Title:
LEVELING AGENT AND ELECTROPLATING COMPOSITION COMPRISING SAME FOR FILLING VIA HOLE
Document Type and Number:
WIPO Patent Application WO/2023/008958
Kind Code:
A1
Abstract:
The present invention relates to a leveling agent and an electroplating composition comprising same, wherein when a via hole in a substrate is filled with the electroplating composition according to the present invention, the via hole can be filled within a relatively short time, while minimizing formation of dimples or voids.
Inventors:
CHUN SUNG WOOK (KR)
CHUNG BO MOOK (KR)
KIM DEA GEUN (KR)
KO NAK EUN (KR)
SIM JU YONG (KR)
CHUNG BO MOOK (KR)
KIM DEA GEUN (KR)
KO NAK EUN (KR)
SIM JU YONG (KR)
Application Number:
PCT/KR2022/011217
Publication Date:
February 02, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
YMT CO LTD (KR)
International Classes:
C25D3/02; C25D3/38; C25D5/02; C25D5/18; C25D5/56; H05K3/42
Foreign References:
| KR20110103891A | 2011-09-21 | |||
| KR20190061627A | 2019-06-05 | |||
| KR20190113871A | 2019-10-08 | |||
| KR20040051309A | 2004-06-18 | |||
| KR20210065836A | 2021-06-04 | |||
| KR102339867B1 | 2021-12-16 | |||
| KR20120077058A | 2012-07-10 |
Other References:
See also references of EP 4151777A4
Attorney, Agent or Firm:
KWAK, Hyun Kyu (KR)
Download PDF: