
Embodiments of the present application provide a leveling agent, particularly a polypyridine compound. The polypyridine compound comprises a structural unit as shown in formula (I) or a protonation product of the structural unit as shown...
|
|
WO/2024/046450A1 |
Provided in the present invention is a metal plating composition, comprising a leveling agent, wherein the leveling agent is the compound of formula (I), where R1 is selected from hydrogen, an alkyl and an aralkyl; R2 is selected from an...
|
|
WO/2024/046447A1 |
The present invention provides a metal electroplating composition used for electrolytic copper coating, comprising a chip copper interconnect electroplating additive, the chip copper interconnect electroplating additive being selected fr...
|
|
WO/2024/048039A1 |
The present invention provides a plating solution which enables the achievement of plating with high degree of gloss. The plating solution contains metal ions and a PEI compound (L) which has a polyethyleneimine main backbone, while havi...
|
|
WO/2024/049027A1 |
A surface-treated copper foil, which has an excellent adhesive strength with respect to a resin substrate and is suitable for application to a high frequency foil, is disclosed. The present invention provides the surface-treated copper f...
|
|
WO/2024/046398A1 |
A composition. The composition comprises a metal ion source and a leveling agent as represented by formula (I), i.e., R1-S-(R3-O)m-(R2-O)n-R2-(O-R3)m-S-R1 , wherein each R1 group is independently selected from a substituted or unsubstitu...
|
|
WO/2024/041062A1 |
Provided in the present invention is an electroplating process of a zinc-nickel alloy coating on the surface of a sintered neodymium-iron-boron material. By means of a multilayer electroplating method, bottom zinc is firstly electroplate...
|
|
WO/2024/041968A1 |
The invention relates to a method for controlling the chromium feed in an electrolysis process for producing a chromium layer by means of direct current and use of an anode (44, 144, 244) and a cathode (48, 148, 248), comprising, during ...
|
|
WO/2024/036411A1 |
Disclosed herein are methods for producing a radium or barium target. The methods include providing an organic-aqueous electrolyte bath solution comprising radium or barium ions, exposing a deposition surface of a target substrate to the...
|
|
WO/2024/028570A1 |
The specification describes a method of manufacturing a plating solution comprising a platinum (II) complex, comprising the steps of: (i) preparing an acidic aqueous solution comprising a chloride-free platinum (IV) compound and a source...
|
|
WO/2024/027108A1 |
The present invention relates to an electrode having an integrated composite structure of a matrix and a catalyst layer, and a preparation method therefor. The method comprises the following steps: (1) carrying out impurity removal treat...
|
|
WO/2024/027968A1 |
The invention relates to a process of manufacturing an electrocatalyst for alkaline water electrolysis, the method comprising the steps of: (i) producing an aqueous electrolyte comprising suspended graphene and graphite nanoplatelet stru...
|
|
WO/2024/022979A1 |
The present invention provides an aqueous composition comprising tin ions, optionally alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive of formula L1 (L1) wherein RL1 is, for each group RL1...
|
|
WO/2024/021403A1 |
The present invention relates to a nickel-based alloy composite electrode having a gradient component structure, and a preparation method therefor and a use thereof. The method comprises: placing a nickel matrix in a weak acid solution f...
|
|
WO/2024/016268A1 |
Provided in the present application are a high-entropy alloy electrode and a preparation method therefor, which preparation method comprises: dissolving a soluble metal salt, a complexing agent, an antioxidant and an acidic standard volu...
|
|
WO/2024/018005A1 |
The invention concerns a treated copper foil for use in a secondary battery with a first side and a second side opposite to the first side. The treated copper foil comprises a copper foil with two opposite surfaces and a treatment stack ...
|
|
WO/2024/016330A1 |
The present invention relates to a cyanide-free copper plating grain refiner, which comprises water as well as N-methylpiperazine and 2-methyltetrahydrofuran dissolved in water, where the concentration of the N-methylpiperazine in the cy...
|
|
WO/2024/016070A1 |
Articles including anisotropic electrodeposited layers of fine-grained alloys of Co, Cu, Fe, Ni and/or Zn with minor additions of B, O, P and S that provide high strength, ductility and heat-resistance, are disclosed as well as a process...
|
|
WO/2024/016069A1 |
Articles including electrodeposited layers of fine-grained alloys of Ni, Cu, Co, Fe and Zn with minor additions of B, O, P and S that provide high strength, ductility and thermal stability, are disclosed. The disclosure further relates t...
