Title:
POLYHYDRIC PHENOLIC RESIN, AS WELL AS RESIN COMPOSITION, CURED PRODUCT THEREOF, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/157590
Kind Code:
A1
Abstract:
Provided is a novel polyhydric phenolic resin that provides a cured product having excellent toughness. The polyhydric phenolic resin (X) contains a polydiene skeleton, and is characterized by containing a structural unit represented by formula (1). (In formula (1), Rp1 and Rp3 each independently represent a hydrogen atom, a methyl group, or an ethyl group, Rp2 represents a hydrogen atom, a methyl group, or a bond, one of X1 and X2 represents a hydroxy group while the other represents a monovalent group represented by formula (2), and * represents a bond. The C-C bond structure in formula (1) is a portion of the polydiene skeleton. In formula (2), each RS independently represents a substituent, * represents a bond, and n represents a number from 0 to 4.)
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Inventors:
OGURA ICHIRO (JP)
SATO NAOYA (JP)
SATO NAOYA (JP)
Application Number:
PCT/JP2023/002255
Publication Date:
August 24, 2023
Filing Date:
January 25, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08F8/00; C08C19/20; C08G59/02; C08G59/40; C08J5/24; H01L23/29; H01L23/31
Foreign References:
JP2001081240A | 2001-03-27 | |||
CN113234186A | 2021-08-10 | |||
JPS60105660A | 1985-06-11 | |||
JP2021004339A | 2021-01-14 | |||
JP2013184999A | 2013-09-19 | |||
JPS60199024A | 1985-10-08 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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