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WO/2022/190746A1 |
A curable resin composition which contains (A) a cyanate ester resin, (B) an epoxy resin that indispensably includes at least 4-amino-3-methylphenol type epoxy resin and (C) a latent curing agent. It is preferable that the cyanate ester ...
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WO/2022/191328A1 |
One embodiment of the present invention is a single-layer film composed of a layer of a cured product of a composition including a polyorganosiloxane compound having an epoxy group. The polyorganosiloxane compound is a condensate of a si...
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WO/2022/190745A1 |
A curable resin composition that contains (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen–containing amine latent curing agent, and (D) an ion scavenger. The (A) cyanate ester resin is preferably one type of compo...
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WO/2022/186203A1 |
The present invention provides an epoxy-based composition that has excellent fluidity, low heat generation during curing, cures in a short time at room temperature, and can be used to obtain a cured product having excellent mechanical st...
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WO/2022/186219A1 |
The present invention addresses the problem of providing a resin composition capable of giving cured objects which can have a lower dielectric dissipation factor, can be inhibited from having cracks after desmearing, and have an excellen...
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WO/2022/185832A1 |
The present invention relates to an epoxy resin composition having excellent low-temperature curability and excellent permeability through narrow clearances. This epoxy resin composition contains components (A) through (C). Component (A)...
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WO/2022/186361A1 |
Provided is a curable resin composition containing: an epoxy resin; a curing agent; and a linear polysiloxane compound that has a structural unit having an epoxy group and an alkoxy group, and that also has a polymerization degree of 3 o...
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WO/2022/186312A1 |
The purpose of the present invention is to provide a protection film which has high chemical solution resistance, satisfactory optical parameters, and desirable dry etching selectivity in a lithographic process in the production of a sem...
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WO/2022/186292A1 |
The present invention provides an epoxy resin which enables the achievement of a cured product that is excellent in terms of heat resistance, high thermal conductivity, low thermal expansion properties and the like, and which is useful i...
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WO/2022/186231A1 |
Provided is a resist underlayer film which, while exhibiting excellent resistance to a resist developer which is a resist solvent or an alkaline aqueous solution, exhibits removability, and preferably solubility, only in wet etching chem...
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WO/2022/186144A1 |
As a composition for forming a release layer, which yields a release layer that exhibits high heat resistance and suitable release properties and exhibits excellent stability following film formation, the present invention provides a com...
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WO/2022/186101A1 |
[Problem] To provide a fast-curing epoxy resin composition having a long pot life. [Solution] An epoxy resin composition containing a curing agent A, a curing agent B, a curing agent C, an epoxy resin D, an epoxy resin E, and resin parti...
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WO/2022/181158A1 |
Provided are: a coloring composition with which low illuminance dependence is achieved with respect to the obtained line width of pixels and superior temporal stability is achieved with respect to the sensitivity; a film; a color filter;...
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WO/2022/180175A1 |
The present disclosure generally relates to a one component epoxy resin-based composition including an epoxy resin, a reactive diluent, a cyanoacetamide derived from a cycloaliphatic-type diamine and a polyoxyalkylene amine, a protected ...
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WO/2022/180156A1 |
The present invention relates to a reactive flame-proof composition for vinyl polymers, consisting at least of a first monomer and a second monomer that can be polymerised using the first monomer, wherein the first monomer has at least o...
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WO/2022/179827A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.% of a) at least one oxetane compound according to Formula (I) wherein: R1 and R2 ar...
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WO/2022/179826A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.%, of a) at least one oxetane compound according to Formula (I) wherein: R1, R2, R3,...
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WO/2022/176608A1 |
Provided is a cationic curing agent comprising porous particles and a mixture supported thereon, the mixture comprising a compound of general formula (1), wherein R1-R3 are the same and R4-R6 are the same and a compound of general formul...
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WO/2022/175303A1 |
The invention relates to an insulation system for an electrically rotating machine, in particular an electric motor and/or a generator. The invention also relates to a method for producing such an insulation system, in particular for pro...
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WO/2022/175664A1 |
A mild surfactant composition for use in personal care and/or detergent compositions. The composition comprises a surfactant which is mild and/or non-irritating to skin. The mild surfactant is the reaction product of (a) an epoxidised ca...
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WO/2022/175140A1 |
The invention relates to a method for producing polyether-modified aminofunctional polybutadienes and to polyether-modified aminofunctional polybutadienes that can be produced according to this method, said method comprising the followin...
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WO/2022/176324A1 |
Provided are an epoxy resin that can increase durability when used together with a rubber material, and a production method for the epoxy resin. The present invention is characterized in that a diene polymer is grafted to the main chai...
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WO/2022/176976A1 |
Provided is a photosensitive colored composition which is less apt to roughen the electrode surface through a heat treatment. This photosensitive colored composition is characterized by comprising (a) a colorant, (b) an alkali-soluble re...
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WO/2022/173088A1 |
The present invention relates to an additive for an epoxy adhesive, and a structural epoxy adhesive composition comprising same. The additive for an epoxy adhesive according to the present invention may have excellent dispersibility and ...
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WO/2022/165729A1 |
The present invention discloses a waterborne amine curing agent, process of making such curing agent, and curable amine-epoxy compositions. The curing agent comprises the product of the reaction of a first polyamine containing primary am...
