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WO/2023/280560A1 |
The present invention is directed to a two component (2K) composition based on modified epoxy resins. More particularly, the present invention is directed to a two component (2K) composition comprising, as a first component, a silicone-b...
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WO/2023/277016A1 |
[Problem] To provide a composition that satisfies patterning properties, film-forming properties, and a high refractive index which are required for a composition for forming an optical waveguide by overcoming a trade-off therebetween. [...
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WO/2023/276851A1 |
Provided is an epoxy resin composition which has favorable melt-kneading properties at 100°C or less and exhibits excellent solvent solubility, produces a cured product thereof which exhibits excellent heat resistance, heat decompositio...
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WO/2023/276622A1 |
An aspect of the present invention pertains to a resin composition that is for an optical waveguide and that contains an epoxy resin and a curing agent. In the resin composition for an optical waveguide, the number of aliphatic compound-...
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WO/2023/277060A1 |
The present invention provides a laminate which exhibits excellent shock resistance. The purpose of the present invention is to provide: an electronic device and cover glass which are obtained using said laminate; and a resin composition...
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WO/2022/270536A1 |
The purpose of the present invention is to provide an epoxy-based material for obtaining a cured product for which the elastic modulus has been reduced in order to maintain reliability of the cured product even for situations in which en...
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WO/2022/270467A1 |
The purpose of the present invention is to provide a novel hydrazide compound. It is additionally the purpose of the present invention to provide: a curable resin composition that contains the hydrazide compound and that exhibits excepti...
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WO/2022/270471A1 |
This hard coating film (10) sequentially comprises, on a transparent film (1), a hard coating layer (3) and a top coating layer (5); and the top coating layer is positioned on the outermost surface. The hard coating layer has a thickness...
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WO/2022/267202A1 |
The present invention relates to the field of powder coatings. Specifically provided is a method for preparing a low-temperature cured powder coating by means of post-mixing. In the method, a composite nano low-temperature cured catalyst...
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WO/2022/271338A1 |
Amine-substituted copolymers that may include an amine-substituted 2-amino-ethan-1-ol moiety. Polyamic acids and polyimides, which may be formed by contacting an amine substituted copolymer with a dianhydride, or a dianhydride and a diam...
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WO/2022/270118A1 |
Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a benzotriazole compound.
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WO/2022/261739A1 |
The present disclosure provides diglycidyl ethers and esters of 2,4-furandimethanol (2,4- FDME) and of2,4-furandicarboxylicacid (2,4-FDCA), methods of making diglycidyl ethers and esters of 2,4-FDME and 2,4-FDCA, epoxy resins derived fro...
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WO/2022/265060A1 |
Provided is an epoxy resin which is represented by general formula (1). (In the formula, X denotes a nitrogen atom, CF, C(CmH2m+1) or C(Ph), A is an optionally substituted aromatic group, B1 and B2 are each independently a hydrogen atom ...
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WO/2022/263943A1 |
A curable composition and a method of making a cured composition are provided. The curable composition contains at least two parts with the first part containing three different types of curing agents that contain multiple -NHR1 groups (...
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WO/2022/259463A1 |
Provided is an epoxy resin prepolymer (4) that can be advantageously used as a material of an epoxy resin composition capable of yielding a cured product having high thermal conductivity. This epoxy resin prepolymer (4) is represented by...
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WO/2022/255272A1 |
An aqueous resin composition comprising an aqueous resin emulsion (α), a curing agent (β), and a curing accelerator (γ), wherein the aqueous resin emulsion (α) contains a copolymer (X), a polyepoxy compound (Y), and an aqueous medium...
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WO/2022/256783A1 |
The present invention relates to a powder coating composition including: an addition polymer including epoxy functional groups; a carboxylic acid functional crosslinker; and a blocked isocyanate functional crosslinker. The addition polym...
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WO/2022/255231A1 |
Provided are: a modified epoxy resin having excellent dielectric properties, heat conductivity, and fluidity; a resin composition containing said modified epoxy resin and a curing agent; a cured product thereof having excellent dielectri...
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WO/2022/253878A1 |
The present application is directed to a dual curing composition which may be cured at room temperature but which is also heat- and photo-curable, said composition comprising, based on the weight of the composition: from 10 to 95 wt.% of...
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WO/2022/254906A1 |
A thermoplastic epoxy resin including a product of reaction between a bifunctional epoxy compound, which has two glycidyl groups in the molecule, and one or more bifunctional thiol compounds, which each have two mercapto groups in the mo...
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WO/2022/255037A1 |
To provide a novel amino compound useful as an epoxy resin curing agent, a method for producing the same, etc., disclosed is an amino compound represented by formula (1) that has a quaternary carbon at the β-position of an amino group. ...
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WO/2022/255122A1 |
Provided are: a phosphorus-containing epoxy resin having exceptional flame retardancy and solubility; a resin composition containing said phosphorus-containing epoxy resin and a curing agent; a cured product of the resin composition, the...
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WO/2022/249282A1 |
The present invention provides a curable composition containing an elastomer (A), an epoxy resin (B), and a latent curing agent (C), wherein the latent curing agent (C) encompasses a combination of two or more types of latent curing agents.
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WO/2022/156832A9 |
Disclosed is a preparation method for a high-insulativity low-temperature electronic packaging material, relating to the field of electronic packaging materials. A modified epoxy resin and a modified boron nitrate are added to a high-spe...
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WO/2022/248266A1 |
The invention relates to a process for preparing hydrogenated polyether-modified polybutadienes and to hydrogenated polyether-modified polybutadienes that can be prepared according to this process, said process comprising the following s...
