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WO/2023/030591A1 |
The invention relates to a metallic strength member rubberized with a sulfur-crosslinkable, substantially cobalt-free rubberization mixture, wherein the metallic strength member is a steel cord containing one or more filaments, wherein t...
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WO/2023/029908A1 |
The present application discloses a composite copper foil structure, a preparation method therefor, a copper clad laminate, and a printed circuit board. The composite copper foil structure comprises a copper foil core layer and a shell l...
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WO/2023/028090A1 |
Exemplary methods of electroplating may include providing a patterned substrate having at least one opening, where the opening includes one or more sidewalls and a bottom surface. The methods may also include plating a first portion of r...
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WO/2023/015602A1 |
An in-situ synthesis method for a Ni-W-WC composite plating, the method comprising the following steps: immersing a carbon steel substrate to be plated into an electroplating solution for electroplating so as to obtain a Ni-W-C alloy pla...
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WO/2023/014524A1 |
A copper electrolyte comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electrolyte is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. T...
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WO/2023/013987A1 |
The present invention relates to a leveling agent and an electroplating composition including the same, and when a via hole of a glass substrate is plated with the electroplating composition according to the present invention, the inside...
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WO/2023/008958A1 |
The present invention relates to a leveling agent and an electroplating composition comprising same, wherein when a via hole in a substrate is filled with the electroplating composition according to the present invention, the via hole ca...
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WO/2023/008406A1 |
This white trivalent chromium plating bath is characterized by containing a trivalent chromium compound, a complexing agent, a sulfate serving as a conductive salt, a pH buffering agent, and one or more sulfur-containing organic compound...
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WO/2023/004907A1 |
A preparation method for a substrate having a sanding surface. The preparation method comprises: providing a flattening mill, which comprises a first rack and a second rack, wherein the first rack comprises a first working roll and a thi...
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WO/2023/008963A1 |
The present invention relates to a leveling agent and an electroplating composition comprising same. When a via hole of a substrate is filled with the electroplating composition according to the present invention, the via hole can be fil...
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WO/2023/001868A1 |
The present invention relates to a silver electrolyte and to a corresponding method for galvanic deposition of silver on conductive substrates. The silver electrolyte is characterized by specific additives which help to prevent a foaming...
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WO/2023/001829A1 |
The invention relates to a component with a part (1) which is made of steel, said part being at least partly coated with a nickel diffusion layer (10), and the layer thickness of the nickel diffusion layer (10) equals 1 – 500 µm. The ...
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WO/2023/001696A1 |
The invention relates to a composite material having a chromium-containing top layer, comprising an adhesion-promoting layer located on a substrate and a chromium-containing top layer located on the adhesion-promoting layer, wherein: - t...
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WO/2023/285604A1 |
The present invention relates to an electroplating composition comprising one or more sources of a noble metal, such as Cu(l) or Cu(ll), and/or Au(l) or Au(lll), a base and an acid, and the combination of at least two different mercapto ...
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WO/2023/284918A2 |
The present invention relates to methods (100, 200) and devices (1, 1a) for enriching a substrate (2) with an alkali metal (3), in particular lithium, and to the use of a substrate (2) enriched in this way as an electrode in a battery, a...
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WO/2023/281759A1 |
This surface-treated copper foil has a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The surface-treated layer has an Sku of 2.50-4.50 and an Str of 0.20-0.40.
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WO/2023/282513A1 |
The present invention relates to a leveling agent and an electroplating composition comprising same, the leveling agent allowing plating process to be controlled such that, during the formation of circuit patterns, the circuit patterns a...
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WO/2023/281773A1 |
The present invention provides a surface-treated copper foil which comprises a copper foil and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has an Sku of 2.50 to 4.50 an...
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WO/2023/276507A1 |
Provided are a silver-plated material having improved wear resistance compared to the past while maintaining a high hardness, and a method for manufacturing the silver-plated material. The present invention is a method for performing ele...
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WO/2023/272492A1 |
A vapor chamber having high heat absorption properties, comprising a substrate layer. The vapor chamber further comprises a protective layer; the protective layer is adhered and solidified on the outer surface of the substrate layer, is ...
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WO/2022/271390A1 |
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. re...
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WO/2022/267384A1 |
Disclosed in the present application are an Fe-Ni-P alloy electroplating solution, an electro-deposition method for an Fe-Ni-P alloy coating, and the alloy coating, which belong to the technical field of electronic manufacturing. The ele...
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WO/2022/266528A1 |
Coated surfaces and coatings are described. The coated surfaces can include a surface coating comprising an alloy layer. The alloy layer can include molybdenum or tungsten in combination with one or more of nickel, cobalt, chromium, tin,...
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WO/2022/266529A1 |
Processes for producing coated surfaces and coatings are described. The processes can be used to produce a surface coating comprising an alloy layer. The produced alloy layer can include molybdenum or tungsten in combination with one or ...
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WO/2022/266533A1 |
Rods, pipes and internal cavities that include a. coated surface are described. The rod or pipe can include an alloy layer on an external surface, an internal surface or both. The alloy layer can include molybdenum or tungsten and at lea...
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WO/2022/260735A1 |
Techniques including methods and apparatuses for selective measurement and monitoring of halide concentrations in processing solutions for iron triad metals and their alloys are provided. Methods include monitoring of a halide ion, for e...
