Title:
TERMINAL MATERIAL HAVING PLATING FILM AND COPPER SHEET FOR TERMINAL MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/033038
Kind Code:
A1
Abstract:
A terminal material that has a plating film and that can be used as a terminal for electrical connection or as a contact element for a connector, the terminal material comprising: a base material made of copper or a copper alloy; and a plating film formed on the base material, wherein the plating film has a tin layer made of tin or a tin alloy, a surface portion KAM value as measured by analyzing, by an EBSD method, a cross-section of a surface portion in the depth range of 1 μm from the interface between the base material and the plating film in the thickness direction of the base material is not less than 0.15° but less than 0.90°, and a center portion KAM value at the thickness center portion of the base material is 0.1-0.6 times of the surface portion KAM value.
Inventors:
KUBOTA KENJI (JP)
ARAI ISAO (JP)
MIYASHIMA NAOKI (JP)
ISHIKAWA SEIICHI (JP)
ARAI ISAO (JP)
MIYASHIMA NAOKI (JP)
ISHIKAWA SEIICHI (JP)
Application Number:
PCT/JP2022/032751
Publication Date:
March 09, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D5/34; C22C9/00; C22F1/08; C25D3/30; C25D7/00; H01R13/03
Domestic Patent References:
| WO2011086978A1 | 2011-07-21 | |||
| WO2011122493A1 | 2011-10-06 | |||
| WO2020203576A1 | 2020-10-08 |
Foreign References:
| JP2012122114A | 2012-06-28 | |||
| JP2016060958A | 2016-04-25 |
Attorney, Agent or Firm:
AOYAMA, Masakazu (JP)
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