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WO/2023/234770A1 |
The present invention relates to a porous material comprising a porous wall structure defining and separating primary pores that are interconnected across its thickness dimension. The primary pores have a diameter greater than 5 µm and ...
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WO/2023/235616A1 |
The present invention involves the combination of relatively soft conductive material, such as copper, with a low thermal expansion metal alloy, such as Invar, by compositing the low thermal expansion alloy with porous insulation layerin...
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WO/2023/223685A1 |
The present invention addresses the problem of providing a plating film manufacturing method that can provide excellent corrosion resistance to a plated product having a trivalent chromium plating film formed thereon, and that can form a...
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WO/2023/219190A1 |
The present invention relates to a composite release layer for a carrier-attached metal foil and a metal foil comprising same. The present invention provides a composite release layer for a carrier-attached metal foil, the release layer ...
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WO/2023/219264A1 |
A method for manufacturing an electrolytic copper foil, according to one embodiment of the present invention, comprises the steps of: dissolving copper (Cu) and nickel (Ni) in sulfuric acid to prepare an electrolytic solution containing ...
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WO/2023/217917A1 |
The present invention belongs to the field of catalytic chemistry, and more specifically to catalysed reduction chemical reactions, preferably of CO2 into small molecules. The present invention relates to a new catalyst compound comprisi...
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WO/2023/219242A1 |
The present invention relates to a method for manufacturing an oxidation catalyst module using electrodeposition (deposition) and an oxidation catalyst module manufactured thereby. More specifically, the present invention relates to: an ...
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WO/2023/219269A1 |
A method for controlling the properties of an electrolytic copper foil, according to one embodiment of the present invention, adds a glossiness control agent so as to adjust the glossiness of an electrolytic copper foil, and thus control...
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WO/2023/213866A1 |
The present invention relates to a method for depositing a zinc-nickel alloy on a substrate, particularly to a method for electrolytically depositing a zinc-nickel alloy on a substrate, wherein a zinc-nickel deposition bath is utilized a...
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WO/2023/210832A1 |
[Problem] Provided is a nickel-plated steel sheet in which a plating layer has adhesiveness to a substrate, which has adhesiveness to other members, and the total thickness of which, including the thickness of a roughened layer, is reduc...
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WO/2023/210822A1 |
[Problem] The present invention addresses the problem of: suppressing the occurrence of a crack even in a state where a rolled surface-treated steel sheet is stretched, while maintaining the hardness of the surface of the rolled surface-...
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WO/2023/211722A1 |
An industrial process is conducted within a sealed chamber filled with dimethylformamide (DMF) saturated with CO2 under pressure which provides the carbon atoms for manufacturing graphene. A copper wire comprising an anode is reeled betw...
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WO/2023/201600A1 |
The present application provides a preparation method for an FeCoNiCuZn high entropy alloy and a FeCoNiCuZn high entropy alloy. In the method, an electroplating solution is electroplated by using electrodeposition to obtain the FeCoNiCuZ...
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WO/2023/203231A1 |
A method of facilitating electrolytically depositing chromium onto a metal substrate from an electrolyte including an ionic form of chromium and one or more organic additives in an electrodeposition vessel by applying a current through t...
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WO/2023/202267A1 |
The present application discloses a multi-metal compounding method for a polymeric fiber material and a multi-metal composite fiber. The method comprises: etching a polymeric fiber in an etching solution containing an oxidizing acid and ...
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WO/2023/201117A2 |
A hybrid conductive material comprising at least one conductive material having at least one internal porous insulative layer; and wherein, at least one of the conductive materials fills the voids of the internal porous insulative layer....
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WO/2023/194802A1 |
The present invention is directed to an electrolyte composition for depositing copper on a conductive surface. The composition contains a combination of two aromatic amines, a complexing agent for copper (II) ions, and an accelerator suc...
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WO/2023/196489A1 |
Disclosed are novel electrolytes based on liquefied gas and high concentration of salt in liquefied gas electrolytes. Unlike common electrolytes, liquefied gas electrolytes utilize solvents which are gaseous under standard conditions. Th...
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WO/2023/195251A1 |
The present invention provides a surface-treated steel sheet which can be produced without using hexavalent chromium, and which exhibits excellent film corrosion resistance, coating corrosion resistance, film wet adhesion, coating materi...
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WO/2022/245576A9 |
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive c...
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WO/2023/196285A1 |
Electroplating methods may include providing an initial anolyte to a first compartment of an electrochemical cell. The methods may include providing an initial catholyte to a second compartment of the electrochemical cell. The initial ca...
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WO/2023/196226A1 |
A process of treating a waste stream comprising organic amine compounds complexed with heavy metal ions. The process includes the steps of: (1) adjusting the pH of the waste stream to between about 4 and about 10; (2) b) adding a chlorid...
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WO/2023/196254A1 |
Disclosed herein is an aluminum-ether-based composition that can serve a dual role as either an electrolyte for use in batteries and/or as an electroplating bath for ambient temperature aluminum deposition. The aluminum-ether-based compo...
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WO/2023/195252A1 |
The present invention provides a surface-treated steel sheet that can be produced without the use of hexavalent chromium and that has both excellent adhesiveness to a BPA-free coating material and BPA-free coating corrosion resistance. P...
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WO/2023/196284A1 |
Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemica...
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WO/2023/188637A1 |
The present invention provides: a silver-plated material wherein a silver plating film is not easily separated from a base plating film and exhibits excellent adhesion in a high-temperature high-humidity environment in cases where the si...
