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WO/2023/174747A1 |
The present invention relates to a method for preparing a curable composition based on ground composite material from the recycling of discarded composite elements such as old pipes or rotor blades of wind power plants. The ground compos...
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WO/2023/176883A1 |
A cured resin product obtained by curing the epoxy resin composition containing an epoxy resin of the present invention for two hours at 180°C has a thermal diffusivity at 25°C, measured based on ASTM E1461-01 (2001), of from 0.17 mm2/...
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WO/2023/176641A1 |
A composition containing tricyclodecanedimethanols, said tricyclodecanedimethanols including a chiral compound A of which one mirror isomer is indicated by formula (I), a chiral compound B of which one mirror isomer is indicated by formu...
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WO/2023/176934A1 |
The present invention addresses the problem of providing: an epoxy resin composition having excellent viscosity stability and attaining high compression characteristics under wet heat conditions and high fracture toughness; and a fiber-r...
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WO/2023/176820A1 |
Provided are: a resin composition for optical-semiconductor encapsulation which has a black color for heightening the contrast of a display and has adequate light-transmitting properties; and a shaped resin object for optical-semiconduct...
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WO/2023/176935A1 |
[Problem] To provide an epoxy resin composition for resin transfer molding having low viscosity and volatility, a cured resin product of which will have excellent balance among elastic modulus under damp heat conditions, heat resistance ...
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WO/2023/171027A1 |
One aspect of the present invention relates to a stretchable resin composition which comprises an epoxy resin and a hardener, wherein the epoxy resin has a weight-average molecular weight of 50,000-3,000,000 and an average-molecular-weig...
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WO/2023/170891A1 |
Provided are: an insulating resin composition which contains a biomass material as a starting material and nevertheless can give cured objects having a better surface touch; a cured object obtained from the insulating resin composition; ...
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WO/2023/171572A1 |
The purpose of the present invention is to provide an epoxy resin composition which contains a reactive diluent that is capable of decreasing the viscosity of an epoxy resin with a minimum deterioration in the normal performance of the e...
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WO/2023/171028A1 |
Provided is a resin composition that is used as a capillary underfill (CUF) capable of further reducing filament cracking. Provided is a resin composition containing (A) an epoxy resin, (B) a curing agent, and (C) a filler. A cured pro...
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WO/2023/169893A1 |
The invention relates to a curable adhesive substance comprising the following, in relation to the mass of the curable adhesive substance: a) one or more (meth)acrylate block copolymers X with an A-B-A structure in a combined mass fracti...
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WO/2023/166212A1 |
The invention provides a coating composition comprising components A and B, wherein component A comprises: i) 15 to 70 wt% of one or more epoxy-based binder, relative to the total weight of component A; ii) 20 to 60 wt% water, relative t...
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WO/2023/167513A1 |
The invention relates to an epoxy resin composition derived from a non-sugar alcohol composition and a preparation method therefor, and a curable epoxy resin composition including same and a cured product thereof. More specifically, the ...
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WO/2023/167505A1 |
The present invention relates to an epoxy resin composition derived from an anhydrosugar alcohol-alkylene glycol composition and a method for preparing same, and a curable epoxy resin composition comprising same and a cured product there...
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WO/2023/167049A1 |
The present invention addresses the problem of providing an epoxy resin composition that contains a bifunctional epoxy resin, a bifunctional compound, and a polymerization catalyst, that has sufficiently long pre-reaction working life, t...
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WO/2023/167014A1 |
The present invention addresses the problem of providing a resin composition and an adhesive with which a cured material, in which unreacted residues are suppressed after thermal curing following UV curing, can be obtained. Provided is...
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WO/2023/166973A1 |
The purpose of the present invention is to provide a curable resin composition that cures rapidly and can reduce the occurrence of bleed. That is, this curable resin composition comprises an epoxy resin, a latent curing agent, and an i...
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WO/2023/166367A1 |
A composition is described comprising an epoxy resin and a dicyandiamide salt comprising an anion selected from sulfonate or phosphonate. In typical embodiments, the dicyandiamide cation has the formula: wherein one or more of R1, R2, R3...
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WO/2023/167108A1 |
The present invention is a thermoplastic polyester elastomer resin composition which has both of excellent fluidability including retention stability and excellent hydrolysis resistance, and also has excellent mechanical properties. The ...
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WO/2023/167077A1 |
Provided are an epoxy resin composition containing an epoxy resin, an epoxy resin curing agent containing a reaction composition (A) that contains a reaction product of xylylene diamine and an alkylene oxide, and a nonreactive diluent, a...
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WO/2023/162975A1 |
A sealing resin composition according to the present invention contains an epoxy resin (A) and a curing agent (B) that includes a phenolic curing agent obtained from a plant-derived starting material.
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WO/2023/162718A1 |
Provided is a resin composition comprising a component (A) comprising at least one polymeric compound selected from the group consisting of polyamide, polyimide, polyamideimide and polybenzoxazole, a component (B) comprising a cationical...
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WO/2023/164000A1 |
Disclosed herein is a hydrolytic depolymerization of post-consumer polyesters such as polyethylene terephthalate (PET) mixed plastics containing clear PET and colored PET into depolymerized-polyester product including one or more of a de...
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WO/2023/163113A1 |
This encapsulant for an organic EL display element contains a cationic-polymerizable compound, a cationic polymerization initiator, a UV absorber, and a compound having phenolic hydroxyl groups. The mass ratio of the compound having phen...
