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Matches 101 - 150 out of 9,846

Document Document Title
WO/2023/126257A1
Therefore the present invention provides a composition for depositing copper on a semiconductor substrate, the composition comprising (a) copper ions; (b) a grain refiner of formula (G1a) or (G1b) or salts thereof (c) a complexing agent;...  
WO/2023/126065A1
The invention relates to a dispersion electrolyte for the electrodeposition of graphite-containing tin, nickel or tin-nickel layers, a method for the electrodeposition of a graphite-containing layer of this kind, a metal substrate which ...  
WO/2023/126259A1
The present invention provides a composition for depositing copper on a semiconductor substrate, the composition comprising (a) copper ions; (b) an additive of formula S1; (c) a complexing agent; and(d) optionally a buffer or base to adj...  
WO/2023/118001A1
The invention relates to an electrodeposited copper foil and its manufacturing method. The copper foil has an as produced tensile strength above 52 kgf/mm2, presents tensile strength above 50 kgf/mm2 after 120 days at 35°C, and presents...  
WO/2023/117127A1
The present invention provides an electrolytic copper foil having improved elongation and electrical conductivity due to an increase in shape deformation of grains selective to a specific direction and an increase in an average grain siz...  
WO/2023/116715A1
The present invention relates to the technical field of high-performance metal materials and advanced electronic interconnection electroplating, and provides a twin crystal copper material and a hybrid bonding structure. The twin crystal...  
WO/2023/116636A1
Disclosed in the present invention are a twinned copper material, a preparation method and a use. The twinned copper material has a preferential (110) crystal plane orientation; the twinned copper material comprises a twinned structure, ...  
WO/2023/118350A1
The invention relates to a high strength steel strip or sheet excellent in ductility and bendability. The invention also relates to a method for producing such steel strip or sheet.  
WO/2023/117128A1
The present invention provides an electrolytic copper foil securing high strength (e.g., tensile strength) characteristics by maintaining an area ratio of fine grains and grain boundaries in the electrolytic copper foil even after high-t...  
WO/2023/120239A1
This composite material is obtained by forming, on a material, a composite film that includes a silver layer containing carbon particles. The crystallite size of silver in the composite film is 30-100 nm, and the Vickers hardness Hv of t...  
WO/2023/117126A1
The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.  
WO/2023/117003A1
A method of regenerating the electrodes of an electrolyser with the electrodes in-situ within the electrolyser is disclosed. The method comprises providing at the electrodes in-situ in the electrolyser a salt solution and reacting the sa...  
WO/2023/120954A1
A method for passivation of an injection-plated article according to an embodiment of the present invention includes the steps of: racking and degreasing the injection-molded article; etching and neutralizing the degreased injection-mold...  
WO/2023/113554A1
A cold rolled steel sheet according to an embodiment of the present invention comprises, by wt%: C: 0.01 to 0.10%; Mn: 0.1 to 0.4%; Al: 0.01 to 0.10%; P: 0.003 to 0.020%; N: 0.001 to 0.006%; S: 0.015% or less; Cr: 0.1 to 0.4%; B: 0.0005 ...  
WO/2023/105368A1
The invention concerns a method of coating optical fiber comprising a process of deposition (102) of a first solution on a surface of a length of optical fiber to coat the surface of optical fiber with a first solution and then a process...  
WO/2023/105747A1
Provided are a nickel plating solution and a method for manufacturing a nickel or nickel alloy plating coating with which it is possible to enhance the efficiency of deposition of SiC microparticles on a nickel or nickel alloy plating co...  
WO/2023/100381A1
The purpose of the present invention is to provide a method for electroplating by using an anode that can be produced relatively easily without requiring any ancillary equipment or anolyte management and without requiring an expensive me...  
WO/2023/095774A1
The present invention solves the difficulty of management for plating with a good appearance while maintaining corrosion resistance of trivalent chromium plating, and the complexity of a plating step. A chromium-plated component and a me...  
WO/2023/093162A1
Disclosed in the present invention is a method for preparing a copper-based negative electrode material by using a waste battery. The method comprises the following steps: (1) disassembling a waste battery and taking out a negative elect...  
WO/2023/090964A1
Provided is a silver plating solution for electroless silver plating comprising a silver-plated complex solution and a reducing agent solution, wherein the silver-plated complex solution is a solution comprising: a carboxylic acid silver...  
WO/2023/088795A1
The present invention provides an aqueous composition comprising tin ions, optionally alloy metal ions, and at least one antioxidant of formula X1a, (X1a) or of formula L1b (X1b) or of formula L1c (X1c) or of formula L1d (X1d) or of form...  
WO/2023/084803A1
The present invention addresses the problem of providing a non-cyanide electrolytic gold plating solution which is capable of improving deposition of gold on the bottom of a via hole. The present invention solves the problem by a non-c...  
WO/2023/082409A1
A copper-based catalyst for electrochemical catalytic carbon dioxide reduction and energy storage driven by new energy electrical energy, which is prepared by copolymerizing copper nanoparticles and a modified polymer. The modified polym...  
WO/2023/082835A1
The present invention belongs to the technical field of coating layers, and specifically discloses a method for controlling the painting shrinkage cavity defect of a tinplate. A layer of surface structure with a good coating property is ...  
WO/2023/080675A1
A method for manufacturing a metal separator for a vehicle fuel cell according to an aspect of the present invention comprises the steps of: preparing a matrix; applying a platinum (Pt)-containing coating agent and an electrolyte to the ...  
