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WO/2023/086555A2 |
An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine con...
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WO/2023/086039A1 |
The present invention relates to a thermal latent curing agent comprising one or more polyoxazoline based polymers and one or more curing agents, wherein the curing agents are: (i) physically entrapped in a matrix of the polyoxazoline ba...
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WO/2023/085357A1 |
The present invention provides a thermosetting resin composition used to form a seal member (65) in a stator (4) having: a stator core (41) that has a plurality of teeth (7) and a plurality of slots (8) formed in an alternating manner in...
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WO/2023/085295A1 |
A composition for forming a resist underlayer film for use in EB or EUV lithography, the composition containing a film-forming component and a solvent, the film-forming component containing at least 20 mass% of a specific structure-conta...
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WO/2023/083782A1 |
The present invention relates to compositions comprising: A) 75-95 wt.% of at least one epoxide compound; B) 3-22 wt.% of a curing-agent composition consisting of B1) at least one compound having at least two hydrogen atoms which are rea...
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WO/2023/086337A1 |
A shellac-substitute is described herein in the form of an acid-functional polymer or an acid-functional polyester polymer. The acid-functional polyester polymer, among other uses, is suitable for stain-blocking with coating compositions...
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WO/2023/082322A1 |
A curable resin composition, and a composite material and a preparation method therefor. A curing reaction of the curable resin composition is not only a reaction of a curing agent and an epoxy functional group, but also a composite reac...
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WO/2023/084904A1 |
An underwater curable epoxy resin composition and underwater curable paint containing the main component epoxy resin and an underwater curable epoxy resin curing agent containing a reaction composition (A) including a reaction product of...
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WO/2023/082230A1 |
The present invention belongs to the technical field of polymer alloys, and in particular relates to a polymer alloy, a preparation method therefor, and a use thereof. The preparation method provided by the present invention comprises: m...
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WO/2023/085414A1 |
Provided is a photo-curable resin composition that is useful for the formation of a wafer edge part protection film for use in the production of a semiconductor. The photo-curable resin composition comprises: a compound containing a poly...
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WO/2023/084913A1 |
Provided is an emulsion-type epoxy resin composition that contains: an epoxy resin (A); an epoxy resin curing agent (B) that contains an aromatic ring-containing polyamine compound or a modified product thereof; at least one type of resi...
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WO/2023/078480A1 |
The invention relates to a high molecular weight epoxy resin composition, prepared from a low molecular weight BPA-based epoxy resin with an epoxy equivalent of 172-500 g/mol with: (a) oligomers and/or monomers and/or polymers of dicyclo...
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WO/2023/078670A1 |
The present invention provides an aqueous dispersion of blocked polyisocyanate having neutralized amine obtainable or obtained by a process comprising steps of (a) reacting a polyurethane prepolymer having isocyanate groups with at least...
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WO/2023/077910A1 |
The present invention provides a preparation method for a curing agent composition, comprising the following steps: providing a first component and a second component; and mixing the first component and the second component, heating the ...
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WO/2023/079753A1 |
An epoxy resin composition containing an epoxy resin and a curing agent, wherein the cured product thereof has at least one of an adhesive strength to a silicon substrate of at least 6.0 MPa and an adhesive strength to a silicon nitride ...
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WO/2023/079752A1 |
An epoxy compound comprising one or more epoxy groups and a divalent saturated hydrocarbon group having one or more branches and 20-60 carbon atoms.
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WO/2023/080072A1 |
This resin curing agent comprises at least one compound selected from the group consisting of: an ester compound which includes, in a molecular structure, a partial structure represented by -C(CF3)H-, and at least two aromatic ester part...
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WO/2023/078664A1 |
The present invention provides a cathodic electrodeposition coating composition, which comprises (A) a cationic amino-containing epoxy resin, and (B) a blocked polyisocyanate having having neutralized amine, which is obtainable or obtain...
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WO/2023/074390A1 |
A liquid crystal aligning agent that enables obtaining a liquid crystal aligned film with high film strength and suppressed AC afterimage, a liquid crystal aligned film obtained from said liquid crystal aligning agent, and a liquid cryst...
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WO/2023/074812A1 |
[Problem] To provide an epoxy resin composition which contains an isocyanuric acid type epoxy compound and a liquid epoxy compound and which enables suppression of precipitation during storage and also has excellent flowability. [Solutio...
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WO/2023/074481A1 |
The present invention provides a compound (in particular, a curing agent) which enables the achievement of a cured product that has excellent flexibility and excellent dielectric characteristics, while maintaining adequate heat resistanc...
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WO/2023/076650A1 |
A color-changing two-part system for indicating proper mixing. The two-part system comprises a A-side and a B-side. The A-side and/or B-side comprises a reactive color-change agent (e.g., a pH sensitive dye). The B-side comprises one or ...
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WO/2023/072940A1 |
The present invention relates to a two-component epoxy resin composition, consisting of - a first component K1 comprising at least one epoxy resin A that contains on average more than one epoxy group per molecule; and - a second componen...
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WO/2023/074484A1 |
The purpose of the present invention is to provide: a resin composition that is suitably used for manufacturing an insulation layer for a printed wiring board and that has a high dielectric constant, a low dielectric loss tangent, a low ...
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WO/2023/072992A1 |
The invention relates to a Mannich base of formula (I) and to the use thereof as a component of a hardener for epoxy resins. The Mannich base of formula (I) has a high Renewable Carbon Index. It makes it possible to produce high-quality ...
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WO/2023/074204A1 |
Provided are: a phenolic resin having a specific structure and used for obtaining an epoxy resin having a low viscosity and excellent handleability; the epoxy resin from which a cured product having high heat resistance and high bending ...