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WO/2022/249966A1 |
An objective of the present invention is to obtain: a polymer composition that can be used as a curing agent of an epoxy resin having a high curing rate even in a low temperature environment as well as low viscosity and favorable stabili...
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WO/2022/251804A1 |
The present disclosure is directed to a composite structure comprising at least one reinforced polymer layer comprising a reinforcing material; a layer comprising a metal substrate comprising a surface and a conformal organic coating pre...
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WO/2022/248267A1 |
The invention relates to a process for preparing hydrogenated polyether-modified amino-functional polybutadienes and to hydrogenated polyether-modified amino-functional polybutadienes that can be prepared according to this process, said ...
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WO/2022/242545A1 |
Disclosed in the present invention are a low-viscosity oxetane fluorine-containing polymer, a preparation method therefor, and an application thereof, as well as an energy curing composition containing the polymer. The polymer has a stru...
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WO/2022/239553A1 |
Provided is an underfill resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a polyether-modified silicone compound having a hydroxy group at an end of the main chain and/or in a side chain, wherein the ...
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WO/2022/239658A1 |
A liquid crystal alignment agent according to the present invention comprises the following components (A), (B), and (C). Component (A): at least one polymer (A) which is selected from the group consisting of polymers (A-1) having a ...
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WO/2022/239554A1 |
A resin composition for underfills which comprises an epoxy resin, a hardener, an inorganic filler, and one or more silicone compounds including a polyglycerin-modified silicone compound and/or a polyester-modified silicone compound.
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WO/2022/239955A1 |
The present invention relates to a flame-retardant curing agent for an epoxy, and more specifically, to a flame-retardant curing agent composition for an epoxy and a flame-retardant curing agent that is for an epoxy and comprises same, w...
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WO/2022/239846A1 |
Provided is a visible-laser-curable or infrared-laser-curable resin composition that cures in a shorter time and with less energy. A visible-laser-curable or infrared-laser-curable cationically polymerizable epoxy resin composition compr...
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WO/2022/239762A1 |
Provided is a photopolymerizable composition which contains: one or more types of compound selected from a compound represented by formula (1) and a compound represented by formula (2); a polymerizable compound; and a photopolymerization...
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WO/2022/239797A1 |
Provided is an epoxy resin composition including an epoxy resin (A), a curing agent (B), an imidazole adduct type curing promoter (C), and a Lewis acid compound (D) having boron atoms or aluminum atoms, wherein: the curing agent (B) incl...
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WO/2022/239471A1 |
Provided is a curable composition comprising an epoxy resin (A), an aliphatic amine compound and/or an alicyclic amine compound (B), core/shell particles (C), and an imidazole compound (D), wherein the ratio H/E between the number of mol...
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WO/2022/239439A1 |
Provided is a crosslinked polyester resin which, even when immersed in water, an organic solvent, etc., retains intact bond-exchange activity and undergoes bond-exchange rapidly. Also provided is a polyester resin which undergoes bond-ex...
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WO/2022/239674A1 |
Provided is a sealant for a display element, the sealant containing (A) a cationically polymerizable compound, (B) a cationic polymerization initiator, and (C) a levelling agent, wherein the drop diameter ratio R of the sealant for a dis...
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WO/2022/234823A1 |
The present invention provides a resin material which is capable of: (1) decreasing the dielectric loss tangent of a cured product thereof; (2) effectively removing smear by means of a desmear treatment; (3) enhancing the plating peel st...
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WO/2022/234776A1 |
Provided is a phenolic resin which is a reaction product of a catechol compound with an ortho-xylylene-skeleton-containing compound, the phenolic resin being characterized by having a catechol skeleton derived from the catechol compound ...
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WO/2022/234804A1 |
The present invention provides a method for decomposing a curable resin which is not susceptible to change in the physical properties even if exposed to an environment at 200°C, and which exhibits excellent durability at high temperatur...
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WO/2022/230745A1 |
The present invention provides a compound which is represented by formula (1). (In formula (1), each of R1, R2, R3 and R4 independently represents a hydrogen atom, a polymerizable functional group having 1 to 50 carbon atoms or an alkyl ...
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WO/2022/230768A1 |
Provided is an epoxy resin curable composition that cures quickly and has a high hardness and excellent color tone after curing. This epoxy resin curable composition, which contains an epoxy resin having two or more epoxy groups per mole...
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WO/2022/229760A1 |
In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one ep...
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WO/2022/231172A1 |
The present invention relates to: a multifunctional epoxy compound obtained by modifying two or more epoxide functional groups on terminal portions of liquid crystal molecules synthesized by bonding multiple thermotropic liquid crystal m...
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WO/2022/231233A1 |
The present invention relates to an epoxy resin with improved water resistance and a composition comprising same and, more specifically, to: an epoxy resin which is prepared by the reaction of epihalohydrin and a diol component including...
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WO/2022/229304A1 |
The invention relates to hydroxyl-functional thioether compound having formula (I). wherein Z is an n-valent hydrocarbyl group, optionally containing one or more moieties selected from an ether moiety, a thioether moiety and an isocyanur...
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WO/2022/224288A1 |
The invention concerns a composition suitable to be hardened comprising an epoxy resin, an unsaturated compound and a hardening compound. The composition is suitable to be hardened by means of UV photocatalysis and by means of thermal ca...
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WO/2022/220253A1 |
The purpose of the present invention is to provide a curable resin composition that has excellent heat resistance, thermal conductivity, and adhesiveness. Another purpose of the present invention is to provide a cured product of said cur...
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