WO/2023/079454A1
Steel sheet suitable for a multistep hot stamping process and associated manufacturing process, said steel sheet having a composition comprising, by weight percent: C : 0.13 - 0.4 %, Mn : 0.4 – 4.2 %, Si : 0.1 – 2.5%, Cr ≤ 2 %, Mo ...  
WO/2023/080250A1
This acidic electrolytic copper plating liquid contains: a soluble copper salt; a specific azole compound that is a copper ion electrodeposition inhibitor and that has two or three nitrogen atoms in a five-membered ring; an acid; and wat...  
WO/2023/079234A1
The invention relates to a method for producing hydrogen by electrochemically reforming an alcohol. This method comprises electrolyzing alcohol in an electrolytic cell comprising an anode, an electrolyte and a cathode, and is characteriz...  
WO/2023/075196A1
Disclosed is an electrolytic copper foil for a current collector of a secondary battery. The present invention provides an electrolytic copper foil characterized in that the thickness ratio elongation at room temperature is 1.3 to 2.0 %/...  
WO/2023/074223A1
A copper-plated membrane having coarsened crystals can be obtained by a simple operation, by using a method for coarsening copper crystal grains in an object to be plated, said method being characterized by including: a step (a) in which...  
WO/2023/075195A1
Disclosed are an electrolytic copper foil with high strength and high elongation characteristics and a manufacturing method therefor. The present invention provides an electrolytic copper foil having a tensile strength of 40kgf/mm2 or hi...  
WO/2023/070319A1
Provided in the present application is a copper plating solution for a composite current collector. The copper plating solution contains a leveling agent of general formula (1), wherein the anion X is F-, Cl- or Br-; R1, R2 and R3 are ea...  
WO/2023/075197A1
An electrolytic copper foil for a secondary battery current collector is disclosed. The present invention relates to an electrolytic copper foil having a thickness elongation at room temperature of 1.3-2.0 %/μm and, in the XRD spectrum ...  
WO/2023/061395A1
Disclosed is a tin-electroplated steel plate, comprising a tin-plated steel plate and a passivation film. The tin-plated steel plate comprises a steel substrate and a tin plating; the tin plating covers the surface of the steel substrate...  
WO/2023/057594A1
The present invention relates in particular to a threaded end 1, 2 of a tubular component for drilling and/or exploiting a hydrocarbon well, transporting oil and gas, transporting or storing hydrogen, carbon capture or geothermy, compris...  
WO/2023/057067A1
The present invention is directed to a copper foil having high fracture energy after heat treatment to be strong against breakage, and to an electrode for secondary batteries and a secondary battery exhibiting, by including the copper fo...  
WO/2023/059872A1
A method of acid mist suppression in copper electrowinning is described. In various embodiments, at least one liquid licorice root extract, powdered licorice root extract, or reconstituted licorice extract is added in an amount sufficien...  
WO/2023/051640A1
The present invention relates to the field of semiconductor gold bump preparation. Disclosed are a cyanide-free gold electroplating solution and the use thereof, a method for preparing a gold bump by electroplating, a gold bump, and an e...  
WO/2023/050980A1
The present invention relates to the field of electroplating gold on nickel plating, and disclosed are a plating solution for electroplating gold on nickel plating, a method for electroplating gold on nickel plating, and a gold-plated ar...  
WO/2023/052452A1
The invention relates to a piston ring for internal combustion engines, having a surface, comprising a wear protection layer made of iron or iron alloy applied onto the surface, wherein the wear protection layer has cracks, said cracks h...  
WO/2023/051766A1
A cyanide-free electroplating gold plating solution and an application thereof, wherein the plating solution comprises: a gold source, a conductive salt, a buffer, a stabilizer, an arsenic-containing compound and polyalkylene glycol. A h...  
WO/2023/052254A1
The present invention provides a copper electroplating composition comprising copper ions, an acid, and at least one polyaminoamide comprising a group of formula L1[B-A-B'-Z]n[Y-Z]m (L1)that is obtainable by reacting a diamine compound c...  
WO/2023/046876A1
The present invention refers to a method for determining the height of a foam blanket on an electroplating composition utilizing a radar signal, as well as a respective use.  
WO/2023/045328A1
The present invention relates to a method for purifying an iron-chromium electrolyte, and the iron-chromium electrolyte thereby obtained. The method for purifying the iron-chromium electrolyte can simply and effectively remove harmful me...  
WO/2023/041972A1
A high-speed pure gold electroforming/electroplating bath consisting of a. gold potassium sulphite and sodium gold sulphite of 1-40g/l; b. lithium, sodium, potassium, rubidium or cesium salts of sulphurous acid of 2-100g/l; c. alkali sal...  
WO/2023/041670A1
The invention relates to a chromium coating further comprising indium, bismuth or antimony.  
WO/2023/035661A1
The present application provides an electrolytic copper foil and a preparation method therefor, a negative electrode plate, a secondary battery, a battery module, a battery pack, and an electric device. The method for preparing the elect...  
WO/2023/038536A1
Electrolyte bath, for deposition of nickel coatings, containing Ni2+ cations in an aqueous medium, according to the invention, is characterized by having a pH value in the range of 4.3-4.8, preferably pH = 4.5, and containing Ni2+ cation...  
WO/2023/033038A1
A terminal material that has a plating film and that can be used as a terminal for electrical connection or as a contact element for a connector, the terminal material comprising: a base material made of copper or a copper alloy; and a p...  
WO/2023/033615A1
An embodiment of the present invention provides a frame nanoparticle having a porous structure, the frame nanoparticle being characterized by comprising: an overall ring frame including a platinum-containing nanoring inner fame and a gol...  

Matches 101 - 150 out of 9,846