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WO/2022/168670A1 |
The purpose of the present invention is to provide a charge transfer complex which enables the achievement of a curable resin composition that has an excellent balance between curability and storage stability if used as an epoxy resin cu...
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WO/2022/168707A1 |
The purpose of the present invention is to provide a photocurable resin composition for electronic devices which has excellent applicability and, after curing, has excellent heat resistance and which gives cured objects having a low perm...
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WO/2022/168815A1 |
[Problem] To provide: a composition for curable resins for obtaining a cured product that is reduced in the molding shrinkage and linear expansion coefficient, while having high heat resistance, the composition for curable resins having ...
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WO/2022/168620A1 |
Provided is a curable composition that can suppress thermal degradation of a tetraazaporphyrin compound so that a lens having high visibility and excellent anti-glare and contrast enhancement effects can be achieved. The curable compos...
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WO/2022/167686A1 |
Herein described is an epoxy system comprising an epoxy resin and a phenolic polymer having a number average molar mass Mn of from 200 to 1,500 g/mol. Use of the phenolic polymer in epoxy resins provides for accelerated curing of the epo...
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WO/2022/168892A1 |
This polymerizable composition comprises: an episulfide compound represented by formula (1); a polyiso(thio)cyanate compound; a polythiol compound; and an epoxy compound (X) that includes one or more epoxy groups per molecule and that do...
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WO/2022/168665A1 |
The purpose of the present invention is to provide a material from which a curable resin composition having an exceptional balance of curability and storage stability can be obtained. The present invention is a compound represented by ...
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WO/2022/168666A1 |
The purpose of the present invention is to provide a curable resin composition having an excellent balance between curability and storage stability. The curable resin composition according to the present invention contains: (A) an epox...
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WO/2022/168694A1 |
The present invention provides an encapsulating resin composition for use in encapsulating a GaAs chip, wherein the die shear strength measured under condition 1 is more than or equal to 1.5 N/mm2. (Condition 1) The sealing resin composi...
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WO/2022/168806A1 |
Provided is a negative photosensitive composition which is for forming a top plate section of a hollow structure, and which comprises: an epoxy group-containing compound; a cationic polymerization initiator; a polyfunctional (meth)acryla...
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WO/2022/162805A1 |
The present invention provides: an insulating resin composition which improves the surface tactility of a cured object; a cured product of the composition; a rotary machine coil having favorable surface tactility; and a rotary machine us...
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WO/2022/163555A1 |
The present invention addresses the problem of providing a production method having higher safety and efficiency in a method for producing a target benzoxazine compound that does not create a sudden temperature rise or smoke when introdu...
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WO/2022/161847A1 |
The invention relates to an amino-functional adduct from the reaction of at least one amine of formula (I) with at least one epoxy novolac resin having an average functionality in the range of 2.5 to 4. The adduct is liquid at room tempe...
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WO/2022/163611A1 |
The present invention addresses the problem of providing an epoxy resin composition that has a low viscosity and excellent impregnation properties; that is stable due to the capability of suppressing an increase in viscosity even at an i...
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WO/2022/163795A1 |
The present invention provides a curable composition comprising: a vinyl group-bound monoepoxy compound represented by formula (1); and a radical polymerization initiator.
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WO/2022/163676A1 |
The present invention provides: a composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, eac...
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WO/2022/161837A1 |
The present invention relates to the use of boronic acids to increase the storage stability of epoxy resin compositions and to epoxy resin compositions comprising an epoxy resin, a hardener and a boronic acid.
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WO/2022/163673A1 |
The present invention provides: a composition for forming a resist underlayer film that enables the formation of a desired resist pattern; and a method for producing a resist pattern and a method for producing a semiconductor device, eac...
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WO/2022/161846A1 |
The invention relates to an anti-corrosion coating comprising: - at least one epoxy novolac resin having an average functionality of at least 2.3; - at least one amine of formula (I): Z—NH—A—NH—CH2—Y, wherein A represents a div...
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WO/2022/159777A1 |
Poly(cyclic acetal)s, methods of making same, and uses of same. The poly(cyclic acetal)s may have a number average molecular weight (Mn) of 10 to 3000 kiloDaltons (kDa) and over 50% of the chain ends may exclude hydroxyl groups. The poly...
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WO/2022/158283A1 |
Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a carboxylic acid quaternary ammonium c...
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WO/2022/159801A1 |
A shape memory polymer foam comprising a reaction product of a reaction of an epoxide and a thiol monomer in the presence of an organobase is provided. In addition, a method of making the shape memory polymer foam is provided. The method...
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WO/2022/158527A1 |
A non-electroconductive flux is provided with which connected structures having enhanced impact resistance are obtained with heightened production efficiency, the flux being able to inhibit the occurrence of solder flush. This non-elec...
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WO/2022/158444A1 |
A resin molding composition comprises an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the ratio CTE1/CTE2 for the resin molding composition between the linear expansion coefficient CTE1 at a temperature below...
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WO/2022/151754A1 |
Disclosed in the present invention are a waterborne epoxy resin for an anti-corrosion coating, an application thereof, and a preparation method therefor. The preparation method for the waterborne epoxy resin achieves a self-emulsifying f...
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