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WO/2024/095928A1 |
The present invention provides an epoxy compound product which has a low viscosity and is not susceptible to curing shrinkage, while being capable of forming a cured product that exhibits excellent heat resistance and excellent transpare...
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WO/2024/092601A1 |
The present invention relates to a two-component epoxy resin composition, consisting of - a first component K1 comprising at least one epoxy resin A that contains on average more than one epoxy group per molecule; and - a second componen...
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WO/2024/095186A1 |
The present invention provides a single-component structural adhesive, the single-component structural adhesive including: 50 weight percent to 60 weight percent of an epoxy resin having an epoxy equivalent weight of less than 190 grams ...
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WO/2024/095203A1 |
Provided in the present invention is a one-component structural adhesive including: 47 to 61 weight percent of a first epoxy resin, the first epoxy resin having an epoxide equivalent weight of less than 240 grams per equivalent; 27 to 41...
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WO/2024/095701A1 |
A single-component curable composition containing (A) an epoxy resin, (B) a solid rubber, (C) a latent curing agent, (D) a filler, and (E) a foaming agent, wherein (A) contains (A1) an unmodified bisphenol epoxy resin, the single-compone...
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WO/2024/095948A1 |
A sealing agent comprising: a cationically polymerizable compound (A); a cationic polymerization initiator (B); and a curing retarder (X), wherein a viscosity change ratio represented by V1/V0 is not less than 1.00 but less than 1.75, wh...
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WO/2024/092864A1 |
A magnolol/glycosyl furan double-bio-based epoxy resin monomer, a preparation method therefor and a use thereof. The magnolol/glycosyl furan double-bio-based epoxy resin monomer is as shown in formula MF. A polymer material has a high gl...
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WO/2024/094600A1 |
The invention relates to the use of an epoxy resin adhesive for bonding a membrane made of soft PVC to a further substrate, wherein the curing-agent component of the adhesive comprises at least one amine A1 having at least one dimethylam...
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WO/2024/091183A1 |
The present invention provides an ionizable polymer comprising a constitutional unit according to formula (I). wherein R1 and R2 are as defined in the specification. The ionizable polymer of the invention finds use in the intracellular d...
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WO/2024/090829A1 |
The present invention pertains to an epoxy resin having a high glass transition temperature and excellent flexibility. This epoxy resin is characterized by being prepared using a method comprising the steps of: reacting alcohol and isocy...
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WO/2024/088676A1 |
The present invention relates to a method for producing a low temperature curable powder coating composition and such low temperature curable powder coating composition obtainable by such method.
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WO/2024/088848A1 |
The invention relates generally to the field of insulation, more particularly to a formulation for a high-temperature insulation at operating temperatures of 200°C and higher. The insulation is used to insulate electric conductors. The ...
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WO/2024/090259A1 |
The present invention addresses the problem of providing: a resin composition which has excellent reactivity and from which a cured product having excellent stress relaxation properties is formed; and an adhesive. Provided is a resin c...
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WO/2024/090531A1 |
[Problem] To provide a cation-curable composition that can be used in uses such as optical members and adhesives, said composition being curable in a light-irradiated portion and also curable in a light-non-irradiated portion in a mold w...
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WO/2024/089087A1 |
A hydrazide with a melting point of at least 65°C is used as a curing agent for the heat-curing in a heat-curable polyurethane composition that comprises a prepolymer with isocyanate end groups, obtained from at least one polyisocyanate...
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WO/2024/090396A1 |
The present invention provides a curable resin composition which is capable of forming a cured product that is excellent in terms of low dielectric loss tangent, plating adhesion and heat resistance. A curable resin composition according...
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WO/2024/089905A1 |
The object of the present invention is to provide a resin composition and an adhesive that cure under a low temperature condition, provide a cured product with an excellent stress relaxation property, and have a low self-exothermic tempe...
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WO/2024/090369A1 |
This compound is a compound represented by general formula (I). (In the formula, X represents a hydrogen atom, an optionally substituted cyclic group in which the number of carbon atoms in the cyclic structure is 2-20, an optionally subs...
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WO/2024/089906A1 |
The object of the present invention is to provide a resin composition and an adhesive that can reduce odor derived from thiol curing agents and provide a cured product with reduced odor. The present invention provides a resin composition...
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WO/2024/084968A1 |
The present invention relates to an epoxy resin composition comprising: (A) an epoxy resin containing two or more epoxy groups per molecule; (B) a mesogenic group-containing polyorganosiloxane represented by formula (1); and (C) an epoxy...
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WO/2024/078879A1 |
The present invention is directed to a two-component (2K) curable composition comprising: a first component comprising: a) at least one epoxy resin; and, a second component comprising: b) a mixture of polyamines of which each polyamine h...
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WO/2024/079077A1 |
The invention relates to a coating composition comprising a binder component and a curing component. The binder component comprises an epoxy resin, and the curing component comprises a cycloaliphatic amine and an aromatic Mannich base cu...
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WO/2024/080455A1 |
The present invention relates to a method for manufacturing a heat-dissipating film, comprising the steps of: preparing a first mixture by mixing hexagonal boron nitride and an organic solvent; conducting first surface-modification of th...
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WO/2024/080255A1 |
The present invention discloses a method for producing a semiconductor device. The method for producing a semiconductor device comprises: a resin film formation step for forming, on a semiconductor wafer, a resin film including a resin w...
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WO/2024/075342A1 |
Provided are an epoxy resin composition whereby it is possible to achieve both injectability and reliability, a semiconductor device, and a method for producing the semiconductor device. The epoxy resin composition contains a polyalkyl...
