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WO/2018/115948A1 |
The present invention relates a method for the manufacture of a coated steel sheet.
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WO/2018/117675A1 |
The present invention relates to a cold rolled steel sheet having high temperature characteristics and room temperature processability, and a manufacturing method therefor, and provides a cold rolled steel sheet having excellent processa...
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WO/2018/110648A1 |
This method for manufacturing an electrolytic aluminum foil comprises supplying an electrolytic solution to an electrolytic bath in which a diaphragm is provided between an anode and a cathode, and causing an aluminum foil to be deposite...
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WO/2018/110198A1 |
The present invention addresses the problem of providing a method for forming a transparent electroconductive film, whereby a transparent electroconductive film can be formed which has excellent electrical conductivity and in which a thi...
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WO/2018/104752A1 |
A method for producing a microstructure is disclosed. A master is provided having a pattern formed of conductive material embedded in a non-conducting substrate. The master has a master surface having a conducting portion defined by the ...
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WO/2018/105388A1 |
Provided are: a Sn plating material which has a Zn plating layer formed at a surface thereof, and which when used as a material for a terminal which is connected to an electric wire formed of aluminum or an aluminum alloy by pressure-att...
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WO/2018/103621A1 |
An acid copper electroplating process using an insoluble anode and equipment therefor. In the process and the equipment, a separator (10) is used to separate electroplating solutions in a cathode region (1) and an anode region (2), to av...
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WO/2018/097184A1 |
The present invention addresses the problem of providing an electrolytic nickel (alloy) plating solution which is able to fill micro holes or micro recesses 14 within an electronic circuit component with nickel or nickel alloy 18 without...
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WO/2018/095132A1 |
An electroplating copper layer includes bamboo-like copper crystal particles having a highly preferred orientation. The bamboo-like copper crystal particles have a long axis direction and a short axis direction, and the bamboo-like coppe...
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WO/2018/097152A1 |
The purpose of the present invention is to provide: a high-quality electrolytic aluminum foil that has a smooth surface and is free of dendritic deposits on the ends thereof; and a manufacturing method allowing electrolytic aluminum foil...
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WO/2018/095133A1 |
A method of preparing an electroplating copper layer having a preferred growth orientation includes: providing an electroplating solution that includes 120 to 200 g /L of copper sulfate, 50 to 150 g /L of sulfuric acid, 100 to 1000 ppm o...
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WO/2018/096769A1 |
The titanium plating solution production method according to an embodiment of the present invention measures a titanium plating solution comprising fluorine and titanium under the following conditions using cyclic voltammetry and adds ti...
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WO/2018/088645A1 |
The present invention relates to an electrolytic copper foil for a secondary battery, having excellent flexural resistance, and a method for producing the electrolytic copper foil and, more specifically, to an electrolytic copper foil fo...
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WO/2018/088644A1 |
The present invention relates to an electrolytic copper foil for a secondary battery, having excellent physical properties at a low temperature, and a method for producing the electrolytic copper foil and, more specifically, to an electr...
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WO/2018/087135A1 |
This invention relates to a method for electroplating an uncoated steel strip with a plating layer from a trivalent Cr-electrolyte, where the uncoated strip is subjected to a cleaning and pickling step prior to the plating process and th...
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WO/2018/078243A1 |
The invention relates to a method for regenerating a platinum bath by flow reaction, comprising the following consecutive steps: drawing fluid from the platinum bath (B) via a drawing current (1); complexing platinum, by mixing the drawi...
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WO/2018/074883A1 |
An embodiment of the present invention provides a through-electrode filling method comprising: a step of immersing a through-electrode including a via in a copper plating solution having a leveler and a copper electrolyte; a first curren...
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WO/2018/072367A1 |
A boron-doped diamond electrode (3). The electrode (3) is formed by disposing a modification layer on the surface of a foam metal skeleton, and then disposing a boron-doped or nitrogen-doped diamond layer or a boron-doped or nitrogen-dop...
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WO/2018/073011A1 |
A composition comprising metal ions and at least one compound of formula I (I) wherein X1 and X2 are independently selected from a chemical bond and straight chain or branched C1-C18 alkanediyl, which may optionally be interrupted by O, ...
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WO/2018/074723A1 |
The present invention provides a method for manufacturing a functional electrode, which is an electrode for electrolysis or water treatment and, particularly, according to the present invention, the method for manufacturing a functional ...
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WO/2018/066398A1 |
The purpose of the present invention is to provide a satin nickel plating solution that enables satin nickel plating without resulting in poor appearance and does not require an activated carbon treatment for a long time. This nickel-pla...
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WO/2018/060779A1 |
The present disclosure discloses a coated steel comprising a steel substrate and a nickel-zinc coating on the steel substrate. The nickel-zinc coating forms an iron-nickel solid solution layer on steel substrate, a nickel layer on iron-n...
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WO/2018/057707A1 |
An electrolytic plating composition for superfilling submicron features in a semiconductor integrated circuit device and a method of using the same. The composition comprises (a) a source of copper ions to electrolytically deposit copper...
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WO/2018/057490A1 |
A process for electrodepositing a copper layer on a metalizing substrate is described. The metalizing substrate comprising a seminal conductive layer positioned on and in electrically conductive communication with a photovoltaic cell pan...
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WO/2018/057590A1 |
An electrodeposition composition comprising: (a) a source of copper ions; (b) an acid; (c) a suppressor; and (d) a leveler, wherein the leveler comprises a quaternized dipyridyl compound prepared by reacting a dipyridyl compound with a d...