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WO/2023/162905A1 |
A resin composition comprising a precursor of a cyclization resin, a base generator having a structure which generates a basic compound by the action of at least one of light, heat, an acid, and a base and having two or more polymerizabl...
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WO/2023/161771A1 |
Curable compositions include a non-aromatic epoxy-functional epoxy resin adduct, a non-aromatic epoxy resin, and a non-aromatic anhydride-based curing agent. The epoxy resin adduct is the reaction product of a reaction mixture including ...
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WO/2023/161597A1 |
A two-part epoxy resin composition is provided comprising: a first resin part comprising a modified hydroxy alkyl urethane and an epoxy component; and a second resin part comprising an amine component; wherein the modified hydroxy alkyl ...
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WO/2023/162785A1 |
The present disclosure addresses the problem of providing a resin composition which is capable of achieving a lower thermal expansion coefficient by suppressing the occurrence of ion migration. A resin composition according to the presen...
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WO/2023/162928A1 |
Provided is a resin composition that can enhance heat dissipating ability of an obtained cured product and that can enhance the flexibility of the obtained cured product. A resin composition according to the present invention contains ...
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WO/2023/163026A1 |
The purpose of the present invention is to provide a bisphenol production method in which, using a highly-versatile catalyst, a polycarbonate resin is decomposed with a high level of reactivity to produce bisphenol. Provided is a bisph...
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WO/2023/162295A1 |
This resin cured product exhibits the scattering intensity peak maximum value when the scattering angle 2θ is in the range of 0.2° to 5° in a scattering profile measured by a small-angle X-ray scattering method, and exhibits a diffrac...
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WO/2023/162693A1 |
Provided are: an epoxy resin which is useful as an insulating material for electrical/electronic components, exhibits excellent handleability as a solid at ordinary temperatures, has a low viscosity at the time of molding, and exhibits e...
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WO/2023/157772A1 |
Provided is a protective film forming composition for forming a protective film that protects, from wet etching, an inorganic film of a semiconductor substrate on the surface of which the inorganic film is formed, said composition contai...
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WO/2023/157750A1 |
A purpose of the present invention is to provide a resin composition for fiber-reinforced plastics which is suitable for improving the strength of fiber-reinforced plastics, has an excellent balance between pot life and curability, and h...
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WO/2023/157542A1 |
Provided is a resin composition capable of giving cured objects which, even in semiconductor chip packages which are, for example, enlarged ones, are inhibited from cracking or causing delamination and from warping. The resin composition...
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WO/2023/156145A1 |
A composition, process, and device are disclosed. The composition includes a polymer formed by reacting an epoxy compound with an amine curing agent. The epoxy compound comprises a Diels-Alder dimer and an ester moiety. The process inclu...
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WO/2023/157590A1 |
Provided is a novel polyhydric phenolic resin that provides a cured product having excellent toughness. The polyhydric phenolic resin (X) contains a polydiene skeleton, and is characterized by containing a structural unit represented by ...
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WO/2023/156684A1 |
The present invention relates to conductive self-healing composite materials and uses thereof in various domains, such as additive manufacturing, electronics and robotics. Furthermore, the present invention relates to a method for self-h...
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WO/2023/157507A1 |
The present invention addresses the problem of providing: a prepreg having excellent mechanical properties such as strength or elastic modulus, excellent appearance such as low coloring, transparency, or weather resistance, and excellent...
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WO/2023/153387A1 |
This polymerizable composition contains a cation-polymerizable compound, a photocationic polymerization initiator, and a tertiary amine. The blending ratio of the tertiary amine is 60 parts by mass or more with respect to 100 parts by ma...
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WO/2023/153196A1 |
Excellent adhesive strength can be maintained to improve product reliability, even after storage under high humidity, by a curing agent (B) for an epoxy resin, the curing agent (B) containing a reactive terminated polydiene (B1), a react...
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WO/2023/153160A1 |
Provided are: a phenolic resin having a specific structure used to obtain an epoxy resin having low viscosity and excellent handling properties, or the epoxy resin that can be used to obtain a cured product having low water absorption an...
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WO/2023/153435A1 |
Provided is a prepreg in which the toughness and elastic modulus of a cured product thereof are improved. In an embodiment of the prepreg according to the present invention, a matrix resin composition and carbon fibers are contained, the...
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WO/2023/153103A1 |
This photosensitive resin composition comprises: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) an inorganic filler; and (E) a heat-curable resin, wherein co...
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WO/2023/154154A1 |
A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-re...
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WO/2023/149221A1 |
This resin composition for injection molding includes at least one kind of wax (a) having a <80°C melting point.
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WO/2023/149328A1 |
Provided is a two-component thermally conductive resin composition which can be cured at room temperature, and a cured product of which has a sufficient resin stretching ratio. The two-component thermally conductive resin composition com...
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WO/2023/147993A1 |
The invention provides a cationically polymerisable material which, in the cured state, is highly flame retardant. The cationically polymerisable material is liquid at room temperature and comprises the following components: (A) at least...
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WO/2023/149521A1 |
Provided is a resin composition with which it is possible to obtain a cured product wherein the dielectric loss tangent can be kept low and increases in the melt viscosity can be suppressed. This resin composition contains (A) a silane c...
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WO/2023/149209A1 |
The object of the present invention is to provide a resin composition, etc., from which a cured product having excellent insulation reliability under high temperature and high humidity environments can be obtained, even in the case of a ...
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