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WO/2024/075602A1 |
The present invention provides a low-temperature-curable epoxy resin composition that achieves both excellent adhesive strength and ink resistance. Provided is an epoxy resin composition that includes components (A)–(C), the epoxy resi...
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WO/2024/075480A1 |
Disclosed are: a thermosetting resin composition which contains an epoxy resin (component (A)), a (meth)acrylate compound (component (B)), an epoxy resin curing agent (component (C)) and a thermal radical polymerization initiator (compon...
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WO/2024/076408A1 |
Provided herein is a novel monomer for making polymers, in particular adhesives, and adhesives made with said novel monomer.
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WO/2024/075343A1 |
The present invention provides: an epoxy resin composition which can be applied by means of a jet dispenser, while having good injectability; a semiconductor device; and a method for producing a semiconductor device. This epoxy resin c...
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WO/2024/075585A1 |
The present invention provides a photosensitive resin composition which contains (A) a silicone resin having a glycidyl group, (B) a photo-cationic polymerization initiator, and (C) quantum dots, and which is characterized in that the qu...
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WO/2024/070902A1 |
Provided is a compound represented by formula (1). (In the formula, R1 represents a hydrogen atom or a methyl group; R2 represents an alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms, an aryl group whi...
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WO/2024/071133A1 |
Provided is a silicon-atom-containing UV-curable composition that has exceptional workability when applied to a substrate and that, being cured, yields a product having exceptional mechanical properties and low outgassing characteristics...
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WO/2024/071129A1 |
Provided are: an epoxy resin composition that exhibits excellent low dielectric properties and excellent copper foil peeling strength and interlayer adhesive strength in printed wiring board uses; and an active ester resin that provides ...
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WO/2024/071090A1 |
The present invention provides a prepreg comprising a fiber-reinforced base material and an epoxy resin composition that partially or totally impregnates the fiber-reinforced base material, wherein the prepreg is characterized in that th...
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WO/2024/069085A1 |
The invention relates to a two-component composition comprising: - a component (A) comprising: - at least one aromatic epoxy resin, and - a component (B) comprising: -a hardener (H) chosen from phenolic Mannich bases having at least one ...
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WO/2024/065363A1 |
The present disclosure provides an aminolysable benzoxazine resin cured product, and a preparation method and an aminolysis method therefor. The preparation method for an aminolysable benzoxazine resin cured product comprises a mixing st...
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WO/2024/070886A1 |
Provided is a phosphorus-containing phenol compound, a cured product of which has excellent flame retardancy, heat resistance, and dielectric properties, a low moisture absorption rate, and little change in dielectric properties after mo...
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WO/2024/070871A1 |
The problem addressed is to provide a method for producing bisphenol that can decompose a thermosetting resin cured product, utilize the properties of the bisphenol in the decomposition solution obtained, and again produce high-purity bi...
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WO/2024/068565A1 |
The present invention is directed to epoxy thermoset polymers comprising phosphorous and phosphonate triple-bonded epoxy thermosets with the phosphonate forming chain members within the epoxy thermoset polymer network and being covalentl...
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WO/2024/071323A1 |
A first object of the present invention is to provide a composition which has excellent curability and achieves excellent orientation when formed into an optically anisotropic layer. A second object of the present invention is to provide...
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WO/2024/070348A1 |
Provided is a resin composition with which it is possible to form a pattern having a high aspect ratio. This resin composition contains (A) a resin, (B) an oxetane compound, and a photocation polymerization initiator, the (A) resin inclu...
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WO/2024/069417A1 |
A method for making a composite material comprising at least one substrate and a covering layer applied to the substrate comprises the following steps: — providing a substrate containing a plurality of functional groups which are selec...
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WO/2024/070897A1 |
With regard to a film for protecting the circuit wiring or the sensor electrode of a circuit sheet or a sensor sheet, the present invention makes it possible to form a protective film which has reduced thickness and has an exceptional ab...
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WO/2024/071101A1 |
Provided is a phosphorus-containing polycyclic aromatic hydroxy compound that yields a cured product with excellent flame retardancy, heat resistance, and dielectric properties, in which the water absorption rate is low, and in which the...
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WO/2024/063130A1 |
The resin composition contains compound (A) having a (meth)acryloyl group, compound (B) having an epoxy group and/or an oxetanyl group, radical polymerization initiator (C) and cationic polymerization initiator (D). The hydrogen bonding ...
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WO/2024/064047A1 |
Aspects of the disclosure relate to compositions for forming films and the use of the films in large die applications. In certain aspects, the disclosure relates to compositions comprising two or more resins, optionally, one or more inor...
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WO/2024/063019A1 |
Provided are: an amino compound represented by general formula (1); a method for producing the amino compound; an epoxy resin curing agent comprising the amino compound; an epoxy resin composition; and a cured product of the epoxy resin ...
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WO/2024/064659A1 |
A multi-layer coating system comprising: an undercoat coating layer derived from a UV curable undercoat coating composition, the UV curable undercoat coating composition comprising: a1) an epoxy material; b1) a polyol material having a h...
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WO/2024/060177A1 |
The present invention provides a method for degrading an anhydride epoxy cured product, a polyol prepared therefrom, and a thermosetting resin. The method for degrading the anhydride epoxy cured product comprises carrying out a mixing st...
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WO/2024/062904A1 |
The purpose of the present invention is to provide a resin composition having favorable elongation in a cured product, a cured product that uses the resin composition, a camera module, and an electronic device. That is, provided is a r...
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