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WO/2018/051925A1 |
The purpose of the present invention is to provide a novel technique which enables a lithium ion secondary battery to have a higher capacity, while enabling the lithium ion secondary battery to exhibit sufficiently excellent cycle charac...
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WO/2018/052023A1 |
This zinc-nickel composite plating bath contains a zinc source, a nickel source, silicon dioxide particles (22) and an ammonium-based dispersant in such ranges that enable the achievement of a zinc-nickel composite plating film (10) wher...
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WO/2018/053499A1 |
A process is provided comprising submerging a substrate in an electrochemical deposit bath having at least a metal salt and saccharin. In embodiments, the film is further treated with anodization, and in other cases chemical vapor deposi...
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WO/2018/048486A1 |
A coating system for a surface of a superalloy component is provided. The coating system includes a MCrAlY coating on the surface of the superalloy component, where M is Ni, Fe, Co, or a combination thereof. The MCrAlY coating generally ...
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WO/2018/033097A1 |
A nanocrystalline material based on a stainless steel surface. In percentage by weight, the nanocrystalline material comprises: 0 to 3% of carbon, 20% to 35% of oxygen, 40% to 53% of chromium, 10% to 35% of ferrum, 0 to 4% of molybdenum,...
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WO/2018/033098A1 |
An anti-coking nanomaterial based on a stainless steel surface. In percentage by weight, the nanomaterial comprises: 0 to 3% of carbon, 23% to 38% of oxygen, 38% to 53% of chromium, 10% to 35% of ferrum, 0 to 2% of molybdenum, 0 to 4% of...
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WO/2018/034511A1 |
The present invention relates to a method for fabricating grooves for silica fiber arrays by using C4F8 gas polymerization and, more particularly, to a method for fabricating grooves for silica fiber arrays, wherein a silica substrate is...
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WO/2018/033461A1 |
The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising (i) copper (II) ions, (ii) one or more than one compound of For...
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WO/2018/029968A1 |
This electrode manufacturing method includes: a step in which a soluble salt of nickel, a soluble salt of iron, and aminocarboxylic acid are dissolved in water to prepare a plating solution; and a step in which a substrate is immersed in...
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WO/2018/029967A1 |
This electrode manufacturing method includes: a step in which a soluble salt of nickel, a soluble salt of iron, and aminocarboxylic acid are dissolved in water to prepare a plating solution; and a step in which a substrate is immersed in...
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WO/2018/024181A1 |
A method for preparing graphene foam metal for carrying a titanium dioxide-precious metal thin film. The method comprises: preparing an electrolyte containing titanium dioxide; cleaning to-be-electroplated foam metal whose surface is dep...
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WO/2018/018161A1 |
A method of electrochemical deposition of a metallic material onto a substrate is provided. The method includes providing an alkaline solution of hydroxide ions, immersing a metallic material precursor and the substrate into the alkaline...
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WO/2018/022374A1 |
A method of applying a corrosion-resistant coating to a fastener including preheating an area of the fastener to be coated to elevate a temperature of the area and spraying the preheated area of the fastener with a molten or semi-molten ...
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WO/2018/017755A1 |
Systems and methods for use in an in vitro diagnostics setting incorporating magnetic shielding to reduce exposure of any of samples, reactants, devices or people from exposure or prolonged exposure to magnetic or electromagnetic fields ...
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WO/2018/015168A1 |
A composition comprising: (a) cobalt ions, and (b) an additive of formula (I) wherein R1 is selected from X-Y; R2 is selected from R1 and R3; X is selected from linear or branched C1 to C10 alkanediyl, linear or branched C2 to C10 alkene...
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WO/2018/016772A1 |
The present invention relates to a multilayer-structure metal manufacturing method using a composite surface treatment method. A multilayer-structure metal manufacturing method using a composite surface treatment method according to the ...
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WO/2018/013874A1 |
The disclosure provides a method comprising inducing a first current between a source of a countercharge and a first electrode, the first current being through an electrolyte. A second current is induced across the first electrode, the s...
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WO/2018/013850A2 |
Galvanic metal-water cells and methods of manufacturing positive electrodes to be used in said galvanic metal-water cells. The galvanic metal-water cells in accordance with various embodiments include a cathode that includes a layer comp...
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WO/2018/004152A1 |
The present invention relates to a surface-treated copper foil for a microcircuit and a method for manufacturing the same. Specifically, a method for surface-treating a copper foil for a microcircuit board according to the present invent...
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WO/2018/004151A1 |
The present invention relates to a surface-treated copper foil for a microcircuit board and a method for manufacturing the same and, more specifically, to a surface-treated copper foil for a microcircuit board and a method for manufactur...
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WO/2017/219797A1 |
The present invention relates to an electric copper plating liquid and an electric copper plating process thereof. The electric copper plating liquid comprises the following components: 20g/L to 240g/L of copper sulfate pentahydrate, 20 ...
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WO/2017/217387A1 |
According to the present invention, an electrodeposition article is formed with use of a tin or tin alloy plating bath which contains a predetermined branched polyoxyalkylene compound such as an alkylene oxide addition product of an alip...
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WO/2017/217234A1 |
[Problem] To provide a copper plating bath which contains a reduced amount of chlorine, considered to be attributable to wiring resistance, or is free of chlorine, without the need to highly purify copper sulfate. The copper plating bath...
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WO/2017/213353A1 |
A method for creating a hologram pattern, and a test specimen comprising a metal-plated layer having a hologram pattern on the surface thereof, according to the present invention, can have a hologram pattern formed on a metal-plated laye...
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WO/2017/210728A1 |
A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold com...
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