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WO/2022/258680A1 |
The present invention relates to a method for electrodepositing a dark chromium layer on a substrate, a respective electroplating bath for depositing such a dark chromium layer, and a respective substrate comprising said dark chromium la...
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WO/2022/257749A1 |
Disclosed in the present invention are a pre-coated steel plate for hot forming and a preparation method therefor, and a hot-formed steel member and an application thereof. In the pre-coated steel plate and the preparation method therefo...
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WO/2022/258621A1 |
The present invention relates to a method for adjusting the brightness L* of an electroplated chromium layer, in particular of a dark electroplated chromium layer. The method includes an aqueous trivalent chromium electroplating bath com...
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WO/2022/253114A1 |
The present invention belongs to the technical field of signal transmission, and particularly relates to a method for preparing a bright high-conductivity graphene/copper composite material. In view of the technical problem of bright hig...
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WO/2022/253385A1 |
The invention relates to a method for producing very precisely located broadband absorbers for structured 2D and 3D surfaces. The aim of the present invention is to specify a method for producing very precisely located broadband absorber...
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WO/2022/246598A1 |
Provided in the present disclosure are an electrolyte for a metal nickel coating, and an application thereof. The electrolyte for a metal nickel coating comprises: an aqueous solution of an additive, Ni2+ ions, and borate ions; wherein t...
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WO/2022/243462A1 |
The present invention relates to an electrolyte composition for depositing graphene–doped copper onto semiconductor substrates. This electrolyte has a pH ranging from 7.0 to 11.0 and comprises copper ions at a concentration ranging fro...
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WO/2022/243145A1 |
The present invention relates to an electroplating bath comprising (A) an alkane sulfonic acid or alkanol sulfonic acid; (B) a soluble metal salt of alkane sulfonic acid or alkanol sulfonic acid; and (C) at least one additive selected fr...
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WO/2022/234113A1 |
A method for producing an electrodeposited copper foil with a matte side having a Rz ISO of 0.8 µm or less, the electrodeposited copper foil being continuously formed in an electroforming cell comprising a rotating drum-shaped cathode, ...
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WO/2022/229373A1 |
The present invention refers to an electroplating composition for depositing a chromium or chromium alloy layer on a substrate, said composition comprising (i) trivalent chromium ions, (ii) at least one complexing agent for the trivalent...
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WO/2022/229175A1 |
The invention relates to a device for coating a component or semi-finished product with a chromium layer, the device comprising an undivided deposition cell, in which there is an anode and which is suitable for receiving a cathodically c...
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WO/2022/224901A1 |
Provided is a trivalent chromium plating solution comprising a trivalent chromium compound, a complexing agent, and a conductive salt, and characterized by further comprising a compound represented by general formula (I) (where, in formu...
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WO/2022/219276A1 |
The invention relates to a process for manufacturing a silver-plated copper or copper alloy blank wire having a silver layer thickness of 1.5 μm to 15 μm, the manufacturing process comprising the step of electrolytically depositing sil...
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WO/2022/214027A1 |
The present application relates to a medical device. The medical device comprises a matrix and a first coating coated on the matrix. The matrix contains a metal element X having a content of ≥ 5 wt%; the first coating is at least one o...
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WO/2022/207539A1 |
The relates to a a platinum electrolyte containing certain additives and a method for electrolytically depositing a platinum layer using the claimed electrolyte.
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WO/2022/206923A1 |
The present invention relates to the technical field of materials, and in particular, to a compound dispersant, which is composed of distilled water, a nonionic surfactant, an anionic surfactant, and a wetting agent; the nonionic surfact...
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WO/2022/206926A1 |
The present invention relates to the technical field of materials, and in particular to a composite dispersant, which consists of distilled water, a nonionic surfactant, an anionic surfactant and a wetting agent. The nonionic surfactant ...
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WO/2022/206588A1 |
Disclosed are a method for preparing a welding joint protective coating, and the use thereof. The welding joint protective coating has a double-layer structure having an anodized aluminum layer and an Ni-P plating layer, and is applied t...
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WO/2022/203095A1 |
The present invention relates to a method for effectively removing ferric ions contained in an iron electroplating solution. The method for removing ferric ions contained in a sulfate-based iron electroplating solution comprises a step o...
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WO/2022/200548A1 |
A process for electrochemical deposition of copper, comprising - providing a rolled and annealed copper foil comprising a first surface and a second surface, - etching the first surface of the rolled and annealed copper foil, thereby cre...
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WO/2022/189283A1 |
The invention relates to method for copper-to-copper direct bonding comprising the steps: a) providing a first substrate comprising a first pure copper deposit having a bonding surface; b) providing a second substrate comprising a second...
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WO/2022/189728A1 |
the invention relates to a landing gear (100) characterized in that it comprises at least one static sealing point (40), the static sealing point comprising a seal made of an elastically deformable material held between a portion of a fi...
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WO/2022/184848A1 |
The invention relates to a method for coating a sanitary component (1), comprising at least the following steps: a) providing the sanitary component (1), the sanitary component (1) having at least one liquid channel (2); and b) at least ...
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WO/2022/186183A1 |
An additive for acidic zinc alloy plating bath according to the present invention is used for obtaining acidic zinc alloy plating bath that can provide a zinc alloy plating film having satisfactory appearance, and contains active compone...
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