PLATING SOLUTION

WIPO Patent Application WO/2024/048039

A1

The present invention provides a plating solution which enables the achievement of plating with high degree of gloss. The plating solution contains metal ions and a PEI compound (L) which has a polyethyleneimine main backbone, while having a structural portion LX represented by formula (LX), a structural portion LY represented by formula (LY) and a structural portion LH represented by formula (LH). (In formula (LX), X represents a structural portion X1 represented by formula (X1); and i represents an integer of 1 or more.) (In formula (LY), Y represents a structural portion Y1 represented by formula (Y1); and j represents an integer of 1 or more.) (In formula (LH), k represents 0 or an integer of 1 or more.) (In formula (X1), A represents C or S; E represents a monovalent metal ion, H, a methyl group, an ethyl group or an allyl group; l represents an integer of 1 to 6; and m represents 1 or 2.) (In formula (Y1), G represents CH2 or CH(OH); n represents 0 or 4; and each of Q1 and Q2 represents H, an electron-withdrawing group or an electron-donating group.)

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TANIMOTO YUMI (JP)
TSUJINO SHUN (JP)
IBATA KAZUO (JP)
YOKOYAMA CHIKAKO (JP)

PCT/JP2023/023544

March 07, 2024

June 26, 2023

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JCU CORP (JP)

C25D3/38

JP2001279228A	2001-10-10
JP2004043957A	2004-02-12
CN110117801A	2019-08-13
JP2005536579A	2005-12-02

HAYASHI Kazuyoshi et al. (JP)

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