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WO/2022/184688A1 |
It is described a method of processing an etching waste medium from circuit board and/or substrate manufacture, the method comprising: i) providing a medium to be processed (11), being the etching waste medium, in particular from an etch...
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WO/2022/180867A1 |
The present invention addresses the problem of providing a gold plating liquid and a replenisher liquid for gold plating liquid, each of which is capable of solving the problem of unevenness in the plating performance. The problem is sol...
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WO/2022/181646A1 |
This production method for titanium foil includes an electrodeposition step in which a molten salt bath that includes titanium ions and a molten chloride is used to perform electrolysis at an electrode that includes an anode and a cathod...
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WO/2022/180650A1 |
A galvanic electrodeposition process, comprising a step of coating with a layer of yellow gold alloy at least one object immersed in a galvanic bath which comprises an aqueous solution. The aqueous solution comprises at least: - gold in ...
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WO/2022/174632A1 |
Disclosed are a cyanide-free alkaline copper plating electroplating solution for a zinc alloy die casting member, a preparation method therefor, and an electroplating method. The electroplating solution comprises the following components...
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WO/2022/175137A1 |
The present invention relates to a method for fabricating cobalt interconnects and an electrolyte enabling it to be implemented. The electrolyte of pH less than 4.0 comprises cobalt ions, chloride ions and organic additives, including an...
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WO/2022/172823A1 |
Provided is an additive for an electroplating solution, the additive containing a reaction product between at least one type of epoxy compound (a1) represented by general formula (1) and at least one type of tertiary amine compound (a2)....
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WO/2022/172464A1 |
The present invention addresses the problem of providing: a palladium plating solution which enables the achievement of a thick palladium plating; and a palladium plating solution replenisher.　The problem is solved by a palladium plati...
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WO/2022/170803A1 |
An electroplating solution for steel substrate direct cyanide-free plating under strong acidic conditions, comprising the following components: 50-250 g/L of a main salt, 30-100 g/L of a compound adsorbent, 1-5 g/L of an additive, and 16...
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WO/2022/163073A1 |
Provided is a can steel sheet 1 having excellent weldability. The can steel sheet 1 has a metal chromium layer 3 and a chromium hydrous oxide layer 4 formed in this order on a surface of a steel sheet 2 when observed from the steel sheet...
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WO/2022/157034A1 |
The disclosure relates to an OER electrode catalyst assembly comprising a multi-metallic catalyst and a support with the catalyst being deposited on the support, the catalyst comprising one or more iron oxides, the catalyst assembly is r...
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WO/2022/158896A1 |
An additive composition for a plating solution is to enhance wear resistance and gloss properties of plating, and comprises one or more materials selected from the group consisting of tungsten, phosphorus, and indium. When the additive c...
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WO/2022/158277A1 |
The present invention addresses the problem of providing: a plating solution able to suppress variations in the filling height of a metal filled in through holes; and a method for producing a metal-filled structure using the plating solu...
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WO/2022/158291A1 |
This electrolytic silver plating bath contains silver ions, a complexing agent, a conductive salt, a brightening agent, and a sacrificial reductant, and is characterized by containing, as the sacrificial reductant, one or more kinds of n...
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WO/2022/153580A1 |
A surface-treated copper foil which comprises: a copper foil; and a surface treatment layer that is formed on at least one surface of the copper foil. The surface treatment layer has an Sku of from 2.50 to 4.50 and an Str of from 0.20 to...
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WO/2022/153740A1 |
A tin alloy plating solution according to the present invention comprises (A) a soluble salt comprising at least a stannous salt, (B) a soluble salt of a metal that is nobler than tin, (C) a tin complexing agent comprising a sugar alcoho...
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WO/2022/154102A1 |
A surface-treated copper foil comprising a copper foil and a surface-treating layer formed on at least one surface of the copper foil. The surface-treating layer has an Sku of 2.50-4.50 and an Str of 0.20-0.40.
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WO/2022/148691A1 |
The present invention refers to an electroplating bath for depositing chromium or chromium alloys and a process for depositing chromium on a substrate.
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WO/2022/143860A1 |
Disclosed in the present invention is an optimization process for insoluble anode acid sulfate copper electroplating. An electroplating tank, an electroplating power supply, and an insoluble anode are comprised. A plating piece serves as...
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WO/2022/101086A9 |
The present invention belongs to the field of catalytic chemistry, and more specifically to catalysed reduction chemical reactions, preferably of CO2 into small molecules. The present invention relates to a catalyst compound comprising a...
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WO/2022/141709A1 |
An electrolytic copper foil for a high-frequency high-speed printed circuit board, and a preparation method therefor. The electrolytic copper foil for a high-frequency high-speed printed circuit board comprises a raw foil layer and a sur...
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WO/2022/145170A1 |
The purpose of the present invention is to provide a method and system for electroplating without requiring ancillary facilities or anode solution control, while using an anode that is able to be relatively easily produced without requir...
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WO/2022/145290A1 |
Provided is a plating structure including a substrate configured from Cu or a Cu alloy, an Ni electrolytic plating film formed on the substrate, a Pd plating film formed on the Ni electrolytic plating film, and an Au plating film formed ...
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WO/2022/138006A1 |
The present invention provides a surface-treated steel sheet that can be produced without using hexavalent chromium, and that exhibits excellent sulfide staining resistance and paint secondary adhesion. Provided is a surface-treated stee...
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WO/2022/138005A1 |
The present invention provides a surface-treated steel sheet that can be produced without using hexavalent chromium, and that exhibits excellent film wet adhesion and paint secondary adhesion as well as high film corrosion resistance and...
