Title:
CYANIDE-FREE COPPER PLATING GRAIN REFINER, CYANIDE-FREE COPPER PLATING SOLUTION, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/016330
Kind Code:
A1
Abstract:
The present invention relates to a cyanide-free copper plating grain refiner, which comprises water as well as N-methylpiperazine and 2-methyltetrahydrofuran dissolved in water, where the concentration of the N-methylpiperazine in the cyanide-free copper plating refiner is (0.1-0.5) g/L, and the concentration of the 2-methyltetrahydrofuran in the cyanide-free copper plating grain refiner is (1-5) g/L. The cyanide-free copper plating grain refiner is added into a base plating solution to form a cyanide-free copper plating solution, which can greatly improve the dispersion and brightness of the copper plating layer of a copper-plated product, achieving or even exceeding the effect of traditional cyanide-free copper plating processes, same is expected to replace other cyanide-free copper plating processes, and pushes forward development of cyanide-free copper plating processes.
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Inventors:
LIU GUOCHUN (CN)
JIA BIN (CN)
JIANG WENQIANG (CN)
CHENG YI (CN)
LI XUEFA (CN)
ZHANG GUOPING (CN)
JIA BIN (CN)
JIANG WENQIANG (CN)
CHENG YI (CN)
LI XUEFA (CN)
ZHANG GUOPING (CN)
Application Number:
PCT/CN2022/107445
Publication Date:
January 25, 2024
Filing Date:
July 22, 2022
Export Citation:
Assignee:
YANGZHOU NANOPORE INNOVATIVE MATERIALS TECH LTD (CN)
International Classes:
C25D3/38
Foreign References:
| CN1183485A | 1998-06-03 | |||
| CN114761621A | 2022-07-15 | |||
| CN112135930A | 2020-12-25 | |||
| CN112680758A | 2021-04-20 | |||
| CN106609385A | 2017-05-03 | |||
| CN105648483A | 2016-06-08 | |||
| CN101550569A | 2009-10-07 |
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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