Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/070246
Kind Code:
A1
Abstract:
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.
Inventors:
KOMURA TOSHIYUKI (JP)
MIKI ATSUSHI (JP)
KUSUNOKI KEISUKE (JP)
MIKI ATSUSHI (JP)
KUSUNOKI KEISUKE (JP)
Application Number:
PCT/JP2023/028812
Publication Date:
April 04, 2024
Filing Date:
August 07, 2023
Export Citation:
Assignee:
JX METALS CORP (JP)
International Classes:
C25D7/06; C25D3/38; C25D5/16; H05K1/03
Domestic Patent References:
| WO2019208520A1 | 2019-10-31 |
Foreign References:
| JP2014131808A | 2014-07-17 | |||
| JP2012087388A | 2012-05-10 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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