Title:
NICKEL PLATING SOLUTION, AND METHOD FOR MANUFACTURING NICKEL OR NICKEL ALLOY PLATING COATING
Document Type and Number:
WIPO Patent Application WO/2023/105747
Kind Code:
A1
Abstract:
Provided are a nickel plating solution and a method for manufacturing a nickel or nickel alloy plating coating with which it is possible to enhance the efficiency of deposition of SiC microparticles on a nickel or nickel alloy plating coating. The nickel plating solution contains a water-soluble nickel compound and SiC microparticles, the nickel plating solution further containing a dispersant comprising at least one substance selected from deoxycholic acid and deoxycholic acid derivatives.
Inventors:
AIKAWA YUSUKE (JP)
Application Number:
PCT/JP2021/045506
Publication Date:
June 15, 2023
Filing Date:
December 10, 2021
Export Citation:
Assignee:
JAPAN KANIGEN CO LTD (JP)
International Classes:
C25D3/12; C23C18/34; C23C18/52; C25D15/02
Domestic Patent References:
| WO2016013219A1 | 2016-01-28 |
Foreign References:
| JP2013241649A | 2013-12-05 | |||
| JP2010279959A | 2010-12-16 |
Attorney, Agent or Firm:
ONDA Makoto et al. (JP)
Download PDF: