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WO/2023/032971A1 |
An epoxy resin composition for compression molding which comprises an epoxy resin including a polycyclic structure and/or two or more cyclic structures, a hardener, and an inorganic filler, the content of the inorganic filler being 87.0 ...
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WO/2023/032860A1 |
In a chart regarding this curable resin composition which is obtained by performing dynamic viscoelasticity measurement of a cured resin product of the curable resin composition and in which tan δ is the vertical axis and the horizontal...
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WO/2023/027154A1 |
The present invention addresses the problem of providing a resin composition from which a cured product having excellent crack resistance can be obtained. The present invention is a resin composition comprising (A) an epoxy resin, (B) an...
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WO/2023/026872A1 |
A problem addressed by the present invention is to provide a resin composition, an adhesive, or a sealing material that gives a cured product having reworkability at a specific temperature that does not have a thermal effect on parts. Th...
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WO/2023/027158A1 |
The present invention provides a thermally conductive composition which has excellent thermal conductivity, processability, and long-term reliability. The thermally conductive composition comprises: 100 parts by mass of an epoxy resin ...
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WO/2023/026850A1 |
The present invention addresses the problem of providing: a novel benzoxazine compound which has excellent heat resistance, and is able to be cured under low-temperature conditions; a resin starting material composition which contains th...
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WO/2023/022046A1 |
A composition comprising an epoxy resin A1 having an epoxy group, an epoxy curing accelerator A2, an acrylic compound B1 having a (meth)acryl group, and a free-radical polymerization initiator B2, wherein the ratio (A/B) between the mass...
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WO/2023/020968A1 |
The present invention relates to a heat-curable-reaction-resin mixture suitable for impregnation or encapsulation material for coils, stators, rotors in electric engine, which reaction-resin mixture comprises: a) A polyfunctional isocyan...
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WO/2023/021900A1 |
To provide an active ester compound used in an epoxy resin cured product that exhibits an excellent loss tangent. An active ester compound characterized by having a dimer acid skeleton and/or a dimer diol skeleton in the molecule.
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WO/2023/022148A1 |
The present invention provides: an epoxy composition configured for reduced viscosity, etc., where even when some heat is applied, progression of curing and a subsequent rise in viscosity are not promoted; an adhesive agent containing th...
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WO/2023/021891A1 |
An ultraviolet-curable composition which contains a component (A) which is a polymerizable compound and a component (B) which is a filler, wherein: the average value of the parallel light transmittance at a wavelength of 380-780nm throug...
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WO/2023/017666A1 |
Provided is a polymer that includes a silphenylene skeleton, an isocyanuric acid skeleton, and a hydroxy-group-substituted alkyl ether skeleton in the main chain, and that includes an epoxy group in a side chain.
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WO/2023/018274A1 |
The present invention relates to a graft copolymer and, specifically, to a graft copolymer composition, a curable resin composition comprising same, and methods for preparing the compositions, wherein the graft copolymer composition has ...
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WO/2023/017734A1 |
Provided is a crosslinked polyester resin which has the property of undergoing covalent-bonding exchange at a temperature of 150°C or higher and has a gel content of 80 mass% or higher. The crosslinked polyester resin is a resin in wh...
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WO/2023/017729A1 |
A fiber-reinforced composite material which is configured of a stitched reinforcing-fiber base and a cured resin obtained by curing an epoxy resin composition comprising a hardener A, a hardener B, a hardener C, an epoxy resin D, an epox...
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WO/2023/017855A1 |
Provided are: a resin composition which exhibits a low initial viscosity immediately after the production thereof, can be thickened at a proper speed, and has excellent handling properties; a method for producing the resin composition; a...
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WO/2023/017854A1 |
A resin composition comprising (A) a vinyl ester resin, (B) a monomer containing an ethylenically unsaturated group, (C) at least one compound selected from an alkaline earth metal oxide and an alkaline earth metal hydroxide, and (D) at ...
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WO/2023/018304A1 |
The present invention relates to a graft copolymer and, specifically, to a graft copolymer composition, a curable resin composition comprising same, and methods for preparing the compositions, wherein the graft copolymer composition has ...
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WO/2023/010442A1 |
The present disclosure relates to an amine composition comprising a) an alkylated diamine b) a tertiary amine; and c) a polyoxyalkyleneamine. Also disclosed are an epoxy system prepared from the amine composition and an epoxy resin and u...
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WO/2023/013495A1 |
A resin composition having low warpage and excellent heat resistance, characterized by: containing, based on 100 total mass parts of (A)-(C), 25-48 mass parts of a polyphenylene sulfide resin (A) having an MVR measured at 295°C under 1....
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WO/2023/013092A1 |
The present invention provides: an epoxy resin mixture which has excellent mechanical strength and toughness at room temperature and in a high-temperature region; an epoxy resin composition; and a cured product thereof. The epoxy resin m...
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WO/2023/013710A1 |
The present invention provides a prepreg which comprises a base material and a thermosetting resin composition that is impregnated into or applied to the base material; and a cured product for evaluation, which is obtained by thermally c...
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WO/2023/014508A1 |
A reversible epoxy polymer obtainable by the reaction between at least one epoxy compound and at least one curing agent, wherein at least part of the epoxy compound contains one reversible borate moiety or derivative thereof per molecule...
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WO/2023/013487A1 |
The present invention addresses the problem of providing a multicomponent curable composition capable of providing a cured product having excellent tensile properties and tear strength. Provided is a multicomponent curable composition in...
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WO/2023/006005A1 |
Embodiments of the present application provide an epoxy resin, which has an aromatic polycyclic skeleton. An epoxy group having at least one alkoxysilyl group and at least two β-band substituents are grafted on the aromatic polycyclic s...
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WO/2023/008351A1 |
The present invention provides a transparent resin composition with which it is possible to form a cured product having excellent resistance to warping and yellowing. This transparent resin composition includes: (A) an epoxy resin that...
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WO/2023/006598A1 |
The invention relates to the use of a hardener that contains at least one amine of formula (I), for curing epoxy resins. The amine of the formula (I) has a high renewable carbon index (RCI) and allows for especially sustainable epoxy res...
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WO/2023/005396A1 |
Disclosed in the present application are chip packaging underfill and a chip packaging structure. The underfill comprises 19-25% by mass of epoxy resin, 55-60% by mass of a filler, 15-25% by mass of a curing agent, and 0.5-0.8% by mass o...
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WO/2023/008542A1 |
The present invention aims to provide a curable resin composition that has excellent curing characteristics and a high refractive index for cured products. In addition, the present invention aims to provide a sealant for display elements...
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WO/2023/008350A1 |
The present invention provides a transparent resin composition with which it is possible to form a cured product having excellent storage stability, as well as excellent resistance to yellowing and strong adhesion to glass. This transp...
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WO/2023/008231A1 |
The present invention provides an epoxy resin and a curable resin composition, a cured product thereof having excellent heat resistance, flame resistance, and tracking resistance. This epoxy resin is represented by formula (1). (In for...
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WO/2023/008492A1 |
A hardcoat film (11) is equipped with a hardcoat layer which contains a cured article of a silsesquioxane compound and is located on one or more main surfaces of a resin film (1). The silsesquioxane compound contains a structure represen...
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WO/2023/006741A1 |
The present invention relates to a binder system comprising: (i) an epoxy-based binder; (ii) trimethylolethane triglycidyl ether; (iii) a curing agent; and (iv) a homopolymerisation accelerator, wherein the wt% of trimethylolethane trigl...
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WO/2023/007439A1 |
A curable, one-part, dual-stage thiol-ene-epoxy liquid adhesive composition, articles, and methods, wherein the composition includes: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule; a t...
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WO/2023/007942A1 |
The present invention provides an epoxy resin curing agent comprising: a component (a1), a polyether polyamine; a component (a2), an aliphatic polyamine having an alicyclic structure; and a component (a3), an aliphatic polyamine having a...
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WO/2023/003011A1 |
This thiol-containing composition contains a polyfunctional secondary thiol compound (A) and a disulfide dimer (B). The polyfunctional secondary thiol compound (A) is an ester of a carboxylic acid having a secondary mercapto group and a ...
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WO/2023/000582A1 |
The present disclosure relates to a preparation method for a two-component epoxy resin adhesive and the two-component epoxy resin adhesive prepared thereby. The preparation method comprises the following steps: mixing an epoxy compound a...
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WO/2023/002902A1 |
The present invention addresses the problem of providing: a phenol mixture that is optimal as an epoxy resin production raw material and that is capable of realizing the high heat resistance required in recent years; and an epoxy resin, ...
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WO/2023/286701A1 |
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a U...
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WO/2023/286728A1 |
This resin composition for semiconductor sealing includes an epoxy resin (A), a curing agent (B) containing a phenol resin (B1) and an active ester resin (B2), and a curing accelerator (C). The active ester resin (B2) has a structure rep...
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WO/2023/288149A1 |
Room temperature, two-component curable compositions and their uses are described. The curable compositions are alternative to isocyanate systems and are kinetically tunable to cure within seconds to months. The curable compositions are ...
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WO/2023/286499A1 |
This epoxy resin composition comprises: a component (A) which is an epoxy resin; a component (B) which is a microcapsule-type curing agent; a component (C) which is a reactive diluent; and a component (D) which is a compound represented ...
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WO/2023/286699A1 |
The present invention addresses the problem of providing a UV-curable resin composition that provides a flexible cured product having a lower crosslinking density than conventional cured products. The present invention comprises the foll...
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WO/2023/285221A1 |
The present invention relates to epoxide-acrylate hybrid molecules, and their use in the resin component of a multi-component reactive resin composition for chemical anchoring. Furthermore, the invention relates to a multi-component reac...
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WO/2022/265096A9 |
The present invention provides an epoxy resin and a curable resin composition which give cured objects having excellent heat resistance and tracking properties. The epoxy resin is represented by formula (1) and has a value obtained by ...
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WO/2023/285188A1 |
The invention relates to the use of an amine of formula (I) for curing epoxy resins. The amine of formula (I) cures surprisingly fast, and in a trouble-free manner, provides a high final hardnesses, and produces beautiful, defect-free su...
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WO/2023/285255A1 |
The invention relates to an amine of formula (I) and its use for curing epoxy resins. According to the invention, the amine of formula (I) has a low viscosity and odour, and cures surprisingly fast, at ambient temperatures, to a material...
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WO/2023/286700A1 |
The present invention addresses the problem of providing a UV/heat-curing type curable resin composition which exhibits sufficiently high adhesion strength even after having only undergone either a UV-curing treatment or a heat-curing tr...
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WO/2023/285220A1 |
The present invention relates to epoxy resin mixtures comprising epoxide-acrylate hybrid molecules, and their use in the resin component of a multi-component reactive resin composition for chemical anchoring. Furthermore, the invention r...
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WO/2023/285189A1 |
The invention relates to the use of an amine of formula (I) for curing epoxy resins, whereby synthetic resin products with a surprisingly high glass transition temperature are formed with particularly low exotherm. According to the inven...
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