|
|
WO/2024/008562A1 |
The present invention provides a new use of a polyaminoamide comprising a group of formula N1 [B-A-B'-Z]n[Y-Z]m (N1) in a composition for electrodepositing nanotwinned copper, that is obtainable by reacting a diamine compound comprising ...
|
|
WO/2024/003123A1 |
The disclosure relates to a polymeric article, comprising a thermoplastic polymer composition, wherein the thermoplastic polymer composition includes (i) a copolymer (A) comprising polymeric units derived from a vinyl aromatic monomer, a...
|
|
WO/2024/005307A1 |
A method for manufacturing an electrolytic copper foil, according to one embodiment of the present invention, comprises: a copper melting step of melting, in a melting furnace, a material containing copper (Cu), thereby preparing molten ...
|
|
WO/2023/246889A1 |
Disclosed in the present invention is an acid sulfate electroplating copper combination additive for dense filling of PCB through hole metal. The additive is made up of a bridger, a carrier, a refiner, and a leveler having mass ratios of...
|
|
WO/2023/246676A1 |
Disclosed in the present invention are a low-copper-salt weakly-alkaline electronic copper electroplating liquid and a use thereof. The low-copper-salt weakly-alkaline electronic copper electroplating liquid is composed of deionized wate...
|
|
WO/2023/246176A1 |
The present invention relates to the technical field of metal material surface treatment, and provides a preparation method for a composite film with a self-repairing function, a product, and a use. The method comprises the following ste...
|
|
WO/2023/244075A1 |
The present invention relates to a steel sheet that can be used for automobiles, etc., and relates to a steel sheet that can ensure improved plating characteristics, and a manufacturing method therefor.
|
|
WO/2023/243394A1 |
Provided is a composition containing: (A) a compound represented by general formula (1); (B) a compound represented by general formula (2); and (C) a silver compound. (In the formula, R1 and R2 each independently represent a hydrogen ato...
|
|
WO/2023/241905A1 |
The present invention relates to a method for electroplating a substrate comprising a step of applying a current through an aqueous electroplating bath which comprises the substrate and a diacid of the formula (I) or salts thereof, where...
|
|
WO/2023/239209A1 |
The present invention relates to: a hot-dip plated steel sheet having excellent plating quality; a steel sheet for plating, for manufacturing same; and respective methods for manufacturing same. A steel sheet for hot press forming, accor...
|
|
WO/2023/239211A1 |
The present invention relates to a hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating for producing same, and a method for manufacturing same. A steel sheet for plating according to one aspect of t...
|
|
WO/2023/239208A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating to manufacture same, and methods for manufacturing same. The steel sheet for plating, according t...
|
|
WO/2023/239206A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a plating steel sheet for manufacturing same, and manufacturing methods therefor. A plating steel sheet according to one as...
|
|
WO/2023/239207A1 |
The present invention relates to a hot-dipped steel sheet having excellent plating quality, a plating steel sheet for manufacturing same, and a manufacturing method therefor. A steel sheet for hot press forming, according to one aspect o...
|
|
WO/2023/239212A1 |
The present invention relates to a hot-dip galvanized steel sheet having excellent plating quality, a plating steel sheet for manufacturing same, and a manufacturing method therefor. A plating steel sheet according to an aspect of the pr...
|
|
WO/2023/234770A1 |
The present invention relates to a porous material comprising a porous wall structure defining and separating primary pores that are interconnected across its thickness dimension. The primary pores have a diameter greater than 5 µm and ...
|
|
WO/2023/235616A1 |
The present invention involves the combination of relatively soft conductive material, such as copper, with a low thermal expansion metal alloy, such as Invar, by compositing the low thermal expansion alloy with porous insulation layerin...
|
|
WO/2023/223685A1 |
The present invention addresses the problem of providing a plating film manufacturing method that can provide excellent corrosion resistance to a plated product having a trivalent chromium plating film formed thereon, and that can form a...
|
|
WO/2023/219190A1 |
The present invention relates to a composite release layer for a carrier-attached metal foil and a metal foil comprising same. The present invention provides a composite release layer for a carrier-attached metal foil, the release layer ...
|
|
WO/2023/219264A1 |
A method for manufacturing an electrolytic copper foil, according to one embodiment of the present invention, comprises the steps of: dissolving copper (Cu) and nickel (Ni) in sulfuric acid to prepare an electrolytic solution containing ...
|