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WO/2022/129238A1 |
The present invention provides an aqueous composition comprising tin ions, optionally alloy metal ions selected from silver, indium, and bismuth ions and at least one additive of formula L1a(L1a) or of formula L1b L1b wherein RL1 is, for...
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WO/2022/129997A1 |
A method of production of a coated steel substrate comprising of the steps to have a steel substrate;performing electroplating of the steel substrate with an electroplating solution having a pH of from 2 to 6 and containing 100g/l to 500...
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WO/2022/131386A1 |
The present invention relates to a solution for electroplating iron, comprising: iron ions comprising first iron ions and second iron ions; a complexing agent; and unavoidable impurities, wherein the amount of second iron ions among the ...
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WO/2022/129916A1 |
The invention relates to an aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of ...
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WO/2022/129461A1 |
The present invention relates to a process for stabilizing the electrolytic deposition of platinum from an electrolytic bath. The present invention particularly relates to a corresponding process in which the platinum electrolytic bath c...
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WO/2022/129491A1 |
The present invention refers to an electroplating composition for plating a chromium coating on a substrate, the composition comprising: (i) a source of hexavalent chromium; (ii) one or more than one betaine comprising a quaternary nitro...
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WO/2022/131802A1 |
The present disclosure relates to: a cold rolled steel sheet including 0.0005-0.2 wt% of C, 0.05-0.2 wt% of Mn, at most 0.15% (excluding 0) of Si, at most 0.03% (excluding 0) of P, at most 0.015% (excluding 0) of S, 0.01-0.05% of Al, 0.0...
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WO/2022/123019A1 |
The present invention relates to a method for electrodepositing a dark chromium layer on a substrate and a substrate having at least one side fully covered with a dark chromium layer. The method includes utilizing an aqueous trivalent ch...
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WO/2022/123012A1 |
The present invention relates to a very specific electroplating bath for depositing a black chromium layer, and a respective method for electroplating such a layer. The electroplating bath comprises two specific groups of compounds defin...
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WO/2022/122989A1 |
The present invention relates to an electrolyte for separating hard silver layers, wherein the element bismuth is alloyed to the silver. The invention also relates to a method for separating a corresponding silver-bismuth alloy from an e...
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WO/2022/124825A1 |
The present invention relates to a high-strength hot-dip galvanized steel sheet having excellent plating quality, a steel sheet for plating for manufacturing same, and methods for manufacturing the steel sheets. The steel sheet for plati...
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WO/2022/123818A1 |
Provided are an Ag-coated material and a technology related thereto, the Ag-coated material including a material and an Ag-film formed on the material, wherein the Ag-coated material is characterized by the Ag-film including Ag-layers, f...
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WO/2022/123023A1 |
The present invention relates to a black plated substrate comprising a base-substrate and deposited thereon a layer stack, wherein the layer stack comprises a black chromium plating layer comprising on its surface a conversion layer havi...
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WO/2022/116509A1 |
Disclosed are a device and method for preventing a conductive roller from being plated with copper, belonging to the technical field of the manufacturing of electroplated copper films. The conductive roller and an electroplating anode ar...
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WO/2022/113787A1 |
A tin alloy plating solution according to the present invention includes: (A) a soluble salt containing at least a stannous salt; (B) a soluble salt of a metal that is more precious than tin; (C) an alkane sulfonic acid having 9-18 carbo...
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WO/2022/112379A1 |
Aqueous electrolyte for deposition of a ruthenium alloy layer on metal surfaces, in particular base metal surfaces, its use and a corresponding electrolytic process, and a correspondingly produced layer sequence.
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WO/2022/108325A1 |
Provided is a tin-silver plating solution comprising: a tin ion supply source; a silver ion (Ag+) supply source; and an organic additive including a silver (Ag) complexing agent, a tin carrier, and a grain refiner, whereby the generation...
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WO/2022/104875A1 |
A vapor chamber upper cover plate manufacturing method, a vapor chamber upper cover plate, and a vapor chamber. The vapor chamber upper cover plate manufacturing method comprises the following processes: manufacturing a vapor chamber upp...
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WO/2022/104882A1 |
Provided are a method for preparing a vapor chamber upper cover plate, a vapor chamber upper cover plate, and a vapor chamber. The method for preparing the vapor chamber upper cover plate comprises the following processes: manufacturing ...
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WO/2022/101474A1 |
The present invention refers to a method for preparing an electroplated product by depositing an underlayer, a barrier diffusion layer and a top layer on a surface of a substrate comprising or consisting of copper or a copper or copper a...
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WO/2022/091427A1 |
This potassium gold cyanide crystal is characterized in that the silicon content is 10 wt ppm or less. This potassium gold cyanide solution is characterized in that, per 10 mL of the potassium gold cyanide solution, the number of pieces ...
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WO/2022/088216A1 |
The present application provides a chemical nickel-plating process for a steel sheet, a phosphorus-nickel-plated steel sheet and a vapor chamber. The chemical nickel-plating process for a steel sheet comprises the following steps: provid...
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WO/2022/089232A1 |
Disclosed are manufacturing equipment and a manufacturing method for lead frame surface roughness. The manufacturing equipment for lead frame surface roughness comprises: a material dispensing apparatus, a cleaning apparatus, a copper el...
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WO/2022/082933A1 |
A production method for an ultrathin high-strength electronic copper foil, comprising the following steps: preparing an electrolyte, adding a mixed additive, manufacturing an isolation layer by using a copper foil having the thickness of...
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WO/2022/080735A1 |
The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with n...
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