Title:
PLATING FILM MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/223685
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a plating film manufacturing method that can provide excellent corrosion resistance to a plated product having a trivalent chromium plating film formed thereon, and that can form a trivalent chromium plating film having excellent glossiness. The present invention provides a plating film manufacturing method that is characterized by comprising a step 1 for forming an electrolytic nickel plating film and a step 2 for forming an electrolytic trivalent chromium plating film on the electrolytic nickel plating film, and that is characterized in that the electrolytic nickel plating film has a compression stress of 0-100 MPa.
Inventors:
NOZAKI MASAFUMI (JP)
MAEDA YOSHIAKI (JP)
NAGAO TOSHIMITSU (JP)
MAEDA YOSHIAKI (JP)
NAGAO TOSHIMITSU (JP)
Application Number:
PCT/JP2023/013182
Publication Date:
November 23, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
OKUNO CHEM IND CO (JP)
International Classes:
C25D5/14; C25D3/06; C25D3/18
Foreign References:
| JP2010185116A | 2010-08-26 | |||
| JP2017145473A | 2017-08-24 |
Other References:
KOBAYASHI YUICHI: "Crack-free Chromium Plating Technology", HYOMEN GIJUTSU - JOURNAL OF THE SURFACE FINISHING SOCIETY OFJAPAN, HYOMEN GIJUTSU KYOKAI, TOKYO, JP, vol. 56, no. 6, 1 June 2005 (2005-06-01), JP , pages 334 - 341, XP093108881, ISSN: 0915-1869
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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