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WO/2023/075988A2 |
Alkylene oxides are polymerized in the presence of a catalyst system that includes a double metal cyanide catalyst. At least one additive is present. The additive is an alkali metal, ammonium or quaternary ammonium salt of a monocarboxyl...
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WO/2023/074258A1 |
The present invention provides: an epoxy resin composition having excellent dielectric loss tangent and heat resistance; and a cured object thereof. This epoxy resin composition is characterized by being an active ester compound that c...
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WO/2023/074450A1 |
A clathrate compound that is obtained by mixing an (A) imidazole compound and a (B) polyvalent phenol compound, said clathrate compound having an average particle size (X) of 7 μm or less and a maximum particle size (Y) of 40 μm or les...
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WO/2023/072786A1 |
The invention relates to the use of a curing agent that contains at least one amine of formula (I), for crosslinking amino-reactive compounds. The amines of formula (I) are bio-based and can be prepared on the basis of vanillin or guaiac...
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WO/2023/074205A1 |
Provided are: a phenolic resin having a specific structure which is for use in obtaining an epoxy resin having a low viscosity and excellent handleability; the epoxy resin, from which cured objects having heat resistance and high bending...
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WO/2023/068089A1 |
An epoxy resin represented by formula (1) (In formula (1), each R independently represents a hydrogen atom or an alkyl group having 1-5 carbon atoms; p represents an integer of 0-4; q represents an integer of 0-3; and m and n respectivel...
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WO/2023/068175A1 |
Provided is a polymer wherein the main chain contains a silphenylene backbone, an epoxy group-containing isocyanuric acid backbone, and a norbornene backbone, and does not contain a siloxane backbone.
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WO/2023/065802A1 |
The present invention belongs to the field of polythiol compounds and uses thereof, relating in particular to a polythiol compound and a preparation method therefor, a curing agent, a resin composition, an adhesive, and a sealant. The po...
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WO/2023/065489A1 |
Provided are a high dielectric compound and a preparation method therefor, an epoxy high dielectric material and a preparation method therefor, and a semiconductor device. The high dielectric compound is represented by chemical formula (...
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WO/2023/065803A1 |
The present invention belongs to the field of adhesives and sealants, and relates to a photo/thermal dual-curing resin composition, and a preparation method therefor and the use thereof. The photo/thermal dual-curing resin composition co...
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WO/2023/068177A1 |
Provided is a photosensitive resin composition that contains: (A) a silicone resin containing an acid-crosslinkable group; (B) an epoxy compound represented by formula (B); and (C) a photoacid generator. (In the formula, R51-R55 each ind...
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WO/2023/068044A1 |
The present invention addresses the problem of providing a thermally conductive sheet that has a high thermal conductivity, a low elastic modulus in a low temperature range of -30°C or lower, and excellent adhesive strength. The main ob...
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WO/2023/068024A1 |
This thermosetting resin composition contains an epoxy resin, a curing agent, an acrylic copolymer having a functional group in a side chain thereof, boron nitride, and a filler. The average particle diameter (D50) of the boron nitride i...
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WO/2023/068109A1 |
The purpose of the present invention is to provide a curable resin composition which makes it possible to obtain a cured product having excellent conductivity and curing properties. The present invention is a curable resin composition ...
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WO/2023/062999A1 |
Provided is an epoxy resin composition comprising an epoxy resin (A) and an epoxy resin curing agent (B), wherein: the epoxy resin (A) contains 10-65 mass% of an epoxy resin (A1) that has a glycidyloxy group derived from resorcinol, and ...
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WO/2023/063264A1 |
A rotor-fixing resin composition according to the present invention is used for forming a fixing member in a rotor comprising a rotor core that is fixed to a rotary shaft and is provided with a plurality of holes arranged along the perip...
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WO/2023/063155A1 |
This laminate body is provided at least with an epoxy resin layer, which is obtained by curing an epoxy resin composition that contains an epoxy resin (A) and an isocyanate compound (B), and a separation film. The epoxy resin (A) contain...
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WO/2023/063266A1 |
A resin composition comprising a biphenyl aralkyl-type phenol resin (A), an epoxy resin (B), an active ester compound (C), and an inorganic filler (D), wherein the amount of the active ester compound (C) is not less than 10 mass% with re...
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WO/2023/063386A1 |
A purpose of the present invention is to provide an adhesive sheet having excellent insulation breakdown reliability and sheet life at room temperature while having high adhesiveness, high heat resistance, and high strength between a res...
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WO/2023/063000A1 |
Provided is an epoxy resin composition containing an epoxy resin (A), an epoxy resin curing agent (B) that includes a phenolic curing agent, and a curing acceleration agent (C), wherein: the epoxy resin (A) includes 10-85 mass% of an epo...
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WO/2023/064552A1 |
A prepreg epoxy-based carbon and/or glass and/or Kevlar fiber composite for application to a metal substrate, such as an oil and gas pipeline pipe and water pipe and pipeline repair is described, includes about 5-50% liquid or solid epox...
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WO/2023/058449A1 |
Provided are: a naphthalene dithiol capable of achieving both high refractive index and high solubility (compatibility) or a derivative thereof; and a production method and a use for the same. A naphthalene compound according to the pr...
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WO/2023/056758A1 |
Disclosed in the present application is a molding sealant for chip packaging, using an epoxy resin as shown in formula (I). The epoxy resin having flexible units such as polyether of formula (I) is combined with components such as a curi...
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WO/2023/058605A1 |
Provided are: a curable resin composition that, as the cured product, exhibits an excellent transparency to ultraviolet radiation, a high light resistance versus ultraviolet radiation, and heat resistance; and a cured product from this c...
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