Title:
ENVIRONMENTALLY FRIENDLY AND RAPID PREPARATION METHOD FOR METAL-ORGANIC FRAMEWORK COMPOUND THIN FILM PLATING
Document Type and Number:
WIPO Patent Application WO/2023/138283
Kind Code:
A1
Abstract:
Provided is an environmentally friendly and rapid preparation method for a metal-organic framework compound thin film plating, and specifically disclosed is that said method comprises the following steps: S1) preparing a semi-degradable metal-organic framework compound: dispersing the metal-organic framework compound in a buffer solution and letting sit after mechanical dispersion; S2) electroplating a semi-degradable metal-organic framework compound layer: taking the dispersion liquid obtained in step S1 as an electroplating liquid and carrying out an electroplating reaction in a three electrode system, the three electrode system comprising a counter electrode, a reference electrode, and a working electrode, and the semi-degradable metal-organic framework compound layer being obtained on the surface of the working electrode. The preparation method of the present invention provides a quick and simple environmentally friendly electroplating process, and the drawbacks of environmental pollution are eliminated. The electroplating solution has simple components and a wide range of application, and any metal-organic framework compound able to be dissolved in the buffer liquid can achieve a plating effect. The present invention has a rapid electroplating time, and the electroplating liquid can be continuously used.
Inventors:
ZHAO SHENGZHUO (CN)
DU ZHANHONG (CN)
SHA BAONING (CN)
ZHAO GUANNAN (CN)
BI GUOQIANG (CN)
WANG LIPING (CN)
DU ZHANHONG (CN)
SHA BAONING (CN)
ZHAO GUANNAN (CN)
BI GUOQIANG (CN)
WANG LIPING (CN)
Application Number:
PCT/CN2022/140092
Publication Date:
July 27, 2023
Filing Date:
December 19, 2022
Export Citation:
Assignee:
SHENZHEN INST OF ADV TECH CAS (CN)
International Classes:
C25D9/02; C25D3/54; C25D9/08
Domestic Patent References:
| WO2021216174A1 | 2021-10-28 |
Foreign References:
| CN105203606A | 2015-12-30 | |||
| CN108525667A | 2018-09-14 | |||
| US20120297982A1 | 2012-11-29 | |||
| CN110952125A | 2020-04-03 | |||
| CN112048746A | 2020-12-08 |
Other References:
WU, ZHENGMING: "Preparation of Metal-Organic Framework Thin Film Materials of Copper by Cathodic Electrodeposition", ENGINEERING SCIENCE & TECHNOLOGY I, CHINA MASTER’S THESES FULL-TEXT DATABASE, vol. 2020, no. 4, 15 April 2020 (2020-04-15), ISSN: 1674-0246
Attorney, Agent or Firm:
BEIJING ZHONG XUN TONG DA INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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