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WO/2023/189537A1 |
The present invention provides a method for producing a trivalent chromium plated component (100) that is obtained by forming a trivalent chromium plating film (3) on a sliding component of a device in which a fluid is sealed, the method...
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WO/2023/188446A1 |
[Problem] To provide a silver-plated material that not only has excellent wear resistance but can also keep the peeling resistance of a silver coating layer high, even when exposed to high-temperature/high-humidity environments. [Solutio...
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WO/2023/190805A1 |
The purpose of the present invention is to provide: a novel copper plating solution for PR pulse electrolysis; and a novel copper plating method by means of PR pulse electrolysis. The present invention provides a copper plating solution ...
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WO/2023/179704A1 |
Provided are a copper plating additive composition, a copper plating solution, and a copper brush plating method using the same. The copper plating additive composition includes 1, 4-cyclohexanedione monoethylene acetal, potassium phthal...
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WO/2023/181627A1 |
This structural body comprises a base material and a plating layer disposed on the base material, the plating layer having a porous structure on a surface thereof on the opposite side to the base material, the structural body satisfying ...
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WO/2023/178825A1 |
The present invention relates to a copper brush plating process for a plastic film. The process comprises: performing first copper plating treatment on a plastic film by using a physical vapor deposition method, so as to prepare a first ...
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WO/2023/178826A1 |
The present invention relates to a copper plating additive, a copper plating solution and the use thereof. The copper plating additive comprises 1,4-cyclohexanedione monoethylene acetal, a phthalimide potassium salt and an amino polyol c...
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WO/2023/174871A1 |
The invention relates to a gold electroplating solution comprising gold in the form of a complex with a compound of formula (I) or a salt thereof : R1S-Ar-CO2H (I) Wherein : R1 is H, a C1-C6 alkyl group or -S-Ar-CO2H, Ar is, at each occu...
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WO/2023/171924A1 |
The present invention provides an electrode for producing BHMF through an HMF reduction reaction, in which the electrode for producing BHMF through an electrochemical HMF reduction reaction comprises: a conductive substrate; and a non-pr...
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WO/2023/166552A1 |
The present invention provides a plating solution which has excellent via filling characteristics and enables the formation of a flat plating surface. This plating solution contains a water-soluble metal salt and a sulfonio group-conta...
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WO/2023/164992A1 |
An antiviral eco-friendly composite coating, a preparation method therefor, and an antiviral eco-friendly product. The antiviral eco-friendly composite coating comprises: a semi-gloss nickel layer, a microporous nickel layer and an eco-f...
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WO/2023/166023A1 |
With the objective of improving the corrosion resistance, in particular the salt spray resistance, of objects with a nickel and trivalent chromium coating, the invention proposes a method for coating a substrate with a corrosion protecti...
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WO/2023/159785A1 |
The present invention relates to a conductive apparatus for a coating and a coating machine. The conductive apparatus for a coating comprises a rack and two conductive mechanisms. The rack is provided with a plating tank which contains a...
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WO/2023/163593A1 |
The present disclosure relates to a method of manufacturing an electrode (In) comprising a current collector element (10) and a coating of a solid or semi-solid electrolyte (20) and the corresponding electrode part. The method comprises ...
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WO/2023/160642A1 |
The present application relates to a conductive device (100) for film plating and a film plating machine (300). The conductive device (100) for film plating comprises a frame (110) and two conductive mechanisms (120). The frame (110) is ...
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WO/2023/161892A1 |
The present invention relates to an electrocatalyst comprising a Cu substrate coated with a 3D TiO2/Cu microrods array decorated with nanoparticles of a noble metal, preferably Ru nanoparticles, an electrochemical cell comprising said el...
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WO/2023/153099A1 |
The present invention provides a steel sheet for hot pressing, the steel sheet being prevented from the generation of scales due to a coating layer and being reduced in adhesion of a metal to heating facilities, thereby preventing liquid...
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WO/2023/151029A1 |
A method of electroplating nanograined copper on a substrate includes: providing the substrate; providing an electroplating bath that includes a copper salt, an acid, a leveler, a chlorine compound, an accelerator, a suppressor; and wate...
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WO/2023/152994A1 |
[Problem] To provide a silver-plated material which has excellent abrasion resistance and has the ability to maintain high resistance to peeling of a silver coating layer even when exposed to high-temperature and high-humidity environmen...
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WO/2023/147634A1 |
A method of electrodepositing neodymium from a neodymium salt solution in ionic liquid and in the presence of transitional metal impurities which results in an improved electrowinning process wherein the electrochemical process occurring...
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WO/2023/147039A1 |
The present invention relates to methods of regenerating ion exchange resins in systems using anhydrous organic solvents, such as systems for alkaliating or lithiating materials, such as anodes, in gamma-butyrolactone.
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WO/2023/141227A1 |
Energy is generated from pulsed electric power sources applied to a gas medium that includes hydrogen. A sealed reactor chamber contains hydrogen. A plasma power supply, such as a DC, AC, or RF power supply, generates a plasma inside the...
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WO/2023/141332A1 |
A method includes applying a bond layer of a first chemical composition to a first surface of a first metal body. The metal body is of a second chemical composition. The method further includes disposing a second metal body of the second...
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WO/2023/138283A1 |
Provided is an environmentally friendly and rapid preparation method for a metal-organic framework compound thin film plating, and specifically disclosed is that said method comprises the following steps: S1) preparing a semi